BR0114155A - Banho e método de deposição sem eletricidade de prata em superfìcies metálicas - Google Patents
Banho e método de deposição sem eletricidade de prata em superfìcies metálicasInfo
- Publication number
- BR0114155A BR0114155A BR0114155-4A BR0114155A BR0114155A BR 0114155 A BR0114155 A BR 0114155A BR 0114155 A BR0114155 A BR 0114155A BR 0114155 A BR0114155 A BR 0114155A
- Authority
- BR
- Brazil
- Prior art keywords
- metal surfaces
- bath
- silver
- deposition method
- copper
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
Abstract
"BANHO E MéTODO DE DEPOSIçãO SEM ELETRICIDADE DE PRATA EM SUPERFìCIES METáLICAS". Métodos conhecidos para melhorar a soldabilidade das superfícies de cobre em placas de circuito impresso apresentam as desvantagens de que as camadas externas de uma espessura irregular são formadas nas superfícies metálicas, de que essas camadas são muito caras ou de que os constituintes usados para produzi-la são prejudiciais ao ambiente. Além disso, as superfícies metálicas devem ser adequadas para formar conexões de aglutinação bem como contatos elétricos. Para superar esses problemas são descritos um banho e um método de deposição de prata sem eletricidade por meio de uma reação de troca de carga em superfícies de metais que são menos nobres que a prata, mais particularmente de cobre, que contém pelo menos um complexo haleto de prata e não contendo qualquer agente de redução para íons Ag^ +^.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10050862A DE10050862C2 (de) | 2000-10-06 | 2000-10-06 | Bad und Verfahren zum stromlosen Abscheiden von Silber auf Metalloberflächen |
| PCT/EP2001/011020 WO2002029132A1 (en) | 2000-10-06 | 2001-09-21 | Bath and method of electroless plating of silver on metal surfaces |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BR0114155A true BR0114155A (pt) | 2003-07-29 |
Family
ID=7659722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BR0114155-4A BR0114155A (pt) | 2000-10-06 | 2001-09-21 | Banho e método de deposição sem eletricidade de prata em superfìcies metálicas |
Country Status (16)
| Country | Link |
|---|---|
| US (1) | US6869637B2 (pt) |
| EP (1) | EP1322798B1 (pt) |
| JP (1) | JP2004510885A (pt) |
| KR (1) | KR100809891B1 (pt) |
| CN (1) | CN1276994C (pt) |
| AT (1) | ATE275214T1 (pt) |
| AU (1) | AU2002212274A1 (pt) |
| BR (1) | BR0114155A (pt) |
| CA (1) | CA2417071A1 (pt) |
| DE (2) | DE10050862C2 (pt) |
| ES (1) | ES2227295T3 (pt) |
| HK (1) | HK1053152B (pt) |
| MX (1) | MXPA03000899A (pt) |
| MY (1) | MY137750A (pt) |
| TW (1) | TWI242607B (pt) |
| WO (1) | WO2002029132A1 (pt) |
Families Citing this family (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10226328B3 (de) * | 2002-06-11 | 2004-02-19 | Atotech Deutschland Gmbh | Saure Lösung zur Silberabscheidung und Verfahren zum Abscheiden von Silberschichten auf Metalloberflächen |
| EP1245697A3 (de) * | 2002-07-17 | 2003-02-19 | ATOTECH Deutschland GmbH | Verfahren zum aussenstromlosen Abscheiden von Silber |
| FI20030816A (fi) * | 2003-05-30 | 2004-12-01 | Metso Corp | Menetelmä metallijohtimien valmistamiseksi substraatille |
| AT500807B1 (de) * | 2004-01-23 | 2006-11-15 | Austria Tech & System Tech | Verfahren zum herstellen eines leiterplattenelements sowie leiterplattenelement |
| US8349393B2 (en) * | 2004-07-29 | 2013-01-08 | Enthone Inc. | Silver plating in electronics manufacture |
| JP4660701B2 (ja) * | 2004-12-03 | 2011-03-30 | Ｄｏｗａエレクトロニクス株式会社 | 銀被覆銅粉およびその製造方法並びに導電ペースト |
| KR100782810B1 (ko) * | 2005-01-07 | 2007-12-06 | 삼성전자주식회사 | 확장 검색 기능을 제공하기 위한 메타데이터가 기록된 저장매체를 재생하는 방법 및 장치 |
| DE102005038392B4 (de) * | 2005-08-09 | 2008-07-10 | Atotech Deutschland Gmbh | Verfahren zum Herstellen von Muster bildenden Kupferstrukturen auf einem Trägersubstrat |
| US7767009B2 (en) * | 2005-09-14 | 2010-08-03 | OMG Electronic Chemicals, Inc. | Solution and process for improving the solderability of a metal surface |
| JP5036216B2 (ja) * | 2006-05-19 | 2012-09-26 | 四国化成工業株式会社 | 金属の表面処理剤およびその利用 |
| KR100794804B1 (ko) * | 2006-08-01 | 2008-01-14 | 주식회사 에이스테크놀로지 | 은도금 처리방법 |
| US7883738B2 (en) * | 2007-04-18 | 2011-02-08 | Enthone Inc. | Metallic surface enhancement |
| US10017863B2 (en) * | 2007-06-21 | 2018-07-10 | Joseph A. Abys | Corrosion protection of bronzes |
| DE102007040065A1 (de) * | 2007-08-24 | 2009-02-26 | Ormecon Gmbh | Artikel mit einer nanoskopischen Beschichtung aus Edel-/Halbedelmetall sowie Verfahren zu deren Herstellung |
| TWI453301B (zh) * | 2007-11-08 | 2014-09-21 | Enthone | 浸鍍銀塗層上的自組分子 |
| US7972655B2 (en) * | 2007-11-21 | 2011-07-05 | Enthone Inc. | Anti-tarnish coatings |
| US8869165B2 (en) * | 2008-03-20 | 2014-10-21 | International Business Machines Corporation | Integrating flow orchestration and scheduling of jobs and data activities for a batch of workflows over multiple domains subject to constraints |
| AT11005U1 (de) * | 2008-09-24 | 2010-02-15 | Austria Tech & System Tech | Verfahren zum verbessern der korrosionsbeständigkeit einer elektronischen komponente, insbesondere von leiterbahnen einer leiterplatte |
| US8878165B2 (en) | 2010-02-25 | 2014-11-04 | Merck Patent Gmbh | Electrode treatment process for organic electronic devices |
| RU2013102912A (ru) * | 2010-06-24 | 2014-07-27 | Мерк Патент Гмбх | Способ модифицирования электродов в органическом элекронном устрйстве |
| US9663667B2 (en) | 2013-01-22 | 2017-05-30 | Andre Reiss | Electroless silvering ink |
| KR101536446B1 (ko) * | 2013-12-06 | 2015-07-13 | 주식회사 포스코 | Ｏｌｅｄ 조명용 기판 및 그 제조방법 |
| KR101478486B1 (ko) | 2014-05-12 | 2014-12-31 | 성균관대학교산학협력단 | 자발적 치환 반응을 이용한 은 코팅 구리 분말 제조 방법 |
| CN104619133B (zh) * | 2015-01-20 | 2017-12-29 | 江门崇达电路技术有限公司 | 一种全面化银线路板的制作方法 |
| JP6666723B2 (ja) * | 2015-03-31 | 2020-03-18 | Ｄｏｗａエレクトロニクス株式会社 | 銀被覆テルル粉及びその製造方法、並びに導電性ペースト |
| US20160351522A1 (en) * | 2015-05-27 | 2016-12-01 | Freescale Semiconductor, Inc. | Package-on-package device and cavity formation by solder removal for package interconnection |
| DE102016110377A1 (de) | 2016-06-06 | 2017-12-07 | Harting Ag & Co. Kg | Verfahren zur Herstellung von elektrischen Kontakten mit einer Silber-Wolfram-Legierung und ein Elektrolyt zum stromlosen/elektrolytischen Abscheiden von einer Silber-Wolfram-Legierung |
| US20190029122A1 (en) * | 2017-07-19 | 2019-01-24 | Anaren, Inc. | Encapsulation of circuit trace |
| CN109423635A (zh) * | 2017-08-22 | 2019-03-05 | 深圳市虹喜科技发展有限公司 | 一种印制线路板表面处理用化学镀银溶液 |
| CN110927231B (zh) * | 2019-12-31 | 2022-08-19 | 嘉兴学院 | 一种离子色谱安培检测用银电极的处理方法 |
| CN114959666A (zh) * | 2022-05-12 | 2022-08-30 | 李正新 | 化学镀银液以及化学镀银新方法 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2602757A (en) * | 1948-04-09 | 1952-07-08 | Morris S Kantrowitz | Method and composition for producing silver coatings |
| GB1022061A (en) * | 1962-01-19 | 1966-03-09 | Mitsubishi Electric Corp | Solutions for immersion plating gold and silver |
| US3294578A (en) * | 1963-10-22 | 1966-12-27 | Gen Aniline & Film Corp | Deposition of a metallic coat on metal surfaces |
| SU501116A1 (ru) | 1973-05-18 | 1976-01-30 | Предприятие П/Я А-7284 | Раствор дл иммерсионного серебрени меди |
| DE3148330A1 (de) * | 1981-12-07 | 1983-06-09 | Max Planck Gesellschaft zur Förderung der Wissenschaften e.V., 3400 Göttingen | Verfahren zur stromlosen abscheidung von edelmetallschichten auf oberflaechen von unedlen metallen |
| GB8703664D0 (en) | 1987-02-17 | 1987-03-25 | Green A | Electroless silver plating composition |
| EP0289412B1 (en) * | 1987-04-22 | 1992-01-29 | Sumitomo Electric Industries Limited | Process for producing a superconducting article |
| JPH05287542A (ja) | 1992-04-08 | 1993-11-02 | Mitsubishi Paper Mills Ltd | 無電解銀メッキ方法 |
| JPH06240463A (ja) * | 1993-02-22 | 1994-08-30 | Mitsubishi Paper Mills Ltd | 金属微粉末の無電解銀鍍金方法 |
| GB9425030D0 (en) | 1994-12-09 | 1995-02-08 | Alpha Metals Ltd | Silver plating |
| GB9425031D0 (en) | 1994-12-09 | 1995-02-08 | Alpha Metals Ltd | Printed circuit board manufacture |
| US5733599A (en) | 1996-03-22 | 1998-03-31 | Macdermid, Incorporated | Method for enhancing the solderability of a surface |
| JP3419995B2 (ja) | 1996-05-10 | 2003-06-23 | 株式会社大和化成研究所 | 無電解錫−銀合金めっき浴 |
| JP3915850B2 (ja) * | 1996-09-06 | 2007-05-16 | ソニー株式会社 | 光学装置及び電解液 |
| JP3532046B2 (ja) * | 1996-10-25 | 2004-05-31 | 株式会社大和化成研究所 | 非シアン置換銀めっき浴 |
| US5871896A (en) * | 1997-05-30 | 1999-02-16 | Eastman Kodak Company | Preparation and use of a dimethylamine silver bromide complex as a single source precursor for nucleation of silver bromide crystals |
-
2000
- 2000-10-06 DE DE10050862A patent/DE10050862C2/de not_active Expired - Fee Related
-
2001
- 2001-09-21 AU AU2002212274A patent/AU2002212274A1/en not_active Abandoned
- 2001-09-21 WO PCT/EP2001/011020 patent/WO2002029132A1/en active IP Right Grant
- 2001-09-21 MX MXPA03000899A patent/MXPA03000899A/es active IP Right Grant
- 2001-09-21 KR KR1020037002859A patent/KR100809891B1/ko not_active IP Right Cessation
- 2001-09-21 JP JP2002532695A patent/JP2004510885A/ja active Pending
- 2001-09-21 CN CNB018169430A patent/CN1276994C/zh not_active Expired - Fee Related
- 2001-09-21 DE DE60105305T patent/DE60105305T2/de not_active Expired - Lifetime
- 2001-09-21 AT AT01980428T patent/ATE275214T1/de active
- 2001-09-21 BR BR0114155-4A patent/BR0114155A/pt not_active IP Right Cessation
- 2001-09-21 ES ES01980428T patent/ES2227295T3/es not_active Expired - Lifetime
- 2001-09-21 US US10/362,087 patent/US6869637B2/en not_active Expired - Fee Related
- 2001-09-21 CA CA002417071A patent/CA2417071A1/en not_active Abandoned
- 2001-09-21 EP EP01980428A patent/EP1322798B1/en not_active Expired - Lifetime
- 2001-09-25 TW TW090123594A patent/TWI242607B/zh not_active IP Right Cessation
- 2001-10-03 MY MYPI20014614A patent/MY137750A/en unknown
-
2003
- 2003-07-25 HK HK03105382.2A patent/HK1053152B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| MY137750A (en) | 2009-03-31 |
| CN1468324A (zh) | 2004-01-14 |
| CA2417071A1 (en) | 2002-04-11 |
| ATE275214T1 (de) | 2004-09-15 |
| CN1276994C (zh) | 2006-09-27 |
| DE60105305D1 (de) | 2004-10-07 |
| EP1322798B1 (en) | 2004-09-01 |
| HK1053152A1 (en) | 2003-10-10 |
| HK1053152B (zh) | 2005-01-28 |
| TWI242607B (en) | 2005-11-01 |
| DE10050862C2 (de) | 2002-08-01 |
| DE10050862A1 (de) | 2002-04-25 |
| EP1322798A1 (en) | 2003-07-02 |
| US20030157264A1 (en) | 2003-08-21 |
| KR20030057530A (ko) | 2003-07-04 |
| MXPA03000899A (es) | 2003-06-24 |
| AU2002212274A1 (en) | 2002-04-15 |
| JP2004510885A (ja) | 2004-04-08 |
| KR100809891B1 (ko) | 2008-03-06 |
| ES2227295T3 (es) | 2005-04-01 |
| US6869637B2 (en) | 2005-03-22 |
| DE60105305T2 (de) | 2005-09-29 |
| WO2002029132A1 (en) | 2002-04-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| B08F | Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette] |
Free format text: REFERENTE A 7A ANUIDADE. |
|
| B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |
Free format text: REFERENTE AO DESPACHO 8.6 DA RPI 2021 DE 29/09/2009. |