KR101046810B1 - 미세복제 공구 생성용 다중 다이아몬드 절삭공구조립체 - Google Patents

미세복제 공구 생성용 다중 다이아몬드 절삭공구조립체 Download PDF

Info

Publication number
KR101046810B1
KR101046810B1 KR1020057004003A KR20057004003A KR101046810B1 KR 101046810 B1 KR101046810 B1 KR 101046810B1 KR 1020057004003 A KR1020057004003 A KR 1020057004003A KR 20057004003 A KR20057004003 A KR 20057004003A KR 101046810 B1 KR101046810 B1 KR 101046810B1
Authority
KR
South Korea
Prior art keywords
tool
cutting
diamond
delete delete
tips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020057004003A
Other languages
English (en)
Korean (ko)
Other versions
KR20050042181A (ko
Inventor
윌리엄 제이. 브라이언
넬슨 디. 세월
제프리 이. 클레멘츠
그렉 이. 쉬랭크
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 컴파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쓰리엠 이노베이티브 프로퍼티즈 컴파니 filed Critical 쓰리엠 이노베이티브 프로퍼티즈 컴파니
Publication of KR20050042181A publication Critical patent/KR20050042181A/ko
Application granted granted Critical
Publication of KR101046810B1 publication Critical patent/KR101046810B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B29/00—Holders for non-rotary cutting tools; Boring bars or boring heads; Accessories for tool holders
    • B23B29/24—Tool holders for a plurality of cutting tools, e.g. turrets
    • B23B29/26—Tool holders in fixed position
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B5/00—Turning-machines or devices specially adapted for particular work; Accessories specially adapted therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D79/00—Methods, machines, or devices not covered elsewhere, for working metal by removal of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B2200/00—Details of cutting inserts
    • B23B2200/16—Supporting or bottom surfaces
    • B23B2200/163—Supporting or bottom surfaces discontinuous
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B2200/00—Details of cutting inserts
    • B23B2200/16—Supporting or bottom surfaces
    • B23B2200/167—Supporting or bottom surfaces with serrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/007—Forming single grooves or ribs, e.g. tear lines, weak spots
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49995—Shaping one-piece blank by removing material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T409/00—Gear cutting, milling, or planing
    • Y10T409/30—Milling
    • Y10T409/303752—Process
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Cutting Tools, Boring Holders, And Turrets (AREA)
  • Milling, Broaching, Filing, Reaming, And Others (AREA)
KR1020057004003A 2002-09-10 2003-07-02 미세복제 공구 생성용 다중 다이아몬드 절삭공구조립체 Expired - Fee Related KR101046810B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/241,247 US20040045419A1 (en) 2002-09-10 2002-09-10 Multi-diamond cutting tool assembly for creating microreplication tools
US10/241,247 2002-09-10
PCT/US2003/020785 WO2004024421A1 (en) 2002-09-10 2003-07-02 Multi-diamond cutting tool assembly for creating microreplication tools

Publications (2)

Publication Number Publication Date
KR20050042181A KR20050042181A (ko) 2005-05-04
KR101046810B1 true KR101046810B1 (ko) 2011-07-06

Family

ID=31991148

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020057004003A Expired - Fee Related KR101046810B1 (ko) 2002-09-10 2003-07-02 미세복제 공구 생성용 다중 다이아몬드 절삭공구조립체

Country Status (9)

Country Link
US (2) US20040045419A1 (enExample)
EP (1) EP1539463A1 (enExample)
JP (1) JP5230896B2 (enExample)
KR (1) KR101046810B1 (enExample)
CN (1) CN100349725C (enExample)
AU (1) AU2003256357A1 (enExample)
BR (1) BR0313927A (enExample)
CA (1) CA2495614A1 (enExample)
WO (1) WO2004024421A1 (enExample)

Families Citing this family (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7516536B2 (en) * 1999-07-08 2009-04-14 Toho Engineering Kabushiki Kaisha Method of producing polishing pad
JP4899375B2 (ja) * 2005-08-08 2012-03-21 コニカミノルタオプト株式会社 切削工具、加工装置、及び切削加工方法
US7757591B2 (en) * 2005-10-19 2010-07-20 3M Innovative Properties Company Aligned multi-diamond cutting tool assembly for creating microreplication tools
US7445409B2 (en) * 2005-10-19 2008-11-04 3M Innovative Properties Company Cutting tool assembly including diamond cutting tips at half-pitch spacing for land feature creation
US7350441B2 (en) * 2005-11-15 2008-04-01 3M Innovative Properties Company Cutting tool having variable movement at two simultaneously independent speeds in an x-direction into a work piece for making microstructures
US7575152B2 (en) * 2005-11-15 2009-08-18 E2Interactive, Inc. Temporary value card method and system
US7350442B2 (en) * 2005-11-15 2008-04-01 3M Innovative Properties Company Cutting tool having variable movement in a z-direction laterally along a work piece for making microstructures
US7293487B2 (en) 2005-11-15 2007-11-13 3M Innovative Properties Company Cutting tool having variable and independent movement in an x-direction and a z-direction into and laterally along a work piece for making microstructures
US7290471B2 (en) * 2005-11-15 2007-11-06 3M Innovative Properties Company Cutting tool having variable rotation about a y-direction transversely across a work piece for making microstructures
US7328638B2 (en) * 2005-12-27 2008-02-12 3M Innovative Properties Company Cutting tool using interrupted cut fast tool servo
JP4739108B2 (ja) 2006-04-27 2011-08-03 東芝機械株式会社 精密ロール旋盤
US7677146B2 (en) * 2006-05-10 2010-03-16 3M Innovative Properties Company Cutting tool using one or more machined tool tips in a continuous or interrupted cut fast tool servo
KR100983950B1 (ko) * 2006-06-14 2010-09-27 도시바 기카이 가부시키가이샤 정밀 롤 선반
JP4837448B2 (ja) * 2006-06-14 2011-12-14 東芝機械株式会社 精密ロール旋盤
JP4786432B2 (ja) * 2006-06-15 2011-10-05 東芝機械株式会社 精密ロール旋盤
ATE430641T1 (de) * 2006-10-26 2009-05-15 Satisloh Ag Maschine zur bearbeitung von optischen werkstücken, insbesondere von kunststoff- brillengläsern
BRPI0718766A2 (pt) 2006-11-15 2014-01-21 3M Innovative Properties Co Impressão flexográfica com cura durante a transferência para o substrato
US20100077932A1 (en) * 2006-11-15 2010-04-01 3M Innovative Properties Company Solvent removal assisted material transfer for flexographic printing
US7628100B2 (en) * 2007-01-05 2009-12-08 3M Innovative Properties Company Cutting tool using one or more machined tool tips with diffractive features in a continuous or interrupted cut fast tool servo
TW200920521A (en) * 2007-04-05 2009-05-16 Toshiba Machine Co Ltd Method and apparatus for machining surface of roll
US20090041553A1 (en) 2007-08-06 2009-02-12 3M Innovative Properties Company Fly-cutting system and method, and related tooling and articles
US9180524B2 (en) 2007-08-06 2015-11-10 3M Innovative Properties Company Fly-cutting head, system and method, and tooling and sheeting produced therewith
US7669508B2 (en) * 2007-10-29 2010-03-02 3M Innovative Properties Company Cutting tool using one or more machined tool tips with diffractive features
US20090147361A1 (en) * 2007-12-07 2009-06-11 3M Innovative Properties Company Microreplicated films having diffractive features on macro-scale features
US9810817B2 (en) 2008-04-02 2017-11-07 3M Innovative Properties Company Light directing film and method for making the same
WO2009146055A2 (en) * 2008-04-02 2009-12-03 3M Innovative Properties Company Methods and systems for fabricating optical films having superimposed features
US8012329B2 (en) * 2008-05-09 2011-09-06 3M Innovative Properties Company Dimensional control in electroforms
JP5355950B2 (ja) 2008-07-17 2013-11-27 東芝機械株式会社 Ｖ溝加工方法および装置
DE102008058452A1 (de) 2008-08-05 2010-02-11 Gühring Ohg Verfahren und Werkzeug zur Erzeugung einer Oberfläche vorbestimmter Rauheit
US20100271910A1 (en) * 2009-04-24 2010-10-28 Zine-Eddine Boutaghou Method and apparatus for near field photopatterning and improved optical coupling efficiency
EP2427287A2 (en) * 2009-05-04 2012-03-14 3M Innovative Properties Company Methods for making microreplication tools
BR112012016335A2 (pt) 2009-12-31 2018-04-03 3M Innovative Properties Co filmes antirreflexivos com superfícies de silicone reticulado, métodos para produzir os mesmos e dispositivos de absorção de luz que usam os mesmos
EP2563865B1 (en) 2010-04-28 2016-06-01 3M Innovative Properties Company Articles including nanosilica-based primers for polymer coatings and methods
KR20130073898A (ko) 2010-04-28 2013-07-03 쓰리엠 이노베이티브 프로퍼티즈 컴파니 실리콘-기반 물질
KR102115940B1 (ko) 2010-10-06 2020-05-27 쓰리엠 이노베이티브 프로퍼티즈 컴파니 나노실리카계 코팅 및 배리어층을 갖는 반사방지 물품
US8677984B2 (en) * 2010-10-15 2014-03-25 Adam Boyd Method and apparatus for tile cutting
KR20130136501A (ko) 2010-12-08 2013-12-12 쓰리엠 이노베이티브 프로퍼티즈 컴파니 유리형 중합체 반사방지 필름, 이를 제조하는 방법 및 이를 사용하는 광 흡수 장치
JP2014502735A (ja) 2010-12-20 2014-02-03 スリーエム イノベイティブ プロパティズ カンパニー シリカナノ粒子でコーティングされたガラス状のポリマー反射防止フィルム、該フィルムの製造方法、及び該フィルムを用いた光吸収装置
US8867001B2 (en) 2011-06-13 2014-10-21 Benq Materials Corp. Patterned retardation film comprising relief-like stripe structures and sub micron grooves
TWI426965B (zh) * 2011-06-13 2014-02-21 Benq Materials Corp 用於製造相位差薄膜之滾輪的製造方法
TWI453107B (zh) * 2011-07-11 2014-09-21 Benq Materials Corp 用於製造相位差薄膜之滾輪的製造方法
TWI458623B (zh) * 2011-07-26 2014-11-01 Benq Materials Corp 用於製造相位差薄膜之滾輪的製造方法
CN102500773A (zh) * 2011-10-28 2012-06-20 苏州金牛精密机械有限公司 飞刀架
JP5871701B2 (ja) * 2012-04-10 2016-03-01 株式会社神戸製鋼所 切削工具の製造方法
JP5905320B2 (ja) * 2012-04-16 2016-04-20 東芝機械株式会社 フライカットによるフィルム状ワークへの溝加工方法及び鏡面加工方法
US9095907B2 (en) * 2012-09-17 2015-08-04 Qmotion Incorporated Drapery tube incorporating batteries within the drapery tube, with a stop for facilitating the loading and unloading of the batteries
US9050669B2 (en) 2012-10-04 2015-06-09 Illinois Tool Works Inc. Rapidly retractable tool support for a pipe machining apparatus
CN102941443A (zh) * 2012-11-05 2013-02-27 宁波镇明转轴有限公司 一种传动螺杆的制造方法
US9623484B2 (en) * 2013-01-14 2017-04-18 Illinois Tool Works Inc. Pipe machining apparatuses and methods of operating the same
CN103302321B (zh) * 2013-05-29 2016-09-28 广州导新模具注塑有限公司 圆形菲涅尔花纹加工刀具组合装置、设备及加工工艺
US9636836B2 (en) 2013-10-03 2017-05-02 Illinois Tool Works Inc. Pivotal tool support for a pipe machining apparatus
DE102014117398B3 (de) * 2014-11-27 2016-05-25 Thielenhaus Technologies Gmbh Verfahren zur Erzeugung von Riefen auf einer Nockenwelle
US10065246B2 (en) 2015-04-13 2018-09-04 Illinois Tool Works Inc. Laser line generator tool for a pipe machining apparatus
US10099292B2 (en) 2015-08-12 2018-10-16 Illinois Tool Works Inc. Crash resistant trip for a pipe machining apparatus
JP7023624B2 (ja) * 2017-06-21 2022-02-22 デクセリアルズ株式会社 微細加工装置、制御装置、原盤の製造方法、及び原盤用基材の微細加工方法
JP7106774B2 (ja) * 2017-06-21 2022-07-26 デクセリアルズ株式会社 微細加工装置、微細加工ユニット、制御装置、原盤の製造方法、及び原盤用基材の微細加工方法
CN110434403A (zh) * 2019-07-03 2019-11-12 福建夜光达科技股份有限公司 高效精密切削微细结构的多刀机构与使用方法及使用方法
CN117255958A (zh) 2021-05-10 2023-12-19 3M创新有限公司 包括光控膜和菲涅耳透镜的光学系统
JP7132456B1 (ja) 2022-02-08 2022-09-06 デクセリアルズ株式会社 微細加工装置、微細加工ユニット、制御装置、原盤の製造方法、及び原盤用基材の微細加工方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0830946A1 (en) * 1996-09-12 1998-03-25 Océ-Technologies B.V. Inkjet print-head
JP2000334834A (ja) * 1999-05-28 2000-12-05 Dainippon Printing Co Ltd 賦型シート用成形型の製造装置及び製造方法

Family Cites Families (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1348115A (en) * 1918-08-31 1920-07-27 Leon G Buckwalter Reversible-taper roughing-reamer
FR967169A (fr) 1948-05-18 1950-10-27 Aiguille ou style pour phonographe d'une seule pièce, mais en deux parties de flexibilité et de rigidité différentes
DE885163C (de) 1951-06-16 1953-08-03 Blaupunkt Elektronik G M B H Universal-Doppelnadeln fuer normale und Microrillen-Schallplatten
US2738730A (en) * 1952-07-01 1956-03-20 Fairchild Camera Instr Co Method for forming engraved image-reproducing plates
BE551477A (enExample) 1955-12-30
CH359899A (fr) 1959-07-24 1962-01-31 Colomb Andre Procédé de fabrication d'une aiguille en saphir pour machine parlante et aiguille obtenue par la mise en oeuvre de ce procédé
NL280085A (enExample) * 1961-06-24
GB906757A (en) * 1961-07-19 1962-09-26 Harold Chandler Multi-diamond tools for use in dressing grinding wheels and the like
US3680213A (en) 1969-02-03 1972-08-01 Karl O Reichert Method of grooving semiconductor wafer for the dividing thereof
US3780409A (en) * 1971-02-19 1973-12-25 Fansteel Inc Threading tool
US3813970A (en) * 1972-01-10 1974-06-04 Ammco Tools Inc Tool holder
US3893356A (en) * 1974-03-19 1975-07-08 Frank Atzberger Rotor cutter
US4035690A (en) * 1974-10-25 1977-07-12 Raytheon Company Plasma panel display device including spheroidal glass shells
US4044379A (en) * 1975-06-30 1977-08-23 Rca Corporation Method and apparatus for electromechanical recording of short wavelength modulation in a metal master
US4035590A (en) * 1975-06-30 1977-07-12 Rca Corporation Apparatus for electromechanical recording of short wavelength modulation in a metal master
US4113266A (en) * 1977-04-25 1978-09-12 Pickering & Company, Inc. Playback stylus for phonograph record stamper
US4113267A (en) * 1977-04-25 1978-09-12 Pickering & Company, Inc. Double stylus assembly for phonograph record stamper playback
US4111083A (en) * 1977-08-08 1978-09-05 Carter Walter L Tool holder
US4287689A (en) * 1979-10-30 1981-09-08 Rca Corporation Method for improving the quality of low frequency output of a video disc pickup stylus
JPS5788501A (en) * 1980-11-25 1982-06-02 Hitachi Ltd Manufacture for video disc reproducing stylus
US4355382A (en) * 1980-12-24 1982-10-19 Rca Corporation Apparatus for sharpening a cutting stylus
JPS58177543A (ja) * 1982-04-09 1983-10-18 Hitachi Ltd ビデオディスク用再生針およびその製造方法
US4525751A (en) * 1982-08-27 1985-06-25 Rca Corporation Disc record with tapered groove
US4625751A (en) * 1985-03-06 1986-12-02 Deere & Company Vehicle steering and auxiliary function hydraulic circuit
JPS62102901A (ja) * 1985-10-28 1987-05-13 Toshiba Corp 光学部品製作方法
JPS63154120A (ja) * 1986-12-18 1988-06-27 松下電器産業株式会社 自動製パン機
DE3718262A1 (de) 1987-05-30 1988-12-08 Werner Hermann Wera Werke Schlagmesser-fraesmaschine
WO1989004052A1 (en) 1987-10-22 1989-05-05 Oxford Instruments Limited Exposing substrates to ion beams
JPH04256501A (ja) * 1991-02-01 1992-09-11 Kobe Steel Ltd 微小切り込み用切削装置
US6069080A (en) 1992-08-19 2000-05-30 Rodel Holdings, Inc. Fixed abrasive polishing system for the manufacture of semiconductor devices, memory disks and the like
US5216843A (en) * 1992-09-24 1993-06-08 Intel Corporation Polishing pad conditioning apparatus for wafer planarization process
US5663802A (en) * 1993-02-25 1997-09-02 Ohio Electronic Engravers, Inc. Method and apparatus for engraving using multiple engraving heads
JPH07124813A (ja) * 1993-10-28 1995-05-16 Olympus Optical Co Ltd フレネル形状の形成方法
US5555473A (en) * 1995-02-21 1996-09-10 Ohio Electronic Engravers, Inc. Engraving system and method for helical or circumferential engraving
US5958799A (en) * 1995-04-13 1999-09-28 North Carolina State University Method for water vapor enhanced charged-particle-beam machining
US5665656A (en) * 1995-05-17 1997-09-09 National Semiconductor Corporation Method and apparatus for polishing a semiconductor substrate wafer
US5814355A (en) 1996-04-30 1998-09-29 Minnesota Mining And Manufacturing Company Mold for producing glittering cube-corner retroreflective sheeting
EP1256320A3 (en) * 1996-09-24 2003-03-19 Xomed Surgical Products, Inc. Powered handpiece and surgical blades and methods thereof
US6216843B1 (en) * 1997-06-05 2001-04-17 Nippon Conlux Co., Ltd. Apparatus for taking out information using magnetic sensor and carrying out test of article by using that information
US6253442B1 (en) 1997-07-02 2001-07-03 3M Innovative Properties Company Retroreflective cube corner sheeting mold and method for making the same
US6077462A (en) 1998-02-20 2000-06-20 3M Innovative Properties Company Method and apparatus for seamless microreplication using an expandable mold
JPH11267902A (ja) * 1998-03-23 1999-10-05 Hiroshi Hashimoto 超微細切刃付き工具及び超微細切刃付き加工具
US6433890B1 (en) * 1998-09-24 2002-08-13 Mdc Max Daetwyler Ag System and method for improving printing of a leading edge of an image in a gravure printing process
JP3652182B2 (ja) * 1999-09-24 2005-05-25 キヤノン株式会社 回折格子の加工方法及び加工装置
IL138710A0 (en) 1999-10-15 2001-10-31 Newman Martin H Atomically sharp edge cutting blades and method for making same
US6325675B1 (en) * 2000-01-14 2001-12-04 Ilsco Corporation Electrical-connector insulating cover having a hinged access cover
US6461224B1 (en) * 2000-03-31 2002-10-08 Lam Research Corporation Off-diameter method for preparing semiconductor wafers
US6325575B1 (en) 2000-05-08 2001-12-04 Daimlerchrysler Corporation Tool for machining multiple surfaces on a stationary workpiece
JP2001322012A (ja) * 2000-05-18 2001-11-20 Canon Inc 切削工具の取り付けホルダー及び切削工具の位置調整装置
US6500054B1 (en) * 2000-06-08 2002-12-31 International Business Machines Corporation Chemical-mechanical polishing pad conditioner
US6551176B1 (en) * 2000-10-05 2003-04-22 Applied Materials, Inc. Pad conditioning disk
US20020159846A1 (en) * 2001-04-26 2002-10-31 Nobukazu Horiike Indexable insert
JP3497492B2 (ja) * 2001-11-02 2004-02-16 東邦エンジニアリング株式会社 半導体デバイス加工用硬質発泡樹脂溝付パッド及びそのパッド旋削溝加工用工具
US6620029B2 (en) * 2002-01-30 2003-09-16 International Business Machines Corporation Apparatus and method for front side chemical mechanical planarization (CMP) of semiconductor workpieces

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0830946A1 (en) * 1996-09-12 1998-03-25 Océ-Technologies B.V. Inkjet print-head
JP2000334834A (ja) * 1999-05-28 2000-12-05 Dainippon Printing Co Ltd 賦型シート用成形型の製造装置及び製造方法

Also Published As

Publication number Publication date
AU2003256357A1 (en) 2004-04-30
EP1539463A1 (en) 2005-06-15
WO2004024421A1 (en) 2004-03-25
US20060234605A1 (en) 2006-10-19
US7510462B2 (en) 2009-03-31
JP2005537944A (ja) 2005-12-15
CN1681639A (zh) 2005-10-12
CN100349725C (zh) 2007-11-21
KR20050042181A (ko) 2005-05-04
US20040045419A1 (en) 2004-03-11
JP5230896B2 (ja) 2013-07-10
CA2495614A1 (en) 2004-03-25
BR0313927A (pt) 2005-07-12

Similar Documents

Publication Publication Date Title
KR101046810B1 (ko) 미세복제 공구 생성용 다중 다이아몬드 절삭공구조립체
US7757591B2 (en) Aligned multi-diamond cutting tool assembly for creating microreplication tools
US7140812B2 (en) Diamond tool with a multi-tipped diamond
US7445409B2 (en) Cutting tool assembly including diamond cutting tips at half-pitch spacing for land feature creation
US20120058310A1 (en) Methods for making microreplication tools

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

A201 Request for examination
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E90F Notification of reason for final refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

FPAY Annual fee payment

Payment date: 20140603

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20150601

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 20160527

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

FPAY Annual fee payment

Payment date: 20170601

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20180630

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20180630