WO2009078448A1 - 銅導体膜及びその製造方法、導電性基板及びその製造方法、銅導体配線及びその製造方法、並びに処理液 - Google Patents

銅導体膜及びその製造方法、導電性基板及びその製造方法、銅導体配線及びその製造方法、並びに処理液 Download PDF

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Publication number
WO2009078448A1
WO2009078448A1 PCT/JP2008/073006 JP2008073006W WO2009078448A1 WO 2009078448 A1 WO2009078448 A1 WO 2009078448A1 JP 2008073006 W JP2008073006 W JP 2008073006W WO 2009078448 A1 WO2009078448 A1 WO 2009078448A1
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Prior art keywords
copper
manufacturing
copper conductor
wiring
conductor film
Prior art date
Application number
PCT/JP2008/073006
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English (en)
French (fr)
Inventor
Hideo Nakako
Kazunori Yamamoto
Yasushi Kumashiro
Youichi Machii
Shunya Yokozawa
Yoshinori Ejiri
Katsuyuki Masuda
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Hitachi Chemical Company, Ltd.
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Publication date
Application filed by Hitachi Chemical Company, Ltd. filed Critical Hitachi Chemical Company, Ltd.
Priority to JP2009546290A priority Critical patent/JP5163655B2/ja
Priority to CN2008801215234A priority patent/CN101903959B/zh
Priority to US12/808,768 priority patent/US8801971B2/en
Priority to KR1020107013643A priority patent/KR101247431B1/ko
Priority to EP08861192.6A priority patent/EP2234119A4/en
Publication of WO2009078448A1 publication Critical patent/WO2009078448A1/ja

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    • H—ELECTRICITY
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    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
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Abstract

　導電性及び配線パターン形成に優れ、配線幅及び配線間スペースが狭くなっても、回路間の絶縁低下のない銅導体膜及びその製造方法並びにパターニングされた銅導体配線を提供する。 　還元剤に対して触媒活性を有する金属と銅酸化物を共に含有してなる銅系粒子含有層を、一つの溶液中に銅酸化物をイオン化又は錯体化する薬剤と、銅イオン又は銅錯体を還元し金属銅にする還元剤を含む処理液を用いて処理してなる銅導体膜及びその製造方法並びに銅系粒子含有層が印刷によりパターニングされており、そのパターニングされた粒子含有層を一つの溶液中に銅酸化物をイオン化又は錯体化する薬剤と、銅イオン又は銅錯体を還元し金属銅にする還元剤を共に含む溶液を用いた処理方法により処理して得られるパターニングされた銅導体配線である。
PCT/JP2008/073006 2007-12-18 2008-12-17 銅導体膜及びその製造方法、導電性基板及びその製造方法、銅導体配線及びその製造方法、並びに処理液 WO2009078448A1 (ja)

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JP2009546290A JP5163655B2 (ja) 2007-12-18 2008-12-17 銅導体膜及びその製造方法、導電性基板及びその製造方法、銅導体配線及びその製造方法、並びに処理液
CN2008801215234A CN101903959B (zh) 2007-12-18 2008-12-17 铜导体膜及其制造方法、导电性基板及其制造方法、铜导体布线及其制造方法、以及处理液
US12/808,768 US8801971B2 (en) 2007-12-18 2008-12-17 Copper conductor film and manufacturing method thereof, conductive substrate and manufacturing method thereof, copper conductor wiring and manufacturing method thereof, and treatment solution
KR1020107013643A KR101247431B1 (ko) 2007-12-18 2008-12-17 구리 도체막 및 그 제조방법, 도전성 기판 및 그 제조방법, 구리 도체 배선 및 그 제조방법, 및 처리액
EP08861192.6A EP2234119A4 (en) 2007-12-18 2008-12-17 COPPER CONDUCTIVE FILM AND MANUFACTURING METHOD THEREFOR, CONDUCTIVE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME, COPPER CONDUCTIVE THREAD AND METHOD FOR MANUFACTURING THE SAME, AND PROCESSING SOLUTION THEREOF

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JP2007-325863 2007-12-18
JP2007325863 2007-12-18
JP2008-062966 2008-03-12
JP2008062966 2008-03-12
JP2008-062964 2008-03-12
JP2008062964 2008-03-12
JP2008097349 2008-04-03
JP2008-097349 2008-04-03

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JP5903887B2 (ja) * 2009-09-16 2016-04-13 日立化成株式会社 印刷法用インクの製造方法
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US20120125659A1 (en) 2012-05-24
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CN101903959A (zh) 2010-12-01
TWI399457B (zh) 2013-06-21
US8801971B2 (en) 2014-08-12
EP2234119A4 (en) 2015-04-15
KR20100084698A (ko) 2010-07-27
JP5163655B2 (ja) 2013-03-13
EP2234119A1 (en) 2010-09-29
CN101903959B (zh) 2013-01-23

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