JP2005537944A5 - - Google Patents

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Publication number
JP2005537944A5
JP2005537944A5 JP2004535413A JP2004535413A JP2005537944A5 JP 2005537944 A5 JP2005537944 A5 JP 2005537944A5 JP 2004535413 A JP2004535413 A JP 2004535413A JP 2004535413 A JP2004535413 A JP 2004535413A JP 2005537944 A5 JP2005537944 A5 JP 2005537944A5
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JP
Japan
Prior art keywords
cutting
tool assembly
cutting tool
diamond tip
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004535413A
Other languages
English (en)
Japanese (ja)
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JP5230896B2 (ja
JP2005537944A (ja
Filing date
Publication date
Priority claimed from US10/241,247 external-priority patent/US20040045419A1/en
Application filed filed Critical
Publication of JP2005537944A publication Critical patent/JP2005537944A/ja
Publication of JP2005537944A5 publication Critical patent/JP2005537944A5/ja
Application granted granted Critical
Publication of JP5230896B2 publication Critical patent/JP5230896B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2004535413A 2002-09-10 2003-07-02 微細複製工具を作製するためのマルチダイヤモンド切削工具組立体 Expired - Fee Related JP5230896B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/241,247 US20040045419A1 (en) 2002-09-10 2002-09-10 Multi-diamond cutting tool assembly for creating microreplication tools
US10/241,247 2002-09-10
PCT/US2003/020785 WO2004024421A1 (en) 2002-09-10 2003-07-02 Multi-diamond cutting tool assembly for creating microreplication tools

Publications (3)

Publication Number Publication Date
JP2005537944A JP2005537944A (ja) 2005-12-15
JP2005537944A5 true JP2005537944A5 (enExample) 2006-08-24
JP5230896B2 JP5230896B2 (ja) 2013-07-10

Family

ID=31991148

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004535413A Expired - Fee Related JP5230896B2 (ja) 2002-09-10 2003-07-02 微細複製工具を作製するためのマルチダイヤモンド切削工具組立体

Country Status (9)

Country Link
US (2) US20040045419A1 (enExample)
EP (1) EP1539463A1 (enExample)
JP (1) JP5230896B2 (enExample)
KR (1) KR101046810B1 (enExample)
CN (1) CN100349725C (enExample)
AU (1) AU2003256357A1 (enExample)
BR (1) BR0313927A (enExample)
CA (1) CA2495614A1 (enExample)
WO (1) WO2004024421A1 (enExample)

Families Citing this family (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7516536B2 (en) * 1999-07-08 2009-04-14 Toho Engineering Kabushiki Kaisha Method of producing polishing pad
JP4899375B2 (ja) * 2005-08-08 2012-03-21 コニカミノルタオプト株式会社 切削工具、加工装置、及び切削加工方法
US7757591B2 (en) * 2005-10-19 2010-07-20 3M Innovative Properties Company Aligned multi-diamond cutting tool assembly for creating microreplication tools
US7445409B2 (en) * 2005-10-19 2008-11-04 3M Innovative Properties Company Cutting tool assembly including diamond cutting tips at half-pitch spacing for land feature creation
US7293487B2 (en) 2005-11-15 2007-11-13 3M Innovative Properties Company Cutting tool having variable and independent movement in an x-direction and a z-direction into and laterally along a work piece for making microstructures
US7290471B2 (en) * 2005-11-15 2007-11-06 3M Innovative Properties Company Cutting tool having variable rotation about a y-direction transversely across a work piece for making microstructures
US7350442B2 (en) * 2005-11-15 2008-04-01 3M Innovative Properties Company Cutting tool having variable movement in a z-direction laterally along a work piece for making microstructures
US7350441B2 (en) * 2005-11-15 2008-04-01 3M Innovative Properties Company Cutting tool having variable movement at two simultaneously independent speeds in an x-direction into a work piece for making microstructures
US7575152B2 (en) * 2005-11-15 2009-08-18 E2Interactive, Inc. Temporary value card method and system
US7328638B2 (en) * 2005-12-27 2008-02-12 3M Innovative Properties Company Cutting tool using interrupted cut fast tool servo
JP4739108B2 (ja) 2006-04-27 2011-08-03 東芝機械株式会社 精密ロール旋盤
US7677146B2 (en) * 2006-05-10 2010-03-16 3M Innovative Properties Company Cutting tool using one or more machined tool tips in a continuous or interrupted cut fast tool servo
JP4837448B2 (ja) * 2006-06-14 2011-12-14 東芝機械株式会社 精密ロール旋盤
KR100983950B1 (ko) * 2006-06-14 2010-09-27 도시바 기카이 가부시키가이샤 정밀 롤 선반
JP4786432B2 (ja) * 2006-06-15 2011-10-05 東芝機械株式会社 精密ロール旋盤
EP1916060B1 (de) * 2006-10-26 2009-05-06 Satisloh AG Maschine zur Bearbeitung von optischen Werkstücken, insbesondere von Kunststoff-Brillengläsern
BRPI0718766A2 (pt) 2006-11-15 2014-01-21 3M Innovative Properties Co Impressão flexográfica com cura durante a transferência para o substrato
JP5254986B2 (ja) * 2006-11-15 2013-08-07 スリーエム イノベイティブ プロパティズ カンパニー フレキソ印刷のための溶剤除去アシスト材料転写
US7628100B2 (en) * 2007-01-05 2009-12-08 3M Innovative Properties Company Cutting tool using one or more machined tool tips with diffractive features in a continuous or interrupted cut fast tool servo
TW200920521A (en) * 2007-04-05 2009-05-16 Toshiba Machine Co Ltd Method and apparatus for machining surface of roll
US9180524B2 (en) * 2007-08-06 2015-11-10 3M Innovative Properties Company Fly-cutting head, system and method, and tooling and sheeting produced therewith
US20090041553A1 (en) * 2007-08-06 2009-02-12 3M Innovative Properties Company Fly-cutting system and method, and related tooling and articles
US7669508B2 (en) * 2007-10-29 2010-03-02 3M Innovative Properties Company Cutting tool using one or more machined tool tips with diffractive features
US20090147361A1 (en) * 2007-12-07 2009-06-11 3M Innovative Properties Company Microreplicated films having diffractive features on macro-scale features
KR101609400B1 (ko) * 2008-04-02 2016-04-05 쓰리엠 이노베이티브 프로퍼티즈 컴파니 광 지향 필름 또는 광 지향 물품
KR20100134077A (ko) * 2008-04-02 2010-12-22 쓰리엠 이노베이티브 프로퍼티즈 컴파니 중첩된 특징부를 갖는 광학 필름을 제조하기 위한 방법 및 시스템
US8012329B2 (en) * 2008-05-09 2011-09-06 3M Innovative Properties Company Dimensional control in electroforms
JP5355950B2 (ja) 2008-07-17 2013-11-27 東芝機械株式会社 Ｖ溝加工方法および装置
DE102008058452A1 (de) 2008-08-05 2010-02-11 Gühring Ohg Verfahren und Werkzeug zur Erzeugung einer Oberfläche vorbestimmter Rauheit
US20100271910A1 (en) * 2009-04-24 2010-10-28 Zine-Eddine Boutaghou Method and apparatus for near field photopatterning and improved optical coupling efficiency
SG175840A1 (en) * 2009-05-04 2011-12-29 3M Innovative Properties Co Methods for making microreplication tools
EP2519594A2 (en) 2009-12-31 2012-11-07 3M Innovative Properties Company Anti-reflective films with cross-linked silicone surfaces, methods of making and light absorbing devices using same
SG184986A1 (en) 2010-04-28 2012-11-29 3M Innovative Properties Co Silicone-based material
SG185084A1 (en) 2010-04-28 2012-12-28 3M Innovative Properties Co Articles including nanosilica-based primers for polymer coatings and methods
JP6247533B2 (ja) 2010-10-06 2017-12-13 スリーエム イノベイティブ プロパティズ カンパニー ナノシリカ系コーティング及びバリア層を有する反射防止物品
US8677984B2 (en) * 2010-10-15 2014-03-25 Adam Boyd Method and apparatus for tile cutting
US20130250425A1 (en) 2010-12-08 2013-09-26 3 M Innovative Properties Company Glass-like polymeric antireflective films, methods of making and light absorbing devices using same
US20130258483A1 (en) 2010-12-20 2013-10-03 3M Innovative Properties Company Glass-like polymeric antireflective films coated with silica nanoparticles, methods of making and light absorbing devices using same
US8867001B2 (en) 2011-06-13 2014-10-21 Benq Materials Corp. Patterned retardation film comprising relief-like stripe structures and sub micron grooves
TWI426965B (zh) * 2011-06-13 2014-02-21 Benq Materials Corp 用於製造相位差薄膜之滾輪的製造方法
TWI453107B (zh) * 2011-07-11 2014-09-21 Benq Materials Corp 用於製造相位差薄膜之滾輪的製造方法
TWI458623B (zh) * 2011-07-26 2014-11-01 Benq Materials Corp 用於製造相位差薄膜之滾輪的製造方法
CN102500773A (zh) * 2011-10-28 2012-06-20 苏州金牛精密机械有限公司 飞刀架
JP5871701B2 (ja) * 2012-04-10 2016-03-01 株式会社神戸製鋼所 切削工具の製造方法
JP5905320B2 (ja) * 2012-04-16 2016-04-20 東芝機械株式会社 フライカットによるフィルム状ワークへの溝加工方法及び鏡面加工方法
US20140076115A1 (en) * 2012-09-17 2014-03-20 Homerun Holdings Corporation Method and apparatus for cutting one or more grooves in a cylindrical element
US9050669B2 (en) 2012-10-04 2015-06-09 Illinois Tool Works Inc. Rapidly retractable tool support for a pipe machining apparatus
CN102941443A (zh) * 2012-11-05 2013-02-27 宁波镇明转轴有限公司 一种传动螺杆的制造方法
US9623484B2 (en) * 2013-01-14 2017-04-18 Illinois Tool Works Inc. Pipe machining apparatuses and methods of operating the same
CN103302321B (zh) * 2013-05-29 2016-09-28 广州导新模具注塑有限公司 圆形菲涅尔花纹加工刀具组合装置、设备及加工工艺
CN105792969B (zh) 2013-10-03 2018-06-29 伊利诺斯工具制品有限公司 用于管道加工设备的可枢转的工具支撑件
DE102014117398B3 (de) * 2014-11-27 2016-05-25 Thielenhaus Technologies Gmbh Verfahren zur Erzeugung von Riefen auf einer Nockenwelle
US10065246B2 (en) 2015-04-13 2018-09-04 Illinois Tool Works Inc. Laser line generator tool for a pipe machining apparatus
US10099292B2 (en) 2015-08-12 2018-10-16 Illinois Tool Works Inc. Crash resistant trip for a pipe machining apparatus
JP7106774B2 (ja) * 2017-06-21 2022-07-26 デクセリアルズ株式会社 微細加工装置、微細加工ユニット、制御装置、原盤の製造方法、及び原盤用基材の微細加工方法
JP7023624B2 (ja) * 2017-06-21 2022-02-22 デクセリアルズ株式会社 微細加工装置、制御装置、原盤の製造方法、及び原盤用基材の微細加工方法
CN110434403A (zh) * 2019-07-03 2019-11-12 福建夜光达科技股份有限公司 高效精密切削微细结构的多刀机构与使用方法及使用方法
CN117255958A (zh) 2021-05-10 2023-12-19 3M创新有限公司 包括光控膜和菲涅耳透镜的光学系统
JP7132456B1 (ja) 2022-02-08 2022-09-06 デクセリアルズ株式会社 微細加工装置、微細加工ユニット、制御装置、原盤の製造方法、及び原盤用基材の微細加工方法

Family Cites Families (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1348115A (en) * 1918-08-31 1920-07-27 Leon G Buckwalter Reversible-taper roughing-reamer
FR967169A (fr) 1948-05-18 1950-10-27 Aiguille ou style pour phonographe d'une seule pièce, mais en deux parties de flexibilité et de rigidité différentes
DE885163C (de) 1951-06-16 1953-08-03 Blaupunkt Elektronik G M B H Universal-Doppelnadeln fuer normale und Microrillen-Schallplatten
US2738730A (en) * 1952-07-01 1956-03-20 Fairchild Camera Instr Co Method for forming engraved image-reproducing plates
BE551477A (enExample) 1955-12-30
CH359899A (fr) 1959-07-24 1962-01-31 Colomb Andre Procédé de fabrication d'une aiguille en saphir pour machine parlante et aiguille obtenue par la mise en oeuvre de ce procédé
NL280085A (enExample) * 1961-06-24
GB906757A (en) * 1961-07-19 1962-09-26 Harold Chandler Multi-diamond tools for use in dressing grinding wheels and the like
US3680213A (en) * 1969-02-03 1972-08-01 Karl O Reichert Method of grooving semiconductor wafer for the dividing thereof
US3780409A (en) * 1971-02-19 1973-12-25 Fansteel Inc Threading tool
US3813970A (en) * 1972-01-10 1974-06-04 Ammco Tools Inc Tool holder
US3893356A (en) * 1974-03-19 1975-07-08 Frank Atzberger Rotor cutter
US4035690A (en) * 1974-10-25 1977-07-12 Raytheon Company Plasma panel display device including spheroidal glass shells
US4035590A (en) * 1975-06-30 1977-07-12 Rca Corporation Apparatus for electromechanical recording of short wavelength modulation in a metal master
US4044379A (en) * 1975-06-30 1977-08-23 Rca Corporation Method and apparatus for electromechanical recording of short wavelength modulation in a metal master
US4113267A (en) * 1977-04-25 1978-09-12 Pickering & Company, Inc. Double stylus assembly for phonograph record stamper playback
US4113266A (en) * 1977-04-25 1978-09-12 Pickering & Company, Inc. Playback stylus for phonograph record stamper
US4111083A (en) * 1977-08-08 1978-09-05 Carter Walter L Tool holder
US4287689A (en) * 1979-10-30 1981-09-08 Rca Corporation Method for improving the quality of low frequency output of a video disc pickup stylus
JPS5788501A (en) * 1980-11-25 1982-06-02 Hitachi Ltd Manufacture for video disc reproducing stylus
US4355382A (en) * 1980-12-24 1982-10-19 Rca Corporation Apparatus for sharpening a cutting stylus
JPS58177543A (ja) * 1982-04-09 1983-10-18 Hitachi Ltd ビデオディスク用再生針およびその製造方法
US4525751A (en) * 1982-08-27 1985-06-25 Rca Corporation Disc record with tapered groove
US4625751A (en) * 1985-03-06 1986-12-02 Deere & Company Vehicle steering and auxiliary function hydraulic circuit
JPS62102901A (ja) * 1985-10-28 1987-05-13 Toshiba Corp 光学部品製作方法
JPS63154120A (ja) * 1986-12-18 1988-06-27 松下電器産業株式会社 自動製パン機
DE3718262A1 (de) * 1987-05-30 1988-12-08 Werner Hermann Wera Werke Schlagmesser-fraesmaschine
WO1989004052A1 (en) 1987-10-22 1989-05-05 Oxford Instruments Limited Exposing substrates to ion beams
JPH04256501A (ja) * 1991-02-01 1992-09-11 Kobe Steel Ltd 微小切り込み用切削装置
US6069080A (en) * 1992-08-19 2000-05-30 Rodel Holdings, Inc. Fixed abrasive polishing system for the manufacture of semiconductor devices, memory disks and the like
US5216843A (en) * 1992-09-24 1993-06-08 Intel Corporation Polishing pad conditioning apparatus for wafer planarization process
US5663802A (en) * 1993-02-25 1997-09-02 Ohio Electronic Engravers, Inc. Method and apparatus for engraving using multiple engraving heads
JPH07124813A (ja) * 1993-10-28 1995-05-16 Olympus Optical Co Ltd フレネル形状の形成方法
US5555473A (en) * 1995-02-21 1996-09-10 Ohio Electronic Engravers, Inc. Engraving system and method for helical or circumferential engraving
US5958799A (en) 1995-04-13 1999-09-28 North Carolina State University Method for water vapor enhanced charged-particle-beam machining
US5665656A (en) * 1995-05-17 1997-09-09 National Semiconductor Corporation Method and apparatus for polishing a semiconductor substrate wafer
US5814355A (en) * 1996-04-30 1998-09-29 Minnesota Mining And Manufacturing Company Mold for producing glittering cube-corner retroreflective sheeting
NL1004016C2 (nl) 1996-09-12 1998-03-13 Oce Tech Bv Inktstraal-drukkop.
DE69734845T2 (de) * 1996-09-24 2006-09-14 Xomed Surgical Products, Inc., North Jacksonville Zusammenbau von chirurgischen Klingen
US6216843B1 (en) * 1997-06-05 2001-04-17 Nippon Conlux Co., Ltd. Apparatus for taking out information using magnetic sensor and carrying out test of article by using that information
US6253442B1 (en) * 1997-07-02 2001-07-03 3M Innovative Properties Company Retroreflective cube corner sheeting mold and method for making the same
US6077462A (en) * 1998-02-20 2000-06-20 3M Innovative Properties Company Method and apparatus for seamless microreplication using an expandable mold
JPH11267902A (ja) * 1998-03-23 1999-10-05 Hiroshi Hashimoto 超微細切刃付き工具及び超微細切刃付き加工具
US6433890B1 (en) * 1998-09-24 2002-08-13 Mdc Max Daetwyler Ag System and method for improving printing of a leading edge of an image in a gravure printing process
JP4221117B2 (ja) * 1999-05-28 2009-02-12 大日本印刷株式会社 賦型シート用成形型の製造装置
JP3652182B2 (ja) * 1999-09-24 2005-05-25 キヤノン株式会社 回折格子の加工方法及び加工装置
IL138710A0 (en) 1999-10-15 2001-10-31 Newman Martin H Atomically sharp edge cutting blades and method for making same
US6325675B1 (en) * 2000-01-14 2001-12-04 Ilsco Corporation Electrical-connector insulating cover having a hinged access cover
US6461224B1 (en) * 2000-03-31 2002-10-08 Lam Research Corporation Off-diameter method for preparing semiconductor wafers
US6325575B1 (en) 2000-05-08 2001-12-04 Daimlerchrysler Corporation Tool for machining multiple surfaces on a stationary workpiece
JP2001322012A (ja) * 2000-05-18 2001-11-20 Canon Inc 切削工具の取り付けホルダー及び切削工具の位置調整装置
US6500054B1 (en) * 2000-06-08 2002-12-31 International Business Machines Corporation Chemical-mechanical polishing pad conditioner
US6551176B1 (en) * 2000-10-05 2003-04-22 Applied Materials, Inc. Pad conditioning disk
US20020159846A1 (en) * 2001-04-26 2002-10-31 Nobukazu Horiike Indexable insert
JP3497492B2 (ja) * 2001-11-02 2004-02-16 東邦エンジニアリング株式会社 半導体デバイス加工用硬質発泡樹脂溝付パッド及びそのパッド旋削溝加工用工具
US6620029B2 (en) * 2002-01-30 2003-09-16 International Business Machines Corporation Apparatus and method for front side chemical mechanical planarization (CMP) of semiconductor workpieces

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