JP2005532678A - 層間誘電体および事前塗布ダイ取り付け用接着性材料 - Google Patents

層間誘電体および事前塗布ダイ取り付け用接着性材料 Download PDF

Info

Publication number
JP2005532678A
JP2005532678A JP2004514137A JP2004514137A JP2005532678A JP 2005532678 A JP2005532678 A JP 2005532678A JP 2004514137 A JP2004514137 A JP 2004514137A JP 2004514137 A JP2004514137 A JP 2004514137A JP 2005532678 A JP2005532678 A JP 2005532678A
Authority
JP
Japan
Prior art keywords
die
adhesive material
product
die attach
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004514137A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005532678A5 (https=
Inventor
ベネディクト ディロース サントス、
ジェイムズ ティー． ハニク、
プウェイ リウー、
カン ヤン、
クィン ジ、
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henkel Corp
Original Assignee
Henkel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel Corp filed Critical Henkel Corp
Publication of JP2005532678A publication Critical patent/JP2005532678A/ja
Publication of JP2005532678A5 publication Critical patent/JP2005532678A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08L79/085—Unsaturated polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2479/00—Presence of polyamine or polyimide
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01331—Manufacture or treatment of die-attach connectors using blanket deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07338—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by curing, e.g. thermosetting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07339—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by cooling, e.g. thermoplastics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/28—Configurations of stacked chips the stacked chips having different sizes, e.g. chip stacks having a pyramidal shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/752—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556—Organic component
    • Y10T428/12562—Elastomer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556—Organic component
    • Y10T428/12569—Synthetic resin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Die Bonding (AREA)
JP2004514137A 2002-06-17 2003-06-17 層間誘電体および事前塗布ダイ取り付け用接着性材料 Pending JP2005532678A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US38964202P 2002-06-17 2002-06-17
PCT/US2003/019052 WO2003107427A1 (en) 2002-06-17 2003-06-17 Interlayer dielectric and pre-applied die attach adhesive materials

Publications (2)

Publication Number Publication Date
JP2005532678A true JP2005532678A (ja) 2005-10-27
JP2005532678A5 JP2005532678A5 (https=) 2006-08-24

Family

ID=29736665

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004514137A Pending JP2005532678A (ja) 2002-06-17 2003-06-17 層間誘電体および事前塗布ダイ取り付け用接着性材料

Country Status (6)

Country Link
US (2) US7312534B2 (https=)
JP (1) JP2005532678A (https=)
KR (2) KR101164671B1 (https=)
CN (2) CN101488480A (https=)
AU (1) AU2003276729A1 (https=)
WO (1) WO2003107427A1 (https=)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006114756A (ja) * 2004-10-15 2006-04-27 Sumitomo Bakelite Co Ltd 樹脂封止型半導体装置
JP2008133423A (ja) * 2006-10-24 2008-06-12 Toray Ind Inc 半導体用接着組成物、それを用いた半導体装置および半導体装置の製造方法
JP2008177550A (ja) * 2006-12-18 2008-07-31 Nitto Denko Corp 半導体装置製造用の接着シート、及びそれを用いた半導体装置の製造方法
JP2008288571A (ja) * 2007-04-18 2008-11-27 Hitachi Chem Co Ltd 接着剤付きウエハ及びその製造方法、並びに、接着剤組成物
JP2009111340A (ja) * 2007-10-11 2009-05-21 Hitachi Chem Co Ltd 接着剤付きウエハ、接着剤組成物及び接着剤付きウエハの製造方法
JP2010020286A (ja) * 2008-06-13 2010-01-28 Henkel Corp 液晶滴下工法用シール剤および液晶表示装置の製造方法
JP2010116531A (ja) * 2008-10-15 2010-05-27 Hitachi Chem Co Ltd 接着剤組成物、接着剤層及び多段パッケージ
JP2013531889A (ja) * 2010-06-08 2013-08-08 ヘンケル コーポレイション 先ダイシング法を行う微細加工されたウェーハへの接着剤の被覆
JP2014523953A (ja) * 2011-07-28 2014-09-18 プロタヴィック コリア カンパニー リミテッド フレキシブルなビスマレイミド、ベンズオキサジン、エポキシ−無水物付加生成物複合接着剤
JP2015510003A (ja) * 2012-01-25 2015-04-02 ヘンケル ユーエス アイピー エルエルシー シアノアクリレート組成物
US9550883B2 (en) 2012-01-25 2017-01-24 Henkel IP & Holding GmbH Cyanoacrylate compositions
WO2025079399A1 (ja) * 2023-10-13 2025-04-17 コニカミノルタ株式会社 組成物、熱硬化性接着剤、積層体、積層体の製造方法、フレキシブル回路基板及び半導体装置

Families Citing this family (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050288457A1 (en) * 2002-10-22 2005-12-29 Puwei Liu Co-curable compositions
WO2005083771A1 (en) * 2004-02-17 2005-09-09 National Starch And Chemical Investment Holding Corporation Assembly of a semiconductor die attached to substrate with oxazoline derivative bearing an electron donor or acceptor functionality
KR100690960B1 (ko) * 2004-06-24 2007-03-09 삼성전자주식회사 스크린 프린팅 공정을 갖는 반도체 칩 패키지 제조 방법
US7816487B2 (en) * 2004-09-30 2010-10-19 Intel Corporation Die-attach films for chip-scale packaging, packages made therewith, and methods of assembling same
DE102005018704B4 (de) 2005-04-21 2019-05-29 Hexion GmbH Härtbare Mischung, Verfahren zu deren Herstellung und gehärtetes Produkt
US20060266496A1 (en) * 2005-05-31 2006-11-30 Sensis Corporation Method and apparatus for dissipating heat
WO2006138367A2 (en) * 2005-06-17 2006-12-28 Fry's Metals, Inc. Thermoplastic/thermoset composition material and method of attaching a wafer to a substrate
US20080315417A1 (en) * 2005-07-14 2008-12-25 Chipmos Technologies Inc. Chip package
US7456748B2 (en) * 2005-10-20 2008-11-25 National Starch And Chemical Investment Holding Corporation RFID antenna with pre-applied adhesives
US7835158B2 (en) 2005-12-30 2010-11-16 Micron Technology, Inc. Connection verification technique
US20070256783A1 (en) * 2006-05-08 2007-11-08 Dietz Raymond L Thermally enhanced adhesive paste
US8344523B2 (en) 2006-05-08 2013-01-01 Diemat, Inc. Conductive composition
US20090050266A1 (en) * 2007-08-21 2009-02-26 Kang Yang Crosslinked polymeric materials as filler and spacers in adhesives
WO2009117345A2 (en) * 2008-03-17 2009-09-24 Henkel Corporation Adhesive compositions for use in die attach applications
US20090236757A1 (en) * 2008-03-24 2009-09-24 Infineon Technologies Ag Semiconductor device and method for manufacturing
US7851930B1 (en) * 2008-06-04 2010-12-14 Henkel Corporation Conductive adhesive compositions containing an alloy filler material for better dispense and thermal properties
KR101990258B1 (ko) * 2008-08-08 2019-06-17 헨켈 아이피 앤드 홀딩 게엠베하 저온 경화 조성물
KR101627598B1 (ko) * 2008-08-12 2016-06-07 훈츠만 어드밴스트 머티리얼스(스위처랜드) 게엠베하 열경화성 조성물
US7851266B2 (en) * 2008-11-26 2010-12-14 Micron Technologies, Inc. Microelectronic device wafers including an in-situ molded adhesive, molds for in-situ molding adhesives on microelectronic device wafers, and methods of molding adhesives on microelectronic device wafers
CN102300950A (zh) * 2009-02-02 2011-12-28 洛德公司 含有马来酰亚胺封端的聚酰亚胺的结构粘合剂
US8710682B2 (en) * 2009-09-03 2014-04-29 Designer Molecules Inc, Inc. Materials and methods for stress reduction in semiconductor wafer passivation layers
US8415812B2 (en) 2009-09-03 2013-04-09 Designer Molecules, Inc. Materials and methods for stress reduction in semiconductor wafer passivation layers
AU2010306807A1 (en) * 2009-10-15 2012-05-03 Henkel Corporation Anaerobically curable compositions
US8698320B2 (en) * 2009-12-07 2014-04-15 Henkel IP & Holding GmbH Curable resin compositions useful as underfill sealants for use with low-k dielectric-containing semiconductor devices
US20120100379A1 (en) * 2010-10-20 2012-04-26 Greene, Tweed Of Delaware, Inc. Fluoroelastomer bonding compositions suitable for high-temperature applications
JP2014511559A (ja) * 2011-02-01 2014-05-15 ヘンケル コーポレイション プレカットされウェハに塗布されるアンダーフィル膜
US8682169B2 (en) 2011-02-28 2014-03-25 Eldon Technology Limited Apparatus, systems and methods for detecting infrared signals at a media device configured to be positioned in different orientations
US8363411B2 (en) 2011-03-18 2013-01-29 Eldon Technology Limited Passive, low-profile heat transferring system
US8619427B2 (en) 2011-03-21 2013-12-31 Eldon Technology Limited Media content device chassis with internal extension members
US9047492B2 (en) 2011-03-22 2015-06-02 Echostar Uk Holdings Limited Apparatus, systems and methods for securely storing media content events on a flash memory device
US9317079B2 (en) 2011-03-29 2016-04-19 Echostar Uk Holdings Limited Media content device with customized panel
US8638199B2 (en) 2011-03-29 2014-01-28 Eldon Technology Limited Apparatus, systems and methods for power line carrier data communication to DC powered electronic device
US8681495B2 (en) 2011-03-29 2014-03-25 Eldon Technology Limited Media device having a piezoelectric fan
KR101686024B1 (ko) * 2011-04-27 2016-12-13 후지필름 가부시키가이샤 임프린트용 경화성 조성물, 패턴 형성 방법 및 패턴
EP2995179A4 (en) * 2013-02-25 2016-11-02 Parker Hannifin Corp PRE-APPLIED CONDUCTIVE ADHESIVE FOR EMI SHIELDING
US9321245B2 (en) * 2013-06-24 2016-04-26 Globalfoundries Inc. Injection of a filler material with homogeneous distribution of anisotropic filler particles through implosion
WO2015046921A1 (ko) * 2013-09-30 2015-04-02 주식회사 엘지화학 반도체 패키지용 열경화성 수지 조성물과 이를 이용한 프리프레그 및 금속박 적층판
JP6301473B2 (ja) 2013-09-30 2018-03-28 エルジー・ケム・リミテッド 半導体パッケージ用の熱硬化性樹脂組成物とこれを用いたプリプレグおよび金属箔積層板
JP5828881B2 (ja) * 2013-12-24 2015-12-09 日東電工株式会社 接着フィルム、ダイシング・ダイボンドフィルム、半導体装置の製造方法及び半導体装置
US9466632B2 (en) 2015-01-09 2016-10-11 Samsung Electronics Co., Ltd. Image sensor package and an image sensor module having the same
US10037932B2 (en) * 2015-03-30 2018-07-31 Renesas Electronics Corporation Semiconductor device and method of manufacturing the same
DE102016101887B4 (de) * 2016-02-03 2019-01-17 Infineon Technologies Ag Verfahren zum Herstellen eines Package mit Befestigung eines Chipbefestigungsmediums an einem bereits gekapselten elektronischen Chip
DE102017215303A1 (de) 2017-09-01 2018-07-19 Robert Bosch Gmbh Verfahren zum Herstellen eines Halbleiterbauelements
JP6926891B2 (ja) * 2017-09-25 2021-08-25 Jsr株式会社 対象物の処理方法、仮固定用組成物、半導体装置およびその製造方法
US11084913B2 (en) * 2017-10-12 2021-08-10 Texas Research International, Inc. Anaerobic composite matrix resins
US20190112438A1 (en) * 2017-10-12 2019-04-18 Texas Research International, Inc. Anaerobic composite matrix resins
TWI826625B (zh) * 2018-12-28 2023-12-21 美商帝克萊股份有限公司 耐高溫傳導性熱固型樹脂組合物
JP7539988B2 (ja) * 2019-12-20 2024-08-26 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン 金属結合用の銅合金を含有する銀焼結組成物
US11639398B2 (en) 2019-12-30 2023-05-02 Rohm And Haas Electronic Materials Llc Photosensitive bismaleimide composition
US11424177B2 (en) 2020-05-07 2022-08-23 Wolfspeed, Inc. Integrated circuit having die attach materials with channels and process of implementing the same
US11830810B2 (en) * 2020-05-07 2023-11-28 Wolfspeed, Inc. Packaged transistor having die attach materials with channels and process of implementing the same
CN117203743A (zh) 2021-03-15 2023-12-08 纳欧克斯影像有限公司 用于制造电子发射体阵列芯片的硅管芯叠置体的系统和方法
US20230197575A1 (en) 2021-12-20 2023-06-22 Texas Instruments Incorporated Die attach adhesive-ready lead frame design
WO2025106944A1 (en) * 2023-11-16 2025-05-22 Henkel Ag & Co. Kgaa Flexible conductive adhesive compositions
CN118630027A (zh) * 2024-04-29 2024-09-10 北京微电子技术研究所 一种用于传感器芯片的高平面度粘片结构的制作方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02248064A (ja) * 1989-03-20 1990-10-03 Nitto Denko Corp 半導体チップ固着キャリヤの製造方法及びウエハ固定部材
JPH11260839A (ja) * 1998-03-16 1999-09-24 Toray Ind Inc 半導体装置用接着剤組成物およびそれを用いた半導体装置用接着剤シート
JP2000001652A (ja) * 1998-06-12 2000-01-07 Tomoegawa Paper Co Ltd 接着テープ

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2928446A (en) 1957-04-05 1960-03-15 Little Inc A Self-locking screw-threaded fastening member
US4325985A (en) 1980-03-31 1982-04-20 The Oakland Corporation Thread lock
AU566422B2 (en) 1981-10-15 1987-10-22 Thompson, W.H. A polymerisable fluid
US4851454A (en) 1986-07-17 1989-07-25 The Dow Chemical Company Photolytically crosslinkable thermally stable composition
US5215860A (en) * 1988-08-19 1993-06-01 Minnesota Mining And Manufacturing Company Energy-curable cyanate compositions
US5015695A (en) 1989-05-09 1991-05-14 Shell Oil Company Functionalized elastomeric polymer production
JPH0395225A (ja) * 1989-09-08 1991-04-19 Fujitsu Ltd マレイミド樹脂組成物
US5148265A (en) 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies with fan-in leads
US5177032A (en) 1990-10-24 1993-01-05 Micron Technology, Inc. Method for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tape
US5140404A (en) 1990-10-24 1992-08-18 Micron Technology, Inc. Semiconductor device manufactured by a method for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tape
US5300608A (en) 1992-03-31 1994-04-05 Loctite Corporation Process for preparing alkoxy-terminated organosiloxane fluids using organo-lithium reagents
US5323060A (en) 1993-06-02 1994-06-21 Micron Semiconductor, Inc. Multichip module having a stacked chip arrangement
BR9507878A (pt) 1994-05-19 1997-08-12 Du Pont Composição de revestimento composição de revestimento transparente camada de base de pigmento e processo para preparar uma composição de revestimento
US6034194A (en) 1994-09-02 2000-03-07 Quantum Materials/Dexter Corporation Bismaleimide-divinyl adhesive compositions and uses therefor
US5789757A (en) 1996-09-10 1998-08-04 The Dexter Corporation Malemide containing formulations and uses therefor
US6960636B2 (en) * 1994-09-02 2005-11-01 Henkel Corporation Thermosetting resin compositions containing maleimide and/or vinyl compounds
US5585671A (en) * 1994-10-07 1996-12-17 Nagesh; Voddarahalli K. Reliable low thermal resistance package for high power flip clip ICs
US5717034A (en) 1996-07-29 1998-02-10 Quantum Materials, Inc. Perfluorinated hydrocarbon polymer-filled adhesive formulations and uses therefor
US5973166A (en) 1998-03-02 1999-10-26 The Dexter Corporation Method for the preparation of maleimides
US6355750B1 (en) 1998-07-02 2002-03-12 National Starch And Chemical Investment Holding Corporation Dye attach adhesives for use in microelectronic devices
SG105450A1 (en) * 1998-07-02 2004-08-27 Nat Starch Chem Invest Allylated amide compounds and die attach adhesives prepared therefrom
US6265530B1 (en) * 1998-07-02 2001-07-24 National Starch And Chemical Investment Holding Corporation Die attach adhesives for use in microelectronic devices
JP2000243831A (ja) * 1999-02-18 2000-09-08 Sony Corp 半導体装置とその製造方法
AR023110A1 (es) 1999-03-22 2002-09-04 Loctite Corp Articulos roscados con revestimiento deformable curado sobre los mismos
US6861670B1 (en) * 1999-04-01 2005-03-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having multi-layer wiring
WO2000078887A1 (en) * 1999-06-18 2000-12-28 Hitachi Chemical Company, Ltd. Adhesive, adhesive member, circuit substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same
US6522018B1 (en) * 2000-05-16 2003-02-18 Micron Technology, Inc. Ball grid array chip packages having improved testing and stacking characteristics
US6953984B2 (en) * 2000-06-23 2005-10-11 International Business Machines Corporation Hydrogenated oxidized silicon carbon material
US6963001B2 (en) * 2000-09-30 2005-11-08 Henkel Corporation Low shrinkage thermosetting resin compositions and methods of use therefor
US6620651B2 (en) 2001-10-23 2003-09-16 National Starch And Chemical Investment Holding Corporation Adhesive wafers for die attach application
US6743852B2 (en) * 2001-11-13 2004-06-01 Henkel Corporation Benzoxazines, thermosetting resins comprised thereof, and methods for use thereof
US6620905B1 (en) * 2002-02-23 2003-09-16 National Starch And Chemical Investment Holding Corporation Curable compositions containing benzoxazine
US6831132B2 (en) * 2002-03-28 2004-12-14 Henkel Corporation Film adhesives containing maleimide compounds and methods for use thereof
US7176044B2 (en) * 2002-11-25 2007-02-13 Henkel Corporation B-stageable die attach adhesives

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02248064A (ja) * 1989-03-20 1990-10-03 Nitto Denko Corp 半導体チップ固着キャリヤの製造方法及びウエハ固定部材
JPH11260839A (ja) * 1998-03-16 1999-09-24 Toray Ind Inc 半導体装置用接着剤組成物およびそれを用いた半導体装置用接着剤シート
JP2000001652A (ja) * 1998-06-12 2000-01-07 Tomoegawa Paper Co Ltd 接着テープ

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006114756A (ja) * 2004-10-15 2006-04-27 Sumitomo Bakelite Co Ltd 樹脂封止型半導体装置
JP2008133423A (ja) * 2006-10-24 2008-06-12 Toray Ind Inc 半導体用接着組成物、それを用いた半導体装置および半導体装置の製造方法
JP2008177550A (ja) * 2006-12-18 2008-07-31 Nitto Denko Corp 半導体装置製造用の接着シート、及びそれを用いた半導体装置の製造方法
JP2008288571A (ja) * 2007-04-18 2008-11-27 Hitachi Chem Co Ltd 接着剤付きウエハ及びその製造方法、並びに、接着剤組成物
JP2009111340A (ja) * 2007-10-11 2009-05-21 Hitachi Chem Co Ltd 接着剤付きウエハ、接着剤組成物及び接着剤付きウエハの製造方法
TWI471351B (zh) * 2008-06-13 2015-02-01 Henkel IP & Holding GmbH 用於液晶滴注製程之密封劑及製造液晶顯示器之方法
JP2010020286A (ja) * 2008-06-13 2010-01-28 Henkel Corp 液晶滴下工法用シール剤および液晶表示装置の製造方法
JP2010116531A (ja) * 2008-10-15 2010-05-27 Hitachi Chem Co Ltd 接着剤組成物、接着剤層及び多段パッケージ
JP2013531889A (ja) * 2010-06-08 2013-08-08 ヘンケル コーポレイション 先ダイシング法を行う微細加工されたウェーハへの接着剤の被覆
JP2014523953A (ja) * 2011-07-28 2014-09-18 プロタヴィック コリア カンパニー リミテッド フレキシブルなビスマレイミド、ベンズオキサジン、エポキシ−無水物付加生成物複合接着剤
JP2015510003A (ja) * 2012-01-25 2015-04-02 ヘンケル ユーエス アイピー エルエルシー シアノアクリレート組成物
US9550883B2 (en) 2012-01-25 2017-01-24 Henkel IP & Holding GmbH Cyanoacrylate compositions
WO2025079399A1 (ja) * 2023-10-13 2025-04-17 コニカミノルタ株式会社 組成物、熱硬化性接着剤、積層体、積層体の製造方法、フレキシブル回路基板及び半導体装置

Also Published As

Publication number Publication date
US20050008832A1 (en) 2005-01-13
CN1663048A (zh) 2005-08-31
AU2003276729A1 (en) 2003-12-31
CN100449776C (zh) 2009-01-07
KR20100121552A (ko) 2010-11-17
US7550825B2 (en) 2009-06-23
KR101136719B1 (ko) 2012-04-20
US7312534B2 (en) 2007-12-25
KR101164671B1 (ko) 2012-07-11
CN101488480A (zh) 2009-07-22
US20070278683A1 (en) 2007-12-06
KR20050010933A (ko) 2005-01-28
WO2003107427A1 (en) 2003-12-24

Similar Documents

Publication Publication Date Title
JP2005532678A (ja) 層間誘電体および事前塗布ダイ取り付け用接着性材料
US7851254B2 (en) B-stageable die attach adhesives
KR101020375B1 (ko) 말레이미드 및 관련 화합물을 함유하는 필름 접착제 및그의 사용 방법
US8338536B2 (en) Adhesive compositions for use in die attach applications
KR100980383B1 (ko) 다이 부착용 이중 경화 ｂ-스테이지 가능형 접착제
KR101223385B1 (ko) 유기 스페이서를 함유하는 접착 조성물 및 그의 사용 방법
TW200424276A (en) Thermally conductive adhesive composition and process for device attachment
US20100311207A1 (en) Compounds Having A Diphenyl Oxide Backbone and Maleimide Functional Group
KR20230164059A (ko) 저 갭 언더필 적용을 위한 플럭스-상용성 에폭시-페놀계 접착제 조성물
JP2017117864A (ja) 先供給型アンダーフィル材及びその硬化物、並びに電子部品装置及びその製造方法
TWI920069B (zh) 用於低間隙底部填充應用之與助熔劑相容的環氧酚系黏著劑組合物
WO2009078878A1 (en) Compounds having a diphenyl oxide backbone and maleimide functional group
JP6707856B2 (ja) 先供給型アンダーフィル材、電子部品装置の製造方法、及び電子部品装置
WO2024225084A1 (ja) フィルム状封止剤および回路装置
JP2020057815A (ja) 先供給型アンダーフィル材及びその硬化物、並びに電子部品装置及びその製造方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20060427

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060706

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20090710

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090715

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20091015

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20091022

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20091113

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20091120

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20091214

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20091221

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100114

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20101020