BR0313927A - Conjunto de ferramenta de corte, máquina-ferramenta de diamante usada para criar entalhes em uma peça de trabalho, e, método - Google Patents
Conjunto de ferramenta de corte, máquina-ferramenta de diamante usada para criar entalhes em uma peça de trabalho, e, métodoInfo
- Publication number
- BR0313927A BR0313927A BR0313927A BR0313927A BR0313927A BR 0313927 A BR0313927 A BR 0313927A BR 0313927 A BR0313927 A BR 0313927A BR 0313927 A BR0313927 A BR 0313927A BR 0313927 A BR0313927 A BR 0313927A
- Authority
- BR
- Brazil
- Prior art keywords
- tool
- diamond
- cutting
- cutting tool
- workpiece
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B29/00—Holders for non-rotary cutting tools; Boring bars or boring heads; Accessories for tool holders
- B23B29/24—Tool holders for a plurality of cutting tools, e.g. turrets
- B23B29/26—Tool holders in fixed position
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B5/00—Turning-machines or devices specially adapted for particular work; Accessories specially adapted therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D79/00—Methods, machines, or devices not covered elsewhere, for working metal by removal of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B2200/00—Details of cutting inserts
- B23B2200/16—Supporting or bottom surfaces
- B23B2200/163—Supporting or bottom surfaces discontinuous
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B2200/00—Details of cutting inserts
- B23B2200/16—Supporting or bottom surfaces
- B23B2200/167—Supporting or bottom surfaces with serrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/007—Forming single grooves or ribs, e.g. tear lines, weak spots
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49995—Shaping one-piece blank by removing material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T409/00—Gear cutting, milling, or planing
- Y10T409/30—Milling
- Y10T409/303752—Process
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/04—Processes
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Cutting Tools, Boring Holders, And Turrets (AREA)
- Milling, Broaching, Filing, Reaming, And Others (AREA)
Abstract
"CONJUNTO DE FERRAMENTA DE CORTE, MáQUINA-FERRAMENTA DE DIAMANTE USADA PARA CRIAR ENTALHES EM UMA PEçA DE TRABALHO, E, MéTODO". Em uma modalidade, é descrito um conjunto de ferramenta de corte (10) usado para criar entalhes em uma ferramenta de micro-replicação (72A). O conjunto de ferramenta de corte inclui uma estrutura de montagem (10) e múltiplos diamantes (12, 13) montados na estrutura de montagem (14). Por exemplo, as primeira e segunda hastes da ferramenta com primeira (17) e segunda (18) pontas de diamante podem ser posicionadas na estrutura de montagem (14) de maneira tal que um local de corte de uma ponta de corte de diamante da primeira haste de ferramenta fique a uma distância definida de um local de corte de uma ponta de corte de diamante da segunda haste de ferramenta. A distância definida (y) pode corresponder a um número inteiro (x) de espaçamentos de passo, e pode ser precisa dentro de uma tolerância de menos de 1O microns.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/241,247 US20040045419A1 (en) | 2002-09-10 | 2002-09-10 | Multi-diamond cutting tool assembly for creating microreplication tools |
PCT/US2003/020785 WO2004024421A1 (en) | 2002-09-10 | 2003-07-02 | Multi-diamond cutting tool assembly for creating microreplication tools |
Publications (1)
Publication Number | Publication Date |
---|---|
BR0313927A true BR0313927A (pt) | 2005-07-12 |
Family
ID=31991148
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR0313927A BR0313927A (pt) | 2002-09-10 | 2003-07-02 | Conjunto de ferramenta de corte, máquina-ferramenta de diamante usada para criar entalhes em uma peça de trabalho, e, método |
Country Status (9)
Country | Link |
---|---|
US (2) | US20040045419A1 (pt) |
EP (1) | EP1539463A1 (pt) |
JP (1) | JP5230896B2 (pt) |
KR (1) | KR101046810B1 (pt) |
CN (1) | CN100349725C (pt) |
AU (1) | AU2003256357A1 (pt) |
BR (1) | BR0313927A (pt) |
CA (1) | CA2495614A1 (pt) |
WO (1) | WO2004024421A1 (pt) |
Families Citing this family (59)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7516536B2 (en) * | 1999-07-08 | 2009-04-14 | Toho Engineering Kabushiki Kaisha | Method of producing polishing pad |
JP4899375B2 (ja) * | 2005-08-08 | 2012-03-21 | コニカミノルタオプト株式会社 | 切削工具、加工装置、及び切削加工方法 |
US7445409B2 (en) * | 2005-10-19 | 2008-11-04 | 3M Innovative Properties Company | Cutting tool assembly including diamond cutting tips at half-pitch spacing for land feature creation |
US7757591B2 (en) * | 2005-10-19 | 2010-07-20 | 3M Innovative Properties Company | Aligned multi-diamond cutting tool assembly for creating microreplication tools |
US7350441B2 (en) * | 2005-11-15 | 2008-04-01 | 3M Innovative Properties Company | Cutting tool having variable movement at two simultaneously independent speeds in an x-direction into a work piece for making microstructures |
US7290471B2 (en) * | 2005-11-15 | 2007-11-06 | 3M Innovative Properties Company | Cutting tool having variable rotation about a y-direction transversely across a work piece for making microstructures |
US7293487B2 (en) * | 2005-11-15 | 2007-11-13 | 3M Innovative Properties Company | Cutting tool having variable and independent movement in an x-direction and a z-direction into and laterally along a work piece for making microstructures |
US7350442B2 (en) * | 2005-11-15 | 2008-04-01 | 3M Innovative Properties Company | Cutting tool having variable movement in a z-direction laterally along a work piece for making microstructures |
US7575152B2 (en) * | 2005-11-15 | 2009-08-18 | E2Interactive, Inc. | Temporary value card method and system |
US7328638B2 (en) * | 2005-12-27 | 2008-02-12 | 3M Innovative Properties Company | Cutting tool using interrupted cut fast tool servo |
JP4739108B2 (ja) * | 2006-04-27 | 2011-08-03 | 東芝機械株式会社 | 精密ロール旋盤 |
US7677146B2 (en) * | 2006-05-10 | 2010-03-16 | 3M Innovative Properties Company | Cutting tool using one or more machined tool tips in a continuous or interrupted cut fast tool servo |
JP4837448B2 (ja) * | 2006-06-14 | 2011-12-14 | 東芝機械株式会社 | 精密ロール旋盤 |
KR100983950B1 (ko) * | 2006-06-14 | 2010-09-27 | 도시바 기카이 가부시키가이샤 | 정밀 롤 선반 |
JP4786432B2 (ja) * | 2006-06-15 | 2011-10-05 | 東芝機械株式会社 | 精密ロール旋盤 |
EP1916060B1 (de) * | 2006-10-26 | 2009-05-06 | Satisloh AG | Maschine zur Bearbeitung von optischen Werkstücken, insbesondere von Kunststoff-Brillengläsern |
JP5254986B2 (ja) * | 2006-11-15 | 2013-08-07 | スリーエム イノベイティブ プロパティズ カンパニー | フレキソ印刷のための溶剤除去アシスト材料転写 |
CN101674942B (zh) | 2006-11-15 | 2012-01-25 | 3M创新有限公司 | 转移至基底期间固化的柔性版印刷 |
US7628100B2 (en) * | 2007-01-05 | 2009-12-08 | 3M Innovative Properties Company | Cutting tool using one or more machined tool tips with diffractive features in a continuous or interrupted cut fast tool servo |
TW200920521A (en) * | 2007-04-05 | 2009-05-16 | Toshiba Machine Co Ltd | Method and apparatus for machining surface of roll |
US9180524B2 (en) * | 2007-08-06 | 2015-11-10 | 3M Innovative Properties Company | Fly-cutting head, system and method, and tooling and sheeting produced therewith |
US20090041553A1 (en) * | 2007-08-06 | 2009-02-12 | 3M Innovative Properties Company | Fly-cutting system and method, and related tooling and articles |
US7669508B2 (en) * | 2007-10-29 | 2010-03-02 | 3M Innovative Properties Company | Cutting tool using one or more machined tool tips with diffractive features |
US20090147361A1 (en) * | 2007-12-07 | 2009-06-11 | 3M Innovative Properties Company | Microreplicated films having diffractive features on macro-scale features |
CN101981474A (zh) * | 2008-04-02 | 2011-02-23 | 3M创新有限公司 | 光导薄膜及其制备方法 |
CN102016656A (zh) * | 2008-04-02 | 2011-04-13 | 3M创新有限公司 | 用于制备具有叠加特征的光学膜的方法和系统 |
US8012329B2 (en) * | 2008-05-09 | 2011-09-06 | 3M Innovative Properties Company | Dimensional control in electroforms |
JP5355950B2 (ja) | 2008-07-17 | 2013-11-27 | 東芝機械株式会社 | V溝加工方法および装置 |
DE102008058452A1 (de) | 2008-08-05 | 2010-02-11 | Gühring Ohg | Verfahren und Werkzeug zur Erzeugung einer Oberfläche vorbestimmter Rauheit |
US20100271910A1 (en) * | 2009-04-24 | 2010-10-28 | Zine-Eddine Boutaghou | Method and apparatus for near field photopatterning and improved optical coupling efficiency |
CN102458728A (zh) * | 2009-05-04 | 2012-05-16 | 3M创新有限公司 | 用于制造微复制工具的方法 |
WO2011081974A2 (en) | 2009-12-31 | 2011-07-07 | 3M Innovative Properties Company | Anti-reflective films with cross-linked silicone surfaces, methods of making and light absorbing devices using same |
SG185084A1 (en) | 2010-04-28 | 2012-12-28 | 3M Innovative Properties Co | Articles including nanosilica-based primers for polymer coatings and methods |
EP2563848B1 (en) | 2010-04-28 | 2020-08-26 | 3M Innovative Properties Company | Silicone-based material |
CN103154319B (zh) | 2010-10-06 | 2016-08-10 | 3M创新有限公司 | 具有基于纳米二氧化硅的涂层和阻挡层的抗反射制品 |
US8677984B2 (en) * | 2010-10-15 | 2014-03-25 | Adam Boyd | Method and apparatus for tile cutting |
SG190353A1 (en) | 2010-12-08 | 2013-06-28 | 3M Innovative Properties Co | Glass-like polymeric antireflective films, methods of making and light absorbing devices using same |
US20130258483A1 (en) | 2010-12-20 | 2013-10-03 | 3M Innovative Properties Company | Glass-like polymeric antireflective films coated with silica nanoparticles, methods of making and light absorbing devices using same |
TWI426965B (zh) * | 2011-06-13 | 2014-02-21 | Benq Materials Corp | 用於製造相位差薄膜之滾輪的製造方法 |
US8867001B2 (en) | 2011-06-13 | 2014-10-21 | Benq Materials Corp. | Patterned retardation film comprising relief-like stripe structures and sub micron grooves |
TWI453107B (zh) * | 2011-07-11 | 2014-09-21 | Benq Materials Corp | 用於製造相位差薄膜之滾輪的製造方法 |
TWI458623B (zh) * | 2011-07-26 | 2014-11-01 | Benq Materials Corp | 用於製造相位差薄膜之滾輪的製造方法 |
CN102500773A (zh) * | 2011-10-28 | 2012-06-20 | 苏州金牛精密机械有限公司 | 飞刀架 |
JP5871701B2 (ja) * | 2012-04-10 | 2016-03-01 | 株式会社神戸製鋼所 | 切削工具の製造方法 |
JP5905320B2 (ja) * | 2012-04-16 | 2016-04-20 | 東芝機械株式会社 | フライカットによるフィルム状ワークへの溝加工方法及び鏡面加工方法 |
US20140076115A1 (en) * | 2012-09-17 | 2014-03-20 | Homerun Holdings Corporation | Method and apparatus for cutting one or more grooves in a cylindrical element |
US9050669B2 (en) | 2012-10-04 | 2015-06-09 | Illinois Tool Works Inc. | Rapidly retractable tool support for a pipe machining apparatus |
CN102941443A (zh) * | 2012-11-05 | 2013-02-27 | 宁波镇明转轴有限公司 | 一种传动螺杆的制造方法 |
US9623484B2 (en) * | 2013-01-14 | 2017-04-18 | Illinois Tool Works Inc. | Pipe machining apparatuses and methods of operating the same |
CN103302321B (zh) * | 2013-05-29 | 2016-09-28 | 广州导新模具注塑有限公司 | 圆形菲涅尔花纹加工刀具组合装置、设备及加工工艺 |
US9636836B2 (en) | 2013-10-03 | 2017-05-02 | Illinois Tool Works Inc. | Pivotal tool support for a pipe machining apparatus |
DE102014117398B3 (de) * | 2014-11-27 | 2016-05-25 | Thielenhaus Technologies Gmbh | Verfahren zur Erzeugung von Riefen auf einer Nockenwelle |
US10065246B2 (en) | 2015-04-13 | 2018-09-04 | Illinois Tool Works Inc. | Laser line generator tool for a pipe machining apparatus |
WO2017027776A1 (en) | 2015-08-12 | 2017-02-16 | Illinois Tool Works Inc. | Crash resistant trip for a pipe for a machining apparatus |
JP7023624B2 (ja) * | 2017-06-21 | 2022-02-22 | デクセリアルズ株式会社 | 微細加工装置、制御装置、原盤の製造方法、及び原盤用基材の微細加工方法 |
JP7106774B2 (ja) * | 2017-06-21 | 2022-07-26 | デクセリアルズ株式会社 | 微細加工装置、微細加工ユニット、制御装置、原盤の製造方法、及び原盤用基材の微細加工方法 |
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JP7132456B1 (ja) | 2022-02-08 | 2022-09-06 | デクセリアルズ株式会社 | 微細加工装置、微細加工ユニット、制御装置、原盤の製造方法、及び原盤用基材の微細加工方法 |
Family Cites Families (56)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1348115A (en) * | 1918-08-31 | 1920-07-27 | Leon G Buckwalter | Reversible-taper roughing-reamer |
FR967169A (fr) | 1948-05-18 | 1950-10-27 | Aiguille ou style pour phonographe d'une seule pièce, mais en deux parties de flexibilité et de rigidité différentes | |
DE885163C (de) | 1951-06-16 | 1953-08-03 | Blaupunkt Elektronik G M B H | Universal-Doppelnadeln fuer normale und Microrillen-Schallplatten |
US2738730A (en) * | 1952-07-01 | 1956-03-20 | Fairchild Camera Instr Co | Method for forming engraved image-reproducing plates |
BE551477A (pt) | 1955-12-30 | |||
CH359899A (fr) | 1959-07-24 | 1962-01-31 | Colomb Andre | Procédé de fabrication d'une aiguille en saphir pour machine parlante et aiguille obtenue par la mise en oeuvre de ce procédé |
NL280085A (pt) * | 1961-06-24 | |||
GB906757A (en) * | 1961-07-19 | 1962-09-26 | Harold Chandler | Multi-diamond tools for use in dressing grinding wheels and the like |
US3680213A (en) * | 1969-02-03 | 1972-08-01 | Karl O Reichert | Method of grooving semiconductor wafer for the dividing thereof |
US3780409A (en) * | 1971-02-19 | 1973-12-25 | Fansteel Inc | Threading tool |
US3813970A (en) * | 1972-01-10 | 1974-06-04 | Ammco Tools Inc | Tool holder |
US3893356A (en) * | 1974-03-19 | 1975-07-08 | Frank Atzberger | Rotor cutter |
US4035690A (en) * | 1974-10-25 | 1977-07-12 | Raytheon Company | Plasma panel display device including spheroidal glass shells |
US4035590A (en) * | 1975-06-30 | 1977-07-12 | Rca Corporation | Apparatus for electromechanical recording of short wavelength modulation in a metal master |
US4044379A (en) * | 1975-06-30 | 1977-08-23 | Rca Corporation | Method and apparatus for electromechanical recording of short wavelength modulation in a metal master |
US4113267A (en) * | 1977-04-25 | 1978-09-12 | Pickering & Company, Inc. | Double stylus assembly for phonograph record stamper playback |
US4113266A (en) * | 1977-04-25 | 1978-09-12 | Pickering & Company, Inc. | Playback stylus for phonograph record stamper |
US4111083A (en) * | 1977-08-08 | 1978-09-05 | Carter Walter L | Tool holder |
US4287689A (en) * | 1979-10-30 | 1981-09-08 | Rca Corporation | Method for improving the quality of low frequency output of a video disc pickup stylus |
JPS5788501A (en) * | 1980-11-25 | 1982-06-02 | Hitachi Ltd | Manufacture for video disc reproducing stylus |
US4355382A (en) * | 1980-12-24 | 1982-10-19 | Rca Corporation | Apparatus for sharpening a cutting stylus |
JPS58177543A (ja) * | 1982-04-09 | 1983-10-18 | Hitachi Ltd | ビデオディスク用再生針およびその製造方法 |
US4525751A (en) * | 1982-08-27 | 1985-06-25 | Rca Corporation | Disc record with tapered groove |
US4625751A (en) * | 1985-03-06 | 1986-12-02 | Deere & Company | Vehicle steering and auxiliary function hydraulic circuit |
JPS62102901A (ja) * | 1985-10-28 | 1987-05-13 | Toshiba Corp | 光学部品製作方法 |
JPS63154120A (ja) * | 1986-12-18 | 1988-06-27 | 松下電器産業株式会社 | 自動製パン機 |
DE3718262A1 (de) * | 1987-05-30 | 1988-12-08 | Werner Hermann Wera Werke | Schlagmesser-fraesmaschine |
WO1989004052A1 (en) | 1987-10-22 | 1989-05-05 | Oxford Instruments Limited | Exposing substrates to ion beams |
JPH04256501A (ja) * | 1991-02-01 | 1992-09-11 | Kobe Steel Ltd | 微小切り込み用切削装置 |
US6069080A (en) * | 1992-08-19 | 2000-05-30 | Rodel Holdings, Inc. | Fixed abrasive polishing system for the manufacture of semiconductor devices, memory disks and the like |
US5216843A (en) * | 1992-09-24 | 1993-06-08 | Intel Corporation | Polishing pad conditioning apparatus for wafer planarization process |
US5663802A (en) * | 1993-02-25 | 1997-09-02 | Ohio Electronic Engravers, Inc. | Method and apparatus for engraving using multiple engraving heads |
JPH07124813A (ja) * | 1993-10-28 | 1995-05-16 | Olympus Optical Co Ltd | フレネル形状の形成方法 |
US5555473A (en) * | 1995-02-21 | 1996-09-10 | Ohio Electronic Engravers, Inc. | Engraving system and method for helical or circumferential engraving |
US5958799A (en) * | 1995-04-13 | 1999-09-28 | North Carolina State University | Method for water vapor enhanced charged-particle-beam machining |
US5665656A (en) * | 1995-05-17 | 1997-09-09 | National Semiconductor Corporation | Method and apparatus for polishing a semiconductor substrate wafer |
US5814355A (en) * | 1996-04-30 | 1998-09-29 | Minnesota Mining And Manufacturing Company | Mold for producing glittering cube-corner retroreflective sheeting |
NL1004016C2 (nl) | 1996-09-12 | 1998-03-13 | Oce Tech Bv | Inktstraal-drukkop. |
DE69727183T2 (de) * | 1996-09-24 | 2004-11-04 | Xomed Surgical Products, Inc., North Jacksonville | Angetriebenes Handstück |
US6216843B1 (en) * | 1997-06-05 | 2001-04-17 | Nippon Conlux Co., Ltd. | Apparatus for taking out information using magnetic sensor and carrying out test of article by using that information |
US6253442B1 (en) * | 1997-07-02 | 2001-07-03 | 3M Innovative Properties Company | Retroreflective cube corner sheeting mold and method for making the same |
US6077462A (en) * | 1998-02-20 | 2000-06-20 | 3M Innovative Properties Company | Method and apparatus for seamless microreplication using an expandable mold |
JPH11267902A (ja) * | 1998-03-23 | 1999-10-05 | Hiroshi Hashimoto | 超微細切刃付き工具及び超微細切刃付き加工具 |
US6433890B1 (en) * | 1998-09-24 | 2002-08-13 | Mdc Max Daetwyler Ag | System and method for improving printing of a leading edge of an image in a gravure printing process |
JP4221117B2 (ja) * | 1999-05-28 | 2009-02-12 | 大日本印刷株式会社 | 賦型シート用成形型の製造装置 |
JP3652182B2 (ja) * | 1999-09-24 | 2005-05-25 | キヤノン株式会社 | 回折格子の加工方法及び加工装置 |
IL138710A0 (en) | 1999-10-15 | 2001-10-31 | Newman Martin H | Atomically sharp edge cutting blades and method for making same |
US6325675B1 (en) * | 2000-01-14 | 2001-12-04 | Ilsco Corporation | Electrical-connector insulating cover having a hinged access cover |
US6461224B1 (en) * | 2000-03-31 | 2002-10-08 | Lam Research Corporation | Off-diameter method for preparing semiconductor wafers |
US6325575B1 (en) | 2000-05-08 | 2001-12-04 | Daimlerchrysler Corporation | Tool for machining multiple surfaces on a stationary workpiece |
JP2001322012A (ja) * | 2000-05-18 | 2001-11-20 | Canon Inc | 切削工具の取り付けホルダー及び切削工具の位置調整装置 |
US6500054B1 (en) * | 2000-06-08 | 2002-12-31 | International Business Machines Corporation | Chemical-mechanical polishing pad conditioner |
US6551176B1 (en) * | 2000-10-05 | 2003-04-22 | Applied Materials, Inc. | Pad conditioning disk |
EP1252955A1 (en) * | 2001-04-26 | 2002-10-30 | Mitsubishi Materials Corporation | Indexable insert |
JP3497492B2 (ja) * | 2001-11-02 | 2004-02-16 | 東邦エンジニアリング株式会社 | 半導体デバイス加工用硬質発泡樹脂溝付パッド及びそのパッド旋削溝加工用工具 |
US6620029B2 (en) * | 2002-01-30 | 2003-09-16 | International Business Machines Corporation | Apparatus and method for front side chemical mechanical planarization (CMP) of semiconductor workpieces |
-
2002
- 2002-09-10 US US10/241,247 patent/US20040045419A1/en not_active Abandoned
-
2003
- 2003-07-02 JP JP2004535413A patent/JP5230896B2/ja not_active Expired - Fee Related
- 2003-07-02 WO PCT/US2003/020785 patent/WO2004024421A1/en active Application Filing
- 2003-07-02 AU AU2003256357A patent/AU2003256357A1/en not_active Abandoned
- 2003-07-02 CN CNB03821198XA patent/CN100349725C/zh not_active Expired - Fee Related
- 2003-07-02 BR BR0313927A patent/BR0313927A/pt not_active IP Right Cessation
- 2003-07-02 KR KR1020057004003A patent/KR101046810B1/ko not_active IP Right Cessation
- 2003-07-02 CA CA 2495614 patent/CA2495614A1/en not_active Abandoned
- 2003-07-02 EP EP03795563A patent/EP1539463A1/en not_active Withdrawn
-
2006
- 2006-06-16 US US11/454,319 patent/US7510462B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN100349725C (zh) | 2007-11-21 |
EP1539463A1 (en) | 2005-06-15 |
WO2004024421A1 (en) | 2004-03-25 |
JP5230896B2 (ja) | 2013-07-10 |
KR20050042181A (ko) | 2005-05-04 |
US20040045419A1 (en) | 2004-03-11 |
US7510462B2 (en) | 2009-03-31 |
US20060234605A1 (en) | 2006-10-19 |
JP2005537944A (ja) | 2005-12-15 |
AU2003256357A1 (en) | 2004-04-30 |
CA2495614A1 (en) | 2004-03-25 |
KR101046810B1 (ko) | 2011-07-06 |
CN1681639A (zh) | 2005-10-12 |
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