JP2005537944A5 - - Google Patents

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Publication number
JP2005537944A5
JP2005537944A5 JP2004535413A JP2004535413A JP2005537944A5 JP 2005537944 A5 JP2005537944 A5 JP 2005537944A5 JP 2004535413 A JP2004535413 A JP 2004535413A JP 2004535413 A JP2004535413 A JP 2004535413A JP 2005537944 A5 JP2005537944 A5 JP 2005537944A5
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JP
Japan
Prior art keywords
cutting
tool assembly
cutting tool
diamond tip
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004535413A
Other languages
English (en)
Japanese (ja)
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JP2005537944A (ja
JP5230896B2 (ja
Filing date
Publication date
Priority claimed from US10/241,247 external-priority patent/US20040045419A1/en
Application filed filed Critical
Publication of JP2005537944A publication Critical patent/JP2005537944A/ja
Publication of JP2005537944A5 publication Critical patent/JP2005537944A5/ja
Application granted granted Critical
Publication of JP5230896B2 publication Critical patent/JP5230896B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2004535413A 2002-09-10 2003-07-02 微細複製工具を作製するためのマルチダイヤモンド切削工具組立体 Expired - Fee Related JP5230896B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/241,247 2002-09-10
US10/241,247 US20040045419A1 (en) 2002-09-10 2002-09-10 Multi-diamond cutting tool assembly for creating microreplication tools
PCT/US2003/020785 WO2004024421A1 (en) 2002-09-10 2003-07-02 Multi-diamond cutting tool assembly for creating microreplication tools

Publications (3)

Publication Number Publication Date
JP2005537944A JP2005537944A (ja) 2005-12-15
JP2005537944A5 true JP2005537944A5 (enExample) 2006-08-24
JP5230896B2 JP5230896B2 (ja) 2013-07-10

Family

ID=31991148

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004535413A Expired - Fee Related JP5230896B2 (ja) 2002-09-10 2003-07-02 微細複製工具を作製するためのマルチダイヤモンド切削工具組立体

Country Status (9)

Country Link
US (2) US20040045419A1 (enExample)
EP (1) EP1539463A1 (enExample)
JP (1) JP5230896B2 (enExample)
KR (1) KR101046810B1 (enExample)
CN (1) CN100349725C (enExample)
AU (1) AU2003256357A1 (enExample)
BR (1) BR0313927A (enExample)
CA (1) CA2495614A1 (enExample)
WO (1) WO2004024421A1 (enExample)

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US9896557B2 (en) 2010-04-28 2018-02-20 3M Innovative Properties Company Silicone-based material
KR102115940B1 (ko) 2010-10-06 2020-05-27 쓰리엠 이노베이티브 프로퍼티즈 컴파니 나노실리카계 코팅 및 배리어층을 갖는 반사방지 물품
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JP2014502735A (ja) 2010-12-20 2014-02-03 スリーエム イノベイティブ プロパティズ カンパニー シリカナノ粒子でコーティングされたガラス状のポリマー反射防止フィルム、該フィルムの製造方法、及び該フィルムを用いた光吸収装置
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JP5905320B2 (ja) * 2012-04-16 2016-04-20 東芝機械株式会社 フライカットによるフィルム状ワークへの溝加工方法及び鏡面加工方法
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DE102014117398B3 (de) * 2014-11-27 2016-05-25 Thielenhaus Technologies Gmbh Verfahren zur Erzeugung von Riefen auf einer Nockenwelle
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JP7106774B2 (ja) * 2017-06-21 2022-07-26 デクセリアルズ株式会社 微細加工装置、微細加工ユニット、制御装置、原盤の製造方法、及び原盤用基材の微細加工方法
JP7023624B2 (ja) * 2017-06-21 2022-02-22 デクセリアルズ株式会社 微細加工装置、制御装置、原盤の製造方法、及び原盤用基材の微細加工方法
CN110434403A (zh) * 2019-07-03 2019-11-12 福建夜光达科技股份有限公司 高效精密切削微细结构的多刀机构与使用方法及使用方法
WO2022238781A1 (en) 2021-05-10 2022-11-17 3M Innovative Properties Company Optical system including light control film and fresnel lens
JP7132456B1 (ja) 2022-02-08 2022-09-06 デクセリアルズ株式会社 微細加工装置、微細加工ユニット、制御装置、原盤の製造方法、及び原盤用基材の微細加工方法

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