JP3962039B2 - 配線回路形成用基板、配線回路基板および金属薄層の形成方法 - Google Patents

配線回路形成用基板、配線回路基板および金属薄層の形成方法 Download PDF

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Publication number
JP3962039B2
JP3962039B2 JP2004180245A JP2004180245A JP3962039B2 JP 3962039 B2 JP3962039 B2 JP 3962039B2 JP 2004180245 A JP2004180245 A JP 2004180245A JP 2004180245 A JP2004180245 A JP 2004180245A JP 3962039 B2 JP3962039 B2 JP 3962039B2
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JP
Japan
Prior art keywords
layer
copper
chromium
sputtering
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004180245A
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English (en)
Japanese (ja)
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JP2006005176A5 (https=
JP2006005176A (ja
Inventor
俊樹 内藤
博司 山▲崎▼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP2004180245A priority Critical patent/JP3962039B2/ja
Priority to EP05010861A priority patent/EP1608211A3/en
Priority to US11/147,345 priority patent/US7417316B2/en
Priority to TW094119239A priority patent/TWI350721B/zh
Priority to KR1020050051930A priority patent/KR101120526B1/ko
Priority to CN2005100811017A priority patent/CN1725933B/zh
Publication of JP2006005176A publication Critical patent/JP2006005176A/ja
Publication of JP2006005176A5 publication Critical patent/JP2006005176A5/ja
Application granted granted Critical
Publication of JP3962039B2 publication Critical patent/JP3962039B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Physical Vapour Deposition (AREA)
  • Structure Of Printed Boards (AREA)
JP2004180245A 2004-06-17 2004-06-17 配線回路形成用基板、配線回路基板および金属薄層の形成方法 Expired - Fee Related JP3962039B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2004180245A JP3962039B2 (ja) 2004-06-17 2004-06-17 配線回路形成用基板、配線回路基板および金属薄層の形成方法
EP05010861A EP1608211A3 (en) 2004-06-17 2005-05-19 Wired circuit forming board, wired circuit board and thin metal layer forming method
US11/147,345 US7417316B2 (en) 2004-06-17 2005-06-08 Wired circuit forming board, wired circuit board, and thin metal layer forming method
TW094119239A TWI350721B (en) 2004-06-17 2005-06-10 Substrate for forming printed circuit, printed circuit board and method of forming metallic thin layer thereon
KR1020050051930A KR101120526B1 (ko) 2004-06-17 2005-06-16 배선 회로 형성용 기판, 배선 회로 기판 및 금속박층의형성 방법
CN2005100811017A CN1725933B (zh) 2004-06-17 2005-06-17 布线电路形成用基板、布线电路基板以及金属薄层的形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004180245A JP3962039B2 (ja) 2004-06-17 2004-06-17 配線回路形成用基板、配線回路基板および金属薄層の形成方法

Publications (3)

Publication Number Publication Date
JP2006005176A JP2006005176A (ja) 2006-01-05
JP2006005176A5 JP2006005176A5 (https=) 2006-06-15
JP3962039B2 true JP3962039B2 (ja) 2007-08-22

Family

ID=34936692

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004180245A Expired - Fee Related JP3962039B2 (ja) 2004-06-17 2004-06-17 配線回路形成用基板、配線回路基板および金属薄層の形成方法

Country Status (6)

Country Link
US (1) US7417316B2 (https=)
EP (1) EP1608211A3 (https=)
JP (1) JP3962039B2 (https=)
KR (1) KR101120526B1 (https=)
CN (1) CN1725933B (https=)
TW (1) TWI350721B (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7804172B2 (en) * 2006-01-10 2010-09-28 Halliburton Energy Services, Inc. Electrical connections made with dissimilar metals
CN101489346B (zh) * 2008-01-15 2011-11-16 欣兴电子股份有限公司 线路板的图案化结构
TWI398933B (zh) * 2008-03-05 2013-06-11 榮創能源科技股份有限公司 積體電路元件之封裝結構及其製造方法
FR2943072B1 (fr) * 2009-03-12 2019-08-16 Centre National De La Recherche Scientifique Cnrs Decoration par pulverisation plasma magnetron sur des contenants en verre pour les secteurs de la cosmetique.
CN101840988A (zh) * 2010-04-22 2010-09-22 傲迪特半导体(南京)有限公司 汽车前大灯发热pcb基台及其制作方法
EP3030061B1 (en) * 2013-07-29 2021-01-06 Kyocera Corporation Wiring substrate, wiring substrate with lead, and electronic device
TWI488549B (zh) * 2014-03-07 2015-06-11 Azotek Co Ltd 金屬基板及其製作方法
JP2015133167A (ja) * 2015-04-22 2015-07-23 大日本印刷株式会社 サスペンション用基板、サスペンション、素子付サスペンション、およびハードディスクドライブ
US10180708B2 (en) 2016-05-24 2019-01-15 Microsoft Technology Licensing, Llc Curved circuit board
KR20180058626A (ko) * 2016-11-24 2018-06-01 주식회사 아모그린텍 평판 케이블 제조 방법
CN108055790B (zh) * 2017-12-06 2019-10-18 深圳市和美源电子有限公司 一种电路板及其制作方法和应用
KR102847046B1 (ko) * 2019-05-08 2025-08-18 삼성디스플레이 주식회사 표시 장치 및 표시 장치의 제조 방법

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Publication number Priority date Publication date Assignee Title
DE1097234B (de) * 1958-06-26 1961-01-12 Bosch Gmbh Robert Verfahren zum UEberziehen von Gegenstaenden mit Silber durch Aufdampfen im Vakuum unter Verwendung einer hafterhoehenden Chromzwischenschicht
LU46411A1 (https=) * 1964-06-27 1972-01-01
US3881884A (en) * 1973-10-12 1975-05-06 Ibm Method for the formation of corrosion resistant electronic interconnections
US4917963A (en) * 1988-10-28 1990-04-17 Andus Corporation Graded composition primer layer
JPH0382188A (ja) * 1989-08-25 1991-04-08 Kyocera Corp セラミック配線基板の製造方法
JPH04235272A (ja) 1991-01-11 1992-08-24 Kobe Steel Ltd 耐食性及び加工性に優れた蒸着Ａｌ−Ｍｎ系合金めっき材およびその製造方法
JP3422371B2 (ja) 1993-01-13 2003-06-30 石川島播磨重工業株式会社 連続真空蒸着方法
US5874174A (en) * 1995-08-09 1999-02-23 Matsushita Electric Industrial Co., Ltd. Conductor film and its forming method
JPH1192579A (ja) 1997-09-19 1999-04-06 Nitto Denko Corp 有機基材のプラズマ処理方法及び有機基材への金属層形成方法
JPH11158613A (ja) 1997-12-01 1999-06-15 Canon Inc 電極基板、及び該電極基板の製造方法
US6328858B1 (en) * 1998-10-01 2001-12-11 Nexx Systems Packaging, Llc Multi-layer sputter deposition apparatus
JP4430165B2 (ja) 1999-09-02 2010-03-10 日東電工株式会社 真空薄膜形成装置および真空薄膜形成方法
JP2003318533A (ja) 2002-04-24 2003-11-07 Toyo Metallizing Co Ltd フレキシブルプリント配線用基板
TW587322B (en) * 2002-12-31 2004-05-11 Phoenix Prec Technology Corp Substrate with stacked via and fine circuit thereon, and method for fabricating the same

Also Published As

Publication number Publication date
EP1608211A2 (en) 2005-12-21
US7417316B2 (en) 2008-08-26
TW200601921A (en) 2006-01-01
CN1725933A (zh) 2006-01-25
CN1725933B (zh) 2010-10-06
EP1608211A3 (en) 2007-10-17
KR20060049235A (ko) 2006-05-18
KR101120526B1 (ko) 2012-02-24
TWI350721B (en) 2011-10-11
JP2006005176A (ja) 2006-01-05
US20050280153A1 (en) 2005-12-22

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