CN1725933B - 布线电路形成用基板、布线电路基板以及金属薄层的形成方法 - Google Patents

布线电路形成用基板、布线电路基板以及金属薄层的形成方法 Download PDF

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Publication number
CN1725933B
CN1725933B CN2005100811017A CN200510081101A CN1725933B CN 1725933 B CN1725933 B CN 1725933B CN 2005100811017 A CN2005100811017 A CN 2005100811017A CN 200510081101 A CN200510081101 A CN 200510081101A CN 1725933 B CN1725933 B CN 1725933B
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CN
China
Prior art keywords
metal
layer
thin
insulating layer
substrate
Prior art date
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Expired - Fee Related
Application number
CN2005100811017A
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English (en)
Chinese (zh)
Other versions
CN1725933A (zh
Inventor
内藤俊樹
山崎博司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
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Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of CN1725933A publication Critical patent/CN1725933A/zh
Application granted granted Critical
Publication of CN1725933B publication Critical patent/CN1725933B/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Physical Vapour Deposition (AREA)
  • Structure Of Printed Boards (AREA)
CN2005100811017A 2004-06-17 2005-06-17 布线电路形成用基板、布线电路基板以及金属薄层的形成方法 Expired - Fee Related CN1725933B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004180245A JP3962039B2 (ja) 2004-06-17 2004-06-17 配線回路形成用基板、配線回路基板および金属薄層の形成方法
JP2004-180245 2004-06-17
JP2004180245 2004-06-17

Publications (2)

Publication Number Publication Date
CN1725933A CN1725933A (zh) 2006-01-25
CN1725933B true CN1725933B (zh) 2010-10-06

Family

ID=34936692

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2005100811017A Expired - Fee Related CN1725933B (zh) 2004-06-17 2005-06-17 布线电路形成用基板、布线电路基板以及金属薄层的形成方法

Country Status (6)

Country Link
US (1) US7417316B2 (https=)
EP (1) EP1608211A3 (https=)
JP (1) JP3962039B2 (https=)
KR (1) KR101120526B1 (https=)
CN (1) CN1725933B (https=)
TW (1) TWI350721B (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7804172B2 (en) * 2006-01-10 2010-09-28 Halliburton Energy Services, Inc. Electrical connections made with dissimilar metals
CN101489346B (zh) * 2008-01-15 2011-11-16 欣兴电子股份有限公司 线路板的图案化结构
TWI398933B (zh) * 2008-03-05 2013-06-11 榮創能源科技股份有限公司 積體電路元件之封裝結構及其製造方法
FR2943072B1 (fr) * 2009-03-12 2019-08-16 Centre National De La Recherche Scientifique Cnrs Decoration par pulverisation plasma magnetron sur des contenants en verre pour les secteurs de la cosmetique.
CN101840988A (zh) * 2010-04-22 2010-09-22 傲迪特半导体(南京)有限公司 汽车前大灯发热pcb基台及其制作方法
EP3030061B1 (en) * 2013-07-29 2021-01-06 Kyocera Corporation Wiring substrate, wiring substrate with lead, and electronic device
TWI488549B (zh) * 2014-03-07 2015-06-11 Azotek Co Ltd 金屬基板及其製作方法
JP2015133167A (ja) * 2015-04-22 2015-07-23 大日本印刷株式会社 サスペンション用基板、サスペンション、素子付サスペンション、およびハードディスクドライブ
US10180708B2 (en) 2016-05-24 2019-01-15 Microsoft Technology Licensing, Llc Curved circuit board
KR20180058626A (ko) * 2016-11-24 2018-06-01 주식회사 아모그린텍 평판 케이블 제조 방법
CN108055790B (zh) * 2017-12-06 2019-10-18 深圳市和美源电子有限公司 一种电路板及其制作方法和应用
KR102847046B1 (ko) * 2019-05-08 2025-08-18 삼성디스플레이 주식회사 표시 장치 및 표시 장치의 제조 방법

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1097234B (de) * 1958-06-26 1961-01-12 Bosch Gmbh Robert Verfahren zum UEberziehen von Gegenstaenden mit Silber durch Aufdampfen im Vakuum unter Verwendung einer hafterhoehenden Chromzwischenschicht
GB1115911A (en) * 1964-06-27 1968-06-06 Mial Internat S A Method for depositing thin metal coatings
US3881884A (en) * 1973-10-12 1975-05-06 Ibm Method for the formation of corrosion resistant electronic interconnections
US4917963A (en) * 1988-10-28 1990-04-17 Andus Corporation Graded composition primer layer
US5874174A (en) * 1995-08-09 1999-02-23 Matsushita Electric Industrial Co., Ltd. Conductor film and its forming method
US6328858B1 (en) * 1998-10-01 2001-12-11 Nexx Systems Packaging, Llc Multi-layer sputter deposition apparatus

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0382188A (ja) * 1989-08-25 1991-04-08 Kyocera Corp セラミック配線基板の製造方法
JPH04235272A (ja) 1991-01-11 1992-08-24 Kobe Steel Ltd 耐食性及び加工性に優れた蒸着Ａｌ−Ｍｎ系合金めっき材およびその製造方法
JP3422371B2 (ja) 1993-01-13 2003-06-30 石川島播磨重工業株式会社 連続真空蒸着方法
JPH1192579A (ja) 1997-09-19 1999-04-06 Nitto Denko Corp 有機基材のプラズマ処理方法及び有機基材への金属層形成方法
JPH11158613A (ja) 1997-12-01 1999-06-15 Canon Inc 電極基板、及び該電極基板の製造方法
JP4430165B2 (ja) 1999-09-02 2010-03-10 日東電工株式会社 真空薄膜形成装置および真空薄膜形成方法
JP2003318533A (ja) 2002-04-24 2003-11-07 Toyo Metallizing Co Ltd フレキシブルプリント配線用基板
TW587322B (en) * 2002-12-31 2004-05-11 Phoenix Prec Technology Corp Substrate with stacked via and fine circuit thereon, and method for fabricating the same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1097234B (de) * 1958-06-26 1961-01-12 Bosch Gmbh Robert Verfahren zum UEberziehen von Gegenstaenden mit Silber durch Aufdampfen im Vakuum unter Verwendung einer hafterhoehenden Chromzwischenschicht
GB1115911A (en) * 1964-06-27 1968-06-06 Mial Internat S A Method for depositing thin metal coatings
US3881884A (en) * 1973-10-12 1975-05-06 Ibm Method for the formation of corrosion resistant electronic interconnections
US4917963A (en) * 1988-10-28 1990-04-17 Andus Corporation Graded composition primer layer
US5874174A (en) * 1995-08-09 1999-02-23 Matsushita Electric Industrial Co., Ltd. Conductor film and its forming method
US6328858B1 (en) * 1998-10-01 2001-12-11 Nexx Systems Packaging, Llc Multi-layer sputter deposition apparatus

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP平3-82188A 1991.04.08

Also Published As

Publication number Publication date
EP1608211A2 (en) 2005-12-21
US7417316B2 (en) 2008-08-26
TW200601921A (en) 2006-01-01
CN1725933A (zh) 2006-01-25
JP3962039B2 (ja) 2007-08-22
EP1608211A3 (en) 2007-10-17
KR20060049235A (ko) 2006-05-18
KR101120526B1 (ko) 2012-02-24
TWI350721B (en) 2011-10-11
JP2006005176A (ja) 2006-01-05
US20050280153A1 (en) 2005-12-22

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SE01 Entry into force of request for substantive examination
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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20101006

Termination date: 20170617

CF01 Termination of patent right due to non-payment of annual fee