TWI826625B - 耐高溫傳導性熱固型樹脂組合物 - Google Patents
耐高溫傳導性熱固型樹脂組合物 Download PDFInfo
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- TWI826625B TWI826625B TW108148073A TW108148073A TWI826625B TW I826625 B TWI826625 B TW I826625B TW 108148073 A TW108148073 A TW 108148073A TW 108148073 A TW108148073 A TW 108148073A TW I826625 B TWI826625 B TW I826625B
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- composition
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- 239000011342 resin composition Substances 0.000 title abstract description 3
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- 150000001875 compounds Chemical class 0.000 claims description 50
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- 239000011347 resin Substances 0.000 claims description 41
- 239000002904 solvent Substances 0.000 claims description 33
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims description 26
- 150000001491 aromatic compounds Chemical class 0.000 claims description 23
- 239000011231 conductive filler Substances 0.000 claims description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 22
- 125000000524 functional group Chemical group 0.000 claims description 22
- 125000001033 ether group Chemical group 0.000 claims description 18
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 claims description 15
- -1 ethynyl aryl compound Chemical class 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- 125000003118 aryl group Chemical group 0.000 claims description 14
- 229910052802 copper Inorganic materials 0.000 claims description 14
- 239000010949 copper Substances 0.000 claims description 14
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims description 12
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 claims description 10
- 150000002989 phenols Chemical class 0.000 claims description 10
- 229910052782 aluminium Inorganic materials 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 9
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 claims description 8
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 8
- HIXDQWDOVZUNNA-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-hydroxy-7-methoxychromen-4-one Chemical compound C=1C(OC)=CC(O)=C(C(C=2)=O)C=1OC=2C1=CC=C(OC)C(OC)=C1 HIXDQWDOVZUNNA-UHFFFAOYSA-N 0.000 claims description 6
- 150000003869 acetamides Chemical class 0.000 claims description 6
- 150000003948 formamides Chemical class 0.000 claims description 5
- 239000012298 atmosphere Substances 0.000 claims description 4
- 238000009835 boiling Methods 0.000 claims description 4
- 239000007795 chemical reaction product Substances 0.000 claims description 4
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 claims description 3
- 125000003342 alkenyl group Chemical group 0.000 claims description 2
- 125000000217 alkyl group Chemical group 0.000 claims description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 2
- 125000003566 oxetanyl group Chemical group 0.000 claims description 2
- 239000001301 oxygen Substances 0.000 claims description 2
- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- 150000002013 dioxins Chemical class 0.000 claims 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
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- 239000011889 copper foil Substances 0.000 description 8
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- 239000002318 adhesion promoter Substances 0.000 description 7
- 229910000077 silane Inorganic materials 0.000 description 7
- 239000004593 Epoxy Substances 0.000 description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 239000003989 dielectric material Substances 0.000 description 5
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- 238000011282 treatment Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000011256 inorganic filler Substances 0.000 description 4
- 229910003475 inorganic filler Inorganic materials 0.000 description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 4
- 229920003319 Araldite® Polymers 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
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- XAZPKEBWNIUCKF-UHFFFAOYSA-N 1-[4-[4-[2-[4-[4-(2,5-dioxopyrrol-1-yl)phenoxy]phenyl]propan-2-yl]phenoxy]phenyl]pyrrole-2,5-dione Chemical compound C=1C=C(OC=2C=CC(=CC=2)N2C(C=CC2=O)=O)C=CC=1C(C)(C)C(C=C1)=CC=C1OC(C=C1)=CC=C1N1C(=O)C=CC1=O XAZPKEBWNIUCKF-UHFFFAOYSA-N 0.000 description 2
- WOCGGVRGNIEDSZ-UHFFFAOYSA-N 4-[2-(4-hydroxy-3-prop-2-enylphenyl)propan-2-yl]-2-prop-2-enylphenol Chemical compound C=1C=C(O)C(CC=C)=CC=1C(C)(C)C1=CC=C(O)C(CC=C)=C1 WOCGGVRGNIEDSZ-UHFFFAOYSA-N 0.000 description 2
- DLFVBJFMPXGRIB-UHFFFAOYSA-N Acetamide Chemical compound CC(N)=O DLFVBJFMPXGRIB-UHFFFAOYSA-N 0.000 description 2
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- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
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- 239000002131 composite material Substances 0.000 description 2
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- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
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- 150000004706 metal oxides Chemical class 0.000 description 2
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- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 description 2
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- 230000004580 weight loss Effects 0.000 description 2
- PNXLPYYXCOXPBM-UHFFFAOYSA-N 1,3-diethynylbenzene Chemical compound C#CC1=CC=CC(C#C)=C1 PNXLPYYXCOXPBM-UHFFFAOYSA-N 0.000 description 1
- ZVDJGAZWLUJOJW-UHFFFAOYSA-N 1-(4-ethenylphenyl)ethyl-trimethoxysilane Chemical compound CO[Si](OC)(OC)C(C)C1=CC=C(C=C)C=C1 ZVDJGAZWLUJOJW-UHFFFAOYSA-N 0.000 description 1
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 description 1
- 125000006024 2-pentenyl group Chemical group 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
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- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
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- 101100280469 Salmonella typhimurium (strain LT2 / SGSC1412 / ATCC 700720) fabI gene Proteins 0.000 description 1
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- 239000006096 absorbing agent Substances 0.000 description 1
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- 230000002411 adverse Effects 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 125000005370 alkoxysilyl group Chemical group 0.000 description 1
- RREGISFBPQOLTM-UHFFFAOYSA-N alumane;trihydrate Chemical compound O.O.O.[AlH3] RREGISFBPQOLTM-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 238000012093 association test Methods 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
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- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- KQAHMVLQCSALSX-UHFFFAOYSA-N decyl(trimethoxy)silane Chemical compound CCCCCCCCCC[Si](OC)(OC)OC KQAHMVLQCSALSX-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
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- 229910003460 diamond Inorganic materials 0.000 description 1
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- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- SCPWMSBAGXEGPW-UHFFFAOYSA-N dodecyl(trimethoxy)silane Chemical compound CCCCCCCCCCCC[Si](OC)(OC)OC SCPWMSBAGXEGPW-UHFFFAOYSA-N 0.000 description 1
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
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- 239000010931 gold Substances 0.000 description 1
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- PYGSKMBEVAICCR-UHFFFAOYSA-N hexa-1,5-diene Chemical group C=CCCC=C PYGSKMBEVAICCR-UHFFFAOYSA-N 0.000 description 1
- CZWLNMOIEMTDJY-UHFFFAOYSA-N hexyl(trimethoxy)silane Chemical compound CCCCCC[Si](OC)(OC)OC CZWLNMOIEMTDJY-UHFFFAOYSA-N 0.000 description 1
- 125000004356 hydroxy functional group Chemical group O* 0.000 description 1
- NOKUWSXLHXMAOM-UHFFFAOYSA-N hydroxy(phenyl)silicon Chemical class O[Si]C1=CC=CC=C1 NOKUWSXLHXMAOM-UHFFFAOYSA-N 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 239000006249 magnetic particle Substances 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002114 nanocomposite Substances 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 239000002135 nanosheet Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- SLYCYWCVSGPDFR-UHFFFAOYSA-N octadecyltrimethoxysilane Chemical compound CCCCCCCCCCCCCCCCCC[Si](OC)(OC)OC SLYCYWCVSGPDFR-UHFFFAOYSA-N 0.000 description 1
- MSRJTTSHWYDFIU-UHFFFAOYSA-N octyltriethoxysilane Chemical compound CCCCCCCC[Si](OCC)(OCC)OCC MSRJTTSHWYDFIU-UHFFFAOYSA-N 0.000 description 1
- 229960003493 octyltriethoxysilane Drugs 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 239000003880 polar aprotic solvent Substances 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- 239000006254 rheological additive Substances 0.000 description 1
- 238000000518 rheometry Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910001923 silver oxide Inorganic materials 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229920006259 thermoplastic polyimide Polymers 0.000 description 1
- 239000004634 thermosetting polymer Substances 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- FZMJEGJVKFTGMU-UHFFFAOYSA-N triethoxy(octadecyl)silane Chemical compound CCCCCCCCCCCCCCCCCC[Si](OCC)(OCC)OCC FZMJEGJVKFTGMU-UHFFFAOYSA-N 0.000 description 1
- UBMUZYGBAGFCDF-UHFFFAOYSA-N trimethoxy(2-phenylethyl)silane Chemical compound CO[Si](OC)(OC)CCC1=CC=CC=C1 UBMUZYGBAGFCDF-UHFFFAOYSA-N 0.000 description 1
- ZYMHKOVQDOFPHH-UHFFFAOYSA-N trimethoxy(oct-1-enyl)silane Chemical compound CCCCCCC=C[Si](OC)(OC)OC ZYMHKOVQDOFPHH-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- AXNJHBYHBDPTQF-UHFFFAOYSA-N trimethoxy(tetradecyl)silane Chemical compound CCCCCCCCCCCCCC[Si](OC)(OC)OC AXNJHBYHBDPTQF-UHFFFAOYSA-N 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F236/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds
- C08F236/02—Copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds the radical having only two carbon-to-carbon double bonds
- C08F236/04—Copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds the radical having only two carbon-to-carbon double bonds conjugated
- C08F236/14—Copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds the radical having only two carbon-to-carbon double bonds conjugated containing elements other than carbon and hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/12—Unsaturated polyimide precursors
- C08G73/126—Unsaturated polyimide precursors the unsaturated precursors being wholly aromatic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
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Abstract
本發明提供耐高溫傳導性熱固型樹脂組合物。
Description
本發明提供耐高溫傳導性熱固型樹脂組合物。
固化之後具有高溫穩定性之樹脂為多種商業應用所需。例如,靜電儲存能量之介電材料普遍存在於先進電子及電功率系統中。與其陶瓷對應物相比,聚合物介電質具有較高擊穿強度及較大可靠性,其為可縮放的、輕質的且可經成形為錯綜複雜的組態。因此,其為許多功率電子、功率調節及脈衝功率應用之理想選擇。然而,聚合物介電質時常在使用中受限於相對較低操作溫度。因此,其在存在於諸如混合及電動車輛、航天功率電子及地下油及氣體勘探之應用中之極端條件下未能滿足對電力之上升需求。[參見例如Qi Li等人, Flexible high-temperature dielectric materials from polymer nanocomposites, Nature, 第523卷, 576 (2015)。]
在經金屬包覆之印刷電路板(「PCB」)應用中,介電層為包夾於印刷電路箔與金屬底板之間的導熱複合物。填充有導熱填料之習知或高溫環氧樹脂用於許多包括某些大功率LED照明市場之當前應用。
歸因於電子及電功率系統之最新發展,經金屬包覆之PCB之操作溫度已增加。該溫度增加可能引起在單板上之各種應用中所使用之習知樹脂的降解。例如,聚合物介電複合物以及灌注化合物用於絕緣閘雙極電晶體(「IGBT」)功率模組中。此等模組充當用於馬達之變速驅動器之功率轉換器、不間斷之功率供應器及更多的切換元件。IGBT功率模組將高速切換效能與高電壓/電流操作能力組合。
在一個最近IGBT功率模組設計中,介電層置放於0.5 mm厚的銅箔與銅底板之間,產生絕緣金屬底板結構。[參見例如K. Ohara等人, 「A New IGBT Module with Insulated Metal Baseplate(IMB)and 7th Generation Chips」, PCIM Europe 2015, Nuremberg, Germany(2015年5月19-21日)。] 此外,在操作中,若操作電壓/電流在未來增加時介電層需要經受住高溫。但隨著樹脂在較高使用溫度下降解,此等功率模組隨時間推移可能不恰當地起作用,從而導致故障。明顯地,那並非所需結果。
另外,現有高溫聚合樹脂通常不適合用於製造經金屬包覆之PCB介電層。
例如,熱塑性聚醯亞胺為熟知高溫介電聚合物。然而,完全醯亞胺化之聚醯亞胺通常在除侵襲性極性非質子溶劑外之多種溶劑中具有不佳溶解性。為使用填充有導熱填料之聚醯亞胺來製造介電層,需要在層壓步驟之前移除所選擇之溶劑。否則,殘餘溶劑可導致氣泡/缺陷形成。
製造許多具有粗糙表面之銅箔以改良與如介電層之基板之黏著力,進一步使事情複雜化。在較高玻璃轉移溫度及較高熔融黏度之情況下使用諸如聚醯亞胺之聚合樹脂可導致銅表面之粗糙地形的不佳滲透及濕透。此可不利地影響黏著力。
因此存在對熱固型樹脂之巨大且長期而未滿足的需求,該等熱固型樹脂可耐受高於180℃或甚至200℃之高溫,從而允許在經金屬包覆之印刷電路板應用或具有相當需求效能之類似應用中或在使用環境中之不間斷功能。
迄今為止彼需求仍未滿足。
本發明藉由提供本發明組合物滿足彼需求,其在一個態樣中包括:
(a)樹脂,其包含:
(i)具有一或多個選自馬來醯亞胺、納迪醯亞胺或衣康醯亞胺之官能基的第一化合物;
(ii)具有一或多個選自馬來醯亞胺、納迪醯亞胺或衣康醯亞胺之官能基的第二化合物,其中該第二化合物不同於該第一化合物;及
(iii)經烯丙基官能化之酚化合物;
(b)呈總樹脂之約0.01至約20重量當量之量的導熱填料;及
(c)選自環烷酮、二烷基甲醯胺、二烷基乙醯胺及其組合之溶劑。
在另一態樣中,本發明組合物包括:
(a)樹脂,其包含:
(i)具有一或多個選自馬來醯亞胺、納迪醯亞胺或衣康醯亞胺之官能基的第一化合物;及
(ii)經一或多個醚基及一或多個烯丙基官能化之芳族化合物;
(b)呈總樹脂之約0.01至約20重量當量之量的導熱填料;及
(c)選自環烷酮、二烷基甲醯胺、二烷基乙醯胺及其組合之溶劑。
如上所指出,在一個態樣中本發明組合物包括:
(a)樹脂,其包含:
(i)具有一或多個選自馬來醯亞胺、納迪醯亞胺或衣康醯亞胺之官能基的第一化合物;
(ii)具有一或多個選自馬來醯亞胺、納迪醯亞胺或衣康醯亞胺之官能基的第二化合物,其中該第二化合物不同於該第一化合物;及
(iii)經烯丙基官能化之酚化合物;
(b)呈總樹脂之約0.01至約20重量當量之量的導熱填料;及
(c)選自環烷酮、二烷基甲醯胺、二烷基乙醯胺及其組合之溶劑。
該(a)之樹脂包含:
(i)具有兩個選自馬來醯亞胺、納迪醯亞胺或衣康醯亞胺之官能基的第一化合物;
(ii)具有兩個選自馬來醯亞胺、納迪醯亞胺或衣康醯亞胺之官能基的第二化合物,該第二化合物不同於該第一化合物;及
(iii)經二烯丙基官能化之酚化合物。除兩個烯丙基以外,該酚化合物亦具有兩個羥基。
在所需實施例中,該(a)之樹脂包括:。
該(a)之樹脂可包括該第一化合物(a)(i)及該第二化合物(a)(ii)與該經烯丙基官能化之酚化合物(a) (iii)的莫耳比為約1:10至約10:1,諸如約1:5至約5:1,期望地約1:2至約2:1。
該(c)之溶劑可選自環烷酮、二烷基甲醯胺及二烷基乙醯胺。例如,無論單獨或組合,環戊酮及環己酮為所期望環烷酮;二甲基甲醯胺為所期望二烷基甲醯胺;且二甲基乙醯胺為所期望二烷基乙醯胺。此等溶劑之組合亦可為適合的。
按總組合物計,該(c)之溶劑應以約10至約90重量%之量存在。
該(c)之溶劑在1大氣壓下具有小於或等於約165℃之沸點。在一些實施例中,溶劑之沸點在1大氣壓下可小於或等於160℃,期望地為150℃,諸如145℃。
且如上文所指出,在另一態樣中本發明組合物包括:
(a)樹脂,其包含:
(i)具有一或多個選自馬來醯亞胺、納迪醯亞胺或衣康醯亞胺之官能基的第一化合物;及
(ii)經一或多個醚基及一或多個烯丙基官能化之芳族化合物;
(b)呈總樹脂之約0.01至約20重量當量之量的導熱填料;及
(c)選自環烷酮、二烷基甲醯胺、二烷基乙醯胺及其組合之溶劑。
此處,該(a)之樹脂包含:
(i)具有兩個選自馬來醯亞胺、納迪醯亞胺或衣康醯亞胺之官能基的第一化合物;及
(ii)經兩個醚基及兩個烯丙基官能化之芳族化合物。
在一個實施例中,該(a)之樹脂包含:。
該(a)之樹脂可包含該第一化合物(a)(i)與該經一或多個醚基及一或多個烯丙基官能化之芳族化合物(a)(ii)之莫耳比為約1:10至約10:1,諸如約1:5至約5:1,期望地約1:2至約2:1。
此處該(c)之溶劑為與上文所描述相同之溶劑。因此,為簡潔起見,此處未再次描述。
該經一或多個醚基及一或多個烯丙基官能化之芳族化合物可由以下通用結構涵蓋:
其中R為選自氧雜環丁烷基、縮水甘油基或C1 - 4
烷基或C6 - 10
芳基之基團;Ar為芳環或芳環系統殘基;X為直接鍵或氧;且m及n獨立地選自1至約10範圍內之整數。
該經一或多個醚基及一或多個烯丙基官能化之芳族化合物之實例包括但不限於。
該經一或多個醚基及一或多個烯丙基官能化之芳族化合物的醚基可為環氧醚或氧雜環丁烷醚。經一或多個環氧醚基或氧雜環丁烷醚基及一或多個烯丙基官能化之芳族化合物的實例包括但不限於。
對於熟習此項技術者而言,可使用諸如巴豆基、γ-甲基巴豆基或2-戊烯基之經取代之烯丙基代替上文所描述之烯丙基。
導熱填料可選自此項技術中已知之多種材料,且其中許多可經商購。參見例如美國專利第6,169,142號(第4欄,第7-33行)。導熱填料可為導熱且導電的。替代地,導熱填料可為導熱且電絕緣的。導熱填料之類別包括金屬填料、無機填料、基於碳之填料、導熱聚合物粒子填料或其組合。
金屬填料包括金屬的粒子及在粒子之表面上具有層之金屬的粒子。此等層可為例如在粒子之表面上之金屬氮化物層或金屬氧化物層。適合之金屬填料由選自鋁、銅、金、鎳、銀及其組合之金屬的粒子例示。適合之金屬填料由在表面上具有選自氮化鋁、氧化鋁、氧化銅、氧化鎳、氧化銀及其組合之層之上文所列金屬的粒子進一步例示。例如,金屬填料可包含在表面上具有氧化鋁層之鋁粒子。
無機填料由諸如氧化鋁、氧化鈹、氧化鎂及氧化鋅之金屬氧化物;諸如氮化鋁及氮化硼之氮化物;諸如碳化矽及碳化鎢之碳化物;及其組合例示。其他實例包括三水合鋁、二氧化矽、鈦酸鋇及氫氧化鎂。
基於碳之填料包括碳纖維、鑽石、石墨。諸如一維奈米碳管及二維石墨烯及石墨奈米片之碳奈米結構材料由於其固有高導熱性可用於組合物中。
導熱聚合物填料之實例包括定向聚乙烯纖維及奈米纖維素、諸如彼等描述於V. Singh等人, 「High thermal conductivity of chain-oriented amorphous polythiophene」,Nature Nanotechnology
, 第9卷, 384 (2014)中之聚噻吩,以及諸如彼等描述於S. Yoshihara等人, 「Main-chain smectic liquid crystalline polymer exhibiting unusually high thermal conductivity in an isotropic composite」,J . Appl . Polym . Sci .
, 第131卷, 39896 (2014)中之液晶聚合物。
導熱填料可為任何形狀。當需要較高負載量時,圓形或球形粒子可將黏度降至最低。導熱填料可為單一導熱填料或至少一種特性(諸如粒子形狀、平均粒度、粒度分佈及填料類型)不同之兩種或更多種導熱填料之組合。例如,可能期望使用無機填料(諸如具有較大平均粒度之第一氧化鋁與具有較小平均粒度之第二氧化鋁)之組合。替代地,可能期望例如使用具有較大平均粒度之氧化鋁與具有較小平均粒度之氧化鋅的組合;或可能期望使用金屬填料之組合,諸如具有較大平均粒度之第一鋁與具有較小平均粒度之第二鋁;或可能期望使用金屬與無機填料之組合,諸如鋁與氧化鋁填料、氧化鋅填料之組合。使用具有較大平均粒度之第一填料及與第一填料相比具有較小平均粒度之第二填料可改良填充效率,可降低黏度且可增強熱傳遞。
導熱填料亦可包括填料處理劑。填料處理劑之量可視包括導熱填料之類型及量的各種因素而變化。填料可經填料處理劑當場處理或在與樹脂組合以製造複合物之前預處理。
填料處理劑可為矽烷,諸如烷氧基矽烷、烷氧基官能性寡聚矽氧烷、環狀聚有機矽氧烷、羥基官能性寡聚矽氧烷,諸如二甲基矽氧烷或甲基苯基矽氧烷,硬脂酸酯或脂肪酸。烷氧基矽烷填料處理劑已知且包括己基三甲氧基矽烷、辛基三乙氧基矽烷、癸基三甲氧基矽烷、十二烷基三甲氧基矽烷、十四烷基三甲氧基矽烷、苯基三甲氧基矽烷、苯基乙基三甲氧基矽烷、十八烷基三甲氧基矽烷、十八烷基三乙氧基矽烷及其組合。
導熱填料應以樹脂總量之約0.01至約20重量當量,諸如0.5至10重量當量之量使用。
除導熱填料之外,可添加其他填料以實現某些所需結果,諸如電磁干擾或微波吸收劑、導電填料及磁性粒子以及可影響流變改質之煙霧狀二氧化矽及針對熱膨脹係數減小之熔融二氧化矽。
另外,可添加大量其他添加劑,諸如顏料、塑化劑、加工助劑、阻燃劑、增效劑、抗氧化劑、流變改質劑、黏著促進劑。代表性黏著促進劑包括具有如烯基、(甲基)丙烯酸酯基及環氧基之額外反應性官能基之烷氧基矽烷基化合物。黏著促進劑之實例為
苯乙烯基乙基三甲氧基矽烷
辛烯基三甲氧基矽烷
丙烯酸3-(三甲氧基矽烷基)丙酯
甲基丙烯酸3-(三甲氧基矽烷基)丙酯
3-縮水甘油基氧基丙基三甲氧基矽烷。
按總樹脂混合物計,黏著促進劑可以約0.0001至約0.05重量當量(0.01-5重量%)之量使用。
當將本發明組合物安置於所需基板上時,溶劑應能夠溶解樹脂混合物,維持在基板上提供實質上均勻厚之塗層的實質上均相之組合物,且能夠在低於約140℃之溫度下蒸發而不導致組合物膠凝。以此方式,可在待黏結或層壓之基板上實現良好黏著力。
在另一態樣中,本發明提供一種物質之組合物,其包括:
(a)具有兩個選自馬來醯亞胺、納迪醯亞胺或衣康醯亞胺之官能基的第一化合物;及
(b)經醚及烯丙基官能化之芳族化合物,其中該芳族化合物具有兩個醚官能基及兩個烯丙基。
上文描述該第一化合物及經醚及烯丙基官能化之芳族化合物。儘管如此,在本發明之物質組合物中,該(a)之第一化合物可為
且該(b)之經醚及烯丙基官能化之芳族化合物可為。
在該物質之組合物中,該(a)之第一化合物包含該第一化合物(a)(i)與該經一或多個醚及一或多個烯丙基官能化之芳族化合物(a)(ii)的莫耳比為約1:10至約10:1,諸如約1:5至約5:1,期望地約1:2至約2:1。
在又一態樣中,本發明組合物可包括該(a)之樹脂的另一化合物。亦即,除(i)具有選自馬來醯亞胺、納迪醯亞胺或衣康醯亞胺之一或多個官能基之第一化合物;(ii)具有選自馬來醯亞胺、納迪醯亞胺或衣康醯亞胺之一或多個官能基之第二化合物,其中該第二化合物不同於該第一化合物;及(iii)經烯丙基官能化之酚化合物以外,該(a)之樹脂可包括乙炔基芳基化合物。
或除(i)具有選自馬來醯亞胺、納迪醯亞胺或衣康醯亞胺之一或多個官能基之第一化合物;及(ii)經一或多個醚基及一或多個烯丙基官能化之芳族化合物以外,該(a)之樹脂可包括乙炔基芳基化合物。
乙炔基芳基化合物可由以下表示:
其中Ar為芳環或芳環系統殘基,且l係選自1至約10範圍內之整數,諸如約2。
乙炔基芳基化合物之實例包括 。
本發明組合物可藉由以任何次序將構成樹脂(a)、導熱填料(b)及溶劑(c)之化合物混合在一起製備。應將此等組分在足以使導熱填料在溶劑中分散於樹脂溶液中之溫度下混合在一起持續一段足以分散的時間。一旦混合完成,可將組合物施用至基板表面上。可使溶劑在室溫下蒸發,或可在真空下或在適當高溫下或在兩者下經由活性蒸發措施驅除溶劑,以在基板表面上得到樹脂及導熱填料之B階段薄膜。
當將組合物施用至基層以便與電路形成組合時,應加熱呈薄膜形式之組合物以使樹脂反應且形成本發明薄膜之反應產物。在此類組態中,可形成包括(a)電路;(b)本發明組合物之反應產物;及(c)基層之組合。電路可通常由銅構成。且基層通常由金屬(諸如鋁或銅)構成。
參考以下實例部分可甚至更多地瞭解本發明。實例 實例 1 :
使用下表1中所列之組分以所指出之量製備在本發明範疇內之組合物(樣品A)。表 1
組分 | 份 |
4,4'-雙馬來醯亞胺二苯基甲烷 | 3.46 |
2,4-雙馬來醯亞胺甲苯 | 1.90 |
o,o'-二烯丙基雙酚A | 3.94 |
聚醯亞胺-矽氧烷共聚物(STM1700) | 0.62 |
環氧矽烷黏著促進劑(Araldite DY 1158) | 0.08 |
氧化鋁 | 74.82 |
環己酮 | 15.17 |
使用300微米間隙將樣品A塗佈於銅箔(來自Circuit Foil Trading, Inc.之TW-YE)上,在120℃之溫度下乾燥約2小時之時段。在215℃之溫度下將經樣品A塗佈之箔在約1000 psi (6.89 MPa)之壓力下層壓至鍍錫銅(經烯基矽烷預處理)持續約3小時之時段。在一系列溫度下評估如此形成之層壓物之剝離強度且記錄於下表2中。表 2
溫度 ( ℃ ) | 剝離強度 (N/mm) |
35 | 1.23 |
50 | 1.14 |
75 | 1.08 |
100 | 1.05 |
125 | 1.00 |
150 | 1.00 |
175 | 0.93 |
200 | 0.89 |
225 | 0.86 |
250 | 0.81 |
300 | 0.53 |
期望超過0.88 N/mm之剝離強度。如表2中所示,樣品A至少在高達200℃之溫度下實現此水準之剝離強度。實例 2 :
將樣品A施用至兩個其他銅箔且層壓至未經處理之銅底板。在各者中,所有均展現在室溫下之足夠剝離強度,如下表3中所示。
表 3 實例 3 :
銅箔 | 剝離強度 (N/mm) | 失效模式 |
TWLS | 1.26 | 黏著至箔失效 |
BF-TZA | 1.31 | 部分黏著至銅板失效 |
TW-YE | 1.09 | 黏著至箔失效 |
在各種溫度下乾燥樣品A持續75分鐘之時段,隨後在與上文實例1中所描述相同的條件下層壓。所觀測到之各種乾燥溫度及剝離強度記錄於下表4中。在150℃之溫度之乾燥/溶劑移除條件下黏著力在75分鐘時完全損失指示固化反應發生,其為不合需要的。表 4
實例 4 :
乾燥溫度 ( ℃) | 剝離強度 (N/mm) |
120 | 1.09 |
130 | 1.12 |
140 | 1.12 |
150 | 0 |
經由將環戊酮用作樣品B中之溶劑作為環己酮之替代物重複實例1。在製備之後,使用300微米間隙將樣品B塗佈於銅箔TW-YE上,且隨後在120℃之溫度下乾燥2小時之時段。在約1000 psi (6.89 MPa)之壓力下將經樣品B塗佈之箔A層壓至215℃溫度的鍍錫銅(表面上未經矽烷處理)持續約3小時之時段。評估如此形成之層壓物之剝離強度為1.09 N/mm。實例 5 :
在與實例4相同之條件下製備含有二甲基甲醯胺或二甲基乙醯胺作為溶劑之調配物,其中組分列舉於下表5中。表 5
組分 | 份 |
4,4'-雙馬來醯亞胺二苯基甲烷 | 3.46 |
2,4-雙馬來醯亞胺甲苯 | 1.90 |
o,o'-二烯丙基雙酚A | 3.94 |
環氧矽烷黏著促進劑 (Araldite DY 1158) | 0.08 |
氧化鋁 | 74.82 |
溶劑 | 15.17 |
如上施用至銅箔TW-YE及層壓之後,觀測到具有所指出之溶劑的調配物在室溫下的剝離強度分別為1.40 N/mm及0.98 N/mm。兩種樣品均提供足夠黏著力且證明此等為適合溶劑。 實例 6 :
為評估熱穩定性,量測固化樣品之熱重量指數(TGI)。TGI係基於在空氣中使用熱重量分析器(TGA)之國家電器製造商協會(National Electrical Manufacturer's Association)測試方法RE-1。出於內部比較目的,TGI經定義為:TGI=0.35 T20
+ 0.07 T50
,其中T20
=發生20%重量損失之溫度且T50
=發生50%重量損失之溫度。
TGI為針對特定材料在產品使用期限內之最大使用溫度之指示。目標TGI超過200℃。發現樣品A具有211℃之TGI指數。實例 7 :
使用下表6中所列之組分以所指出之量製備在本發明範疇內之組合物(樣品C)。表 6
組分 | 份 |
二烯丙基雙酚A二縮水甘油醚 | 1.65 |
2,2-雙[4-(4-馬來醯亞胺苯氧基)苯基]丙烷 | 2.76 |
環氧矽烷黏著促進劑 (Araldite DY 1158) | 0.04 |
氧化鋁 | 36 |
環己酮 | 6.2 |
使用300微米間隙將樣品C塗佈於銅箔TW-YW上,在120℃之溫度下乾燥約2小時之時段。在約1000 psi (6.89 MPa)之壓力下將經樣品C塗佈之箔A層壓至215℃溫度的鍍錫銅(未經矽烷表面處理)上持續約3小時之時段。在室溫下評估如此形成之層壓物之剝離強度且測定為1.70 N/mm。實例 8 :
使用下表7中所列之組分以所指出之量製備本發明範疇內之數種組合物(樣品D-H)。將樣品中之各者溶解於丙二醇單醚醋酸酯(「PGMEA」)中。表 7
組份 | 樣品 / Amt ( 公克 ) | ||||
D | E | F | G | H | |
二烯丙基雙酚A二縮水甘油醚 | 1.54 | 1.54 | 1.46 | 1.38 | 1.38 |
2,2-雙[4-(4-馬來醯亞胺苯氧基)苯基]丙烷 | 5.7 | 5.7 | 5.7 | 5.7 | 5.7 |
1,3-二乙炔基苯 | -- | 0.08 | 0.08 | 0.08 | 0.16 |
將樣品各自施用至基板且暴露於120℃之溫度下約2小時之時段,其後蒸發溶劑。藉由暴露於250℃之溫度下約2小時之時段來使組合物固化。針對各樣品測定TGI且記錄於如下表8中。表 8
樣品 | TGI |
D | 218 |
E | 225 |
F | 225 |
G | 227 |
H | 223 |
將乙炔基芳基化合物添加至樣品中將TGI改良5℃或更高,即使在低量下亦如此。
Claims (31)
- 一種組合物,其包含:(a)樹脂,其包含:(i)具有一或多個選自馬來醯亞胺、納迪醯亞胺或衣康醯亞胺之官能基的第一化合物;(ii)具有一或多個選自馬來醯亞胺、納迪醯亞胺或衣康醯亞胺之官能基的第二化合物,該第二化合物不同於該第一化合物;(iii)經烯丙基官能化之酚化合物;及(iv)乙炔基芳基化合物;(b)呈總樹脂之約0.01至約20重量當量之量的導熱填料;及(c)選自環烷酮、二烷基甲醯胺、二烷基乙醯胺及其組合之溶劑。
- 一種組合物,其包含:(a)樹脂,其包含:(i)具有一或多個選自馬來醯亞胺、納迪醯亞胺或衣康醯亞胺之官能基的第一化合物;(ii)經一或多個醚基及一或多個烯丙基官能化之芳族化合物;及(iii)乙炔基芳基化合物;(b)呈總樹脂之約0.01至約20重量當量之量的導熱填料;及(c)選自環烷酮、二烷基甲醯胺、二烷基乙醯胺及其組合之溶劑。
- 如請求項1之組合物,其中該(a)之樹脂包含:(i)具有兩個選自馬來醯亞胺、納迪醯亞胺或衣康醯亞胺之官能基的第一化合物; (ii)具有兩個選自馬來醯亞胺、納迪醯亞胺或衣康醯亞胺之官能基的第二化合物,該第二化合物不同於該第一化合物;及(iii)經二烯丙基官能化之酚化合物,其中該酚化合物具有兩個羥基。
- 如請求項2之組合物,其中該(a)之樹脂包含:(i)具有兩個選自馬來醯亞胺、納迪醯亞胺或衣康醯亞胺之官能基的第一化合物;及(ii)經兩個醚基及兩個烯丙基官能化之芳族化合物。
- 如請求項1之組合物,其中該(a)之樹脂包含該第一化合物(a)(i)及該第二化合物(a)(ii)與該經烯丙基官能化之酚化合物(a)(iii)的莫耳比為約1:10至約10:1。
- 如請求項2之組合物,其中該(a)之樹脂包含該第一化合物 (a)(i)與該經一或多個醚基及一或多個烯丙基官能化之芳族化合物(a)(ii)的莫耳比為約1:10至約10:1。
- 如請求項2之組合物,其中該(a)之樹脂包含該第一化合物(a)(i)與該經一或多個醚基及一或多個烯丙基官能化之芳族化合物(a)(ii)的莫耳比為約1:2至約2:1。
- 如請求項1之組合物,其中該(c)之溶劑具有在1大氣壓下低於或等於約165℃之沸點。
- 如請求項2之組合物,其中該(c)之溶劑具有在1大氣壓下低於或等於約165℃之沸點。
- 如請求項1之組合物,其中該(c)之溶劑選自由環戊酮、環己酮及其組合組成之群。
- 如請求項2之組合物,其中該(c)之溶劑選自由環戊酮、環己酮及其組合組成之群。
- 如請求項1之組合物,其中按總組合物計,該(c)之溶劑以約10至約90重量%之量存在。
- 如請求項2之組合物,其中按總組合物計,該(c)之溶劑以約10至約90重量%之量存在。
- 一種物質之組合物,其包含:(a)具有兩個選自馬來醯亞胺、納迪醯亞胺或衣康醯亞胺之官能基的第一化合物;(b)經醚基及烯丙基官能化之芳族化合物,其中該芳族化合物具有兩個醚官能基及兩個烯丙基;及(c)乙炔基芳基化合物。
- 如請求項20之物質之組合物,其中該第一化合物(a)與該經醚基及烯丙基官能化之芳族化合物(b)的莫耳比為約1:10至約10:1。
- 一種組合,其包含:(a)電路;(b)如請求項1之組合物之反應產物;及(c)基層。
- 一種組合,其包含:(a)電路;(b)如請求項2之組合物之反應產物;及(c)基層。
- 如請求項24之組合,其中該電路由銅構成。
- 如請求項25之組合,其中該電路由銅構成。
- 如請求項24之組合,其中該基層由金屬構成。
- 如請求項25之組合,其中該基層由金屬構成。
- 如請求項24之組合,其中該基層由鋁或銅構成。
- 如請求項25之組合,其中該基層由鋁或銅構成。
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US4806419A (en) * | 1983-11-04 | 1989-02-21 | The Boots Company Plc | Bisimide/polyhydantoin curable resins |
JPH07206991A (ja) * | 1994-01-21 | 1995-08-08 | Maruzen Petrochem Co Ltd | 熱硬化性樹脂組成物 |
US20010020071A1 (en) * | 1997-10-10 | 2001-09-06 | Capote Miguel Albert | High performance cyanate-bismaleimide-epoxy resin compositions for printed circuits and encapsulants |
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JP3444199B2 (ja) | 1998-06-17 | 2003-09-08 | 信越化学工業株式会社 | 熱伝導性シリコーンゴム組成物及びその製造方法 |
KR101164671B1 (ko) * | 2002-06-17 | 2012-07-11 | 헨켈 코포레이션 | 층간 절연 물질 및 미리 도포되는 다이 부착 접착제 물질 |
US8373283B2 (en) * | 2008-08-04 | 2013-02-12 | Hitachi Chemical Company, Ltd. | Adhesive composition, film-like adhesive, adhesive sheet and semiconductor device |
JP5685533B2 (ja) * | 2008-08-08 | 2015-03-18 | ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング | 低温硬化組成物 |
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US4806419A (en) * | 1983-11-04 | 1989-02-21 | The Boots Company Plc | Bisimide/polyhydantoin curable resins |
JPH07206991A (ja) * | 1994-01-21 | 1995-08-08 | Maruzen Petrochem Co Ltd | 熱硬化性樹脂組成物 |
US20010020071A1 (en) * | 1997-10-10 | 2001-09-06 | Capote Miguel Albert | High performance cyanate-bismaleimide-epoxy resin compositions for printed circuits and encapsulants |
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KR102679622B1 (ko) | 2024-07-01 |
DE112019006442T5 (de) | 2021-09-09 |
CN113891905A (zh) | 2022-01-04 |
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KR20210149030A (ko) | 2021-12-08 |
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