CN113891905A - 耐高温传导性热固型树脂组合物 - Google Patents
耐高温传导性热固型树脂组合物 Download PDFInfo
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Abstract
本发明提供耐高温传导性热固型树脂组合物。
Description
技术领域
本发明提供耐高温传导性热固型树脂组合物。
背景技术
固化之后具有高温稳定性的树脂为多种商业应用所需。例如,静电储存能量的介电材料普遍存在于先进电子及电功率系统中。与其陶瓷对应物相比,聚合物介电质具有较高击穿强度及较大可靠性,其为可缩放的、轻质的且可经成形为错综复杂的组态。因此,其为许多功率电子、功率调节及脉冲功率应用的理想选择。然而,聚合物介电质时常在使用中受限于相对较低操作温度。因此,其在存在于诸如混合及电动车辆、航天功率电子及地下油及气体勘探的应用中的极端条件下未能满足对电力的上升需求。[参见例如Qi Li等人,Flexible high-temperature dielectric materials from polymer nanocomposites,Nature,第523卷,576(2015)。]
在经金属包覆的印刷电路板(「PCB」)应用中,介电层为包夹于印刷电路箔与金属底板之间的导热复合物。填充有导热填料的现有或高温环氧树脂用于许多包括某些大功率LED照明市场的当前应用。
归因于电子及电功率系统的最新发展,经金属包覆的PCB的操作温度已增加。该温度增加可能引起在单板上的各种应用中所使用的现有树脂的降解。例如,聚合物介电复合物以及灌注化合物用于绝缘栅双极晶体管(「IGBT」)功率模块中。此等模块充当用于马达的变速驱动器的功率转换器、不间断的功率供应器及更多的切换元件。IGBT功率模块将高速切换效能与高电压/电流操作能力组合。
在一个最近IGBT功率模块设计中,介电层置放于0.5mm厚的铜箔与铜底板之间,产生绝缘金属底板结构。[参见例如K.Ohara等人,「A New IGBT Module with InsulatedMetal Baseplate(IMB)and 7th Generation Chips」,PCIM Europe 2015,Nuremberg,Germany(2015年5月19-21日)。]此外,在操作中,若操作电压/电流在未来增加时介电层需要经受住高温。但随着树脂在较高使用温度下降解,此等功率模块随时间推移可能不恰当地起作用,从而导致故障。明显地,那并非所需结果。
另外,现有高温聚合树脂通常不适合用于制造经金属包覆的PCB介电层。
例如,热塑性聚酰亚胺为熟知高温介电聚合物。然而,完全酰亚胺化的聚酰亚胺通常在除侵袭性极性非质子溶剂外的多种溶剂中具有不佳溶解性。为使用填充有导热填料的聚酰亚胺来制造介电层,需要在层压步骤之前移除所选择的溶剂。否则,残余溶剂可导致气泡/缺陷形成。
制造许多具有粗糙表面的铜箔以改良与如介电层的基板的黏着力,进一步使事情复杂化。在较高玻璃转移温度及较高熔融黏度的情况下使用诸如聚酰亚胺的聚合树脂可导致铜表面的粗糙地形的不佳渗透及湿透。此可不利地影响黏着力。
因此存在对热固型树脂的巨大且长期而未满足的需求,该等热固型树脂可耐受高于180℃或甚至200℃的高温,从而允许在经金属包覆的印刷电路板应用或具有相当需求效能的类似应用中或在使用环境中的不间断功能。
发明内容
迄今为止彼需求仍未满足。
本发明通过提供本发明组合物满足彼需求,其在一个方式中包括:
(a)树脂,其包含:
(i)具有一或多个选自马来酰亚胺(maleimide)、纳迪酰亚胺(nadimide)或衣康酰亚胺(itaconimide)的官能基的第一化合物;
(ii)具有一或多个选自马来酰亚胺、纳迪酰亚胺或衣康酰亚胺的官能基的第二化合物,其中该第二化合物不同于该第一化合物;及
(iii)经烯丙基官能化的酚化合物;
(b)呈总树脂的约0.01至约20重量当量的量的导热填料;及
(c)选自环烷酮、二烷基甲酰胺、二烷基乙酰胺及其组合的溶剂。
在另一方式中,本发明组合物包括:
(a)树脂,其包含:
(i)具有一或多个选自马来酰亚胺、纳迪酰亚胺或衣康酰亚胺的官能基的第一化合物;及
(ii)经一或多个醚基及一或多个烯丙基官能化的芳族化合物;
(b)呈总树脂的约0.01至约20重量当量的量的导热填料;及
(c)选自环烷酮、二烷基甲酰胺、二烷基乙酰胺及其组合的溶剂。
具体实施方式
如上所指出,在一个方式中本发明组合物包括:
(a)树脂,其包含:
(i)具有一或多个选自马来酰亚胺、纳迪酰亚胺或衣康酰亚胺的官能基的第一化合物;
(ii)具有一或多个选自马来酰亚胺、纳迪酰亚胺或衣康酰亚胺的官能基的第二化合物,其中该第二化合物不同于该第一化合物;及
(iii)经烯丙基官能化的酚化合物;
(b)呈总树脂的约0.01至约20重量当量的量的导热填料;及
(c)选自环烷酮、二烷基甲酰胺、二烷基乙酰胺及其组合的溶剂。
该(a)的树脂包含:
(i)具有两个选自马来酰亚胺、纳迪酰亚胺或衣康酰亚胺的官能基的第一化合物;
(ii)具有两个选自马来酰亚胺、纳迪酰亚胺或衣康酰亚胺的官能基的第二化合物,该第二化合物不同于该第一化合物;及
(iii)经二烯丙基官能化的酚化合物。除两个烯丙基以外,该酚化合物亦具有两个羟基。
在所需实施例中,该(a)的树脂包括:
该(a)的树脂可包括该第一化合物(a)(i)及该第二化合物(a)(ii)与该经烯丙基官能化的酚化合物(a)(iii)的摩尔比为约1:10至约10:1,诸如约1:5至约5:1,期望地约1:2至约2:1。
该(c)的溶剂可选自环烷酮、二烷基甲酰胺及二烷基乙酰胺。例如,无论单独或组合,环戊酮及环己酮为所期望环烷酮;二甲基甲酰胺为所期望二烷基甲酰胺;且二甲基乙酰胺为所期望二烷基乙酰胺。此等溶剂的组合亦可为适合的。
按总组合物计,该(c)的溶剂应以约10至约90重量%的量存在。
该(c)的溶剂在1大气压下具有小于或等于约165℃的沸点。在一些实施例中,溶剂的沸点在1大气压下可小于或等于160℃,期望地为150℃,诸如145℃。
且如上文所指出,在另一方式中本发明组合物包括:
(a)树脂,其包含:
(i)具有一或多个选自马来酰亚胺、纳迪酰亚胺或衣康酰亚胺的官能基的第一化合物;及
(ii)经一或多个醚基及一或多个烯丙基官能化的芳族化合物;
(b)呈总树脂的约0.01至约20重量当量的量的导热填料;及
(c)选自环烷酮、二烷基甲酰胺、二烷基乙酰胺及其组合的溶剂。
此处,该(a)的树脂包含:
(i)具有两个选自马来酰亚胺、纳迪酰亚胺或衣康酰亚胺的官能基的第一化合物;及
(ii)经两个醚基及两个烯丙基官能化的芳族化合物。
在一个实施例中,该(a)的树脂包含:
该(a)的树脂可包含该第一化合物(a)(i)与该经一或多个醚基及一或多个烯丙基官能化的芳族化合物(a)(ii)的摩尔比为约1:10至约10:1,诸如约1:5至约5:1,期望地约1:2至约2:1。
此处该(c)的溶剂为与上文所描述相同的溶剂。因此,为简洁起见,此处未再次描述。
该经一或多个醚基及一或多个烯丙基官能化的芳族化合物可由以下通用结构涵盖:
其中R为选自氧杂环丁烷基、缩水甘油基或C1-4烷基或C6-10芳基的基团;Ar为芳环或芳环系统残基;X为直接键或氧;且m及n独立地选自1至约10范围内的整数。
该经一或多个醚基及一或多个烯丙基官能化的芳族化合物的实例包括但不限于
该经一或多个醚基及一或多个烯丙基官能化的芳族化合物的醚基可为环氧醚或氧杂环丁烷醚。经一或多个环氧醚基或氧杂环丁烷醚基及一或多个烯丙基官能化的芳族化合物的实例包括但不限于
对于本领域技术人员而言,可使用诸如巴豆基、γ-甲基巴豆基或2-戊烯基的经取代的烯丙基代替上文所描述的烯丙基。
导热填料可选自此项技术中已知的多种材料,且其中许多可经商购。参见例如美国专利第6,169,142号(第4栏,第7-33行)。导热填料可为导热且导电的。替代地,导热填料可为导热且电绝缘的。导热填料的种类包括金属填料、无机填料、基于碳的填料、导热聚合物粒子填料或其组合。
金属填料包括金属的粒子及在粒子的表面上具有层的金属的粒子。此等层可为例如在粒子的表面上的金属氮化物层或金属氧化物层。适合的金属填料由选自铝、铜、金、镍、银及其组合的金属的粒子例示。适合的金属填料由在表面上具有选自氮化铝、氧化铝、氧化铜、氧化镍、氧化银及其组合的层的上文所列金属的粒子进一步例示。例如,金属填料可包含在表面上具有氧化铝层的铝粒子。
无机填料由诸如氧化铝、氧化铍、氧化镁及氧化锌的金属氧化物;诸如氮化铝及氮化硼的氮化物;诸如碳化硅及碳化钨的碳化物;及其组合例示。其他实例包括三水合铝、二氧化硅、钛酸钡及氢氧化镁。
基于碳的填料包括碳纤维、钻石、石墨。诸如一维纳米碳管及二维石墨烯及石墨纳米片的碳纳米结构材料由于其固有高导热性可用于组合物中。
导热聚合物填料的实例包括定向聚乙烯纤维及纳米纤维素、诸如彼等描述于V.Singh等人,「High thermal conductivity of chain-oriented amorphouspolythiophene」,Nature Nanotechnology,第9卷,384(2014)中的聚噻吩,以及诸如彼等描述于S.Yoshihara等人,「Main-chain smectic liquid crystalline polymer exhibitingunusually high thermal conductivity in an isotropic composite」,J.Appl.Polym.Sci.,第131卷,39896(2014)中的液晶聚合物。
导热填料可为任何形状。当需要较高负载量时,圆形或球形粒子可将黏度降至最低。导热填料可为单一导热填料或至少一种特性(诸如粒子形状、平均粒度、粒度分布及填料类型)不同的两种或更多种导热填料的组合。例如,可能期望使用无机填料(诸如具有较大平均粒度的第一氧化铝与具有较小平均粒度的第二氧化铝)的组合。替代地,可能期望例如使用具有较大平均粒度的氧化铝与具有较小平均粒度的氧化锌的组合;或可能期望使用金属填料的组合,诸如具有较大平均粒度的第一铝与具有较小平均粒度的第二铝;或可能期望使用金属与无机填料的组合,诸如铝与氧化铝填料、氧化锌填料的组合。使用具有较大平均粒度的第一填料及与第一填料相比具有较小平均粒度的第二填料可改良填充效率,可降低黏度且可增强热传递。
导热填料亦可包括填料处理剂。填料处理剂的量可视包括导热填料的类型及量的各种因素而变化。填料可经填料处理剂当场处理或在与树脂组合以制造复合物之前预处理。
填料处理剂可为硅烷,诸如烷氧基硅烷、烷氧基官能性寡聚硅氧烷、环状聚有机硅氧烷、羟基官能性寡聚硅氧烷,诸如二甲基硅氧烷或甲基苯基硅氧烷,硬脂酸酯或脂肪酸。烷氧基硅烷填料处理剂已知且包括己基三甲氧基硅烷、辛基三乙氧基硅烷、癸基三甲氧基硅烷、十二烷基三甲氧基硅烷、十四烷基三甲氧基硅烷、苯基三甲氧基硅烷、苯基乙基三甲氧基硅烷、十八烷基三甲氧基硅烷、十八烷基三乙氧基硅烷及其组合。
导热填料应以树脂总量的约0.01至约20重量当量,诸如0.5至10重量当量的量使用。
除导热填料之外,可添加其他填料以实现某些所需结果,诸如电磁干扰或微波吸收剂、导电填料及磁性粒子以及可影响流变改质的烟雾状二氧化硅及针对热膨胀系数减小的熔融二氧化硅。
另外,可添加大量其他添加剂,诸如颜料、塑化剂、加工助剂、阻燃剂、增效剂、抗氧化剂、流变改质剂、黏着促进剂。代表性黏着促进剂包括具有如烯基、(甲基)丙烯酸酯基及环氧基的额外反应性官能基的烷氧基硅烷基化合物。黏着促进剂的实例为:
丙烯酸3-(三甲氧基硅烷基)丙酯、
甲基丙烯酸3-(三甲氧基硅烷基)丙酯及
3-缩水甘油基氧基丙基三甲氧基硅烷。
按总树脂混合物计,黏着促进剂可以约0.0001至约0.05重量当量(0.01-5重量%)的量使用。
当将本发明组合物安置于所需基板上时,溶剂应能够溶解树脂混合物,维持在基板上提供实质上均匀厚的涂层的实质上均相的组合物,且能够在低于约140℃的温度下蒸发而不导致组合物胶凝。以此方式,可在待黏结或层压的基板上实现良好黏着力。
在另一方式中,本发明提供一种物质的组合物,其包括:
(a)具有两个选自马来酰亚胺、纳迪酰亚胺或衣康酰亚胺的官能基的第一化合物;及
(b)经醚及烯丙基官能化的芳族化合物,其中该芳族化合物具有两个醚官能基及两个烯丙基。
上文描述该第一化合物及经醚及烯丙基官能化的芳族化合物。尽管如此,在本发明的物质组合物中,该(a)的第一化合物可为
且该(b)的经醚及烯丙基官能化的芳族化合物可为
在该物质的组合物中,该(a)的第一化合物包含该第一化合物(a)(i)与该经一或多个醚及一或多个烯丙基官能化的芳族化合物(a)(ii)的摩尔比为约1:10至约10:1,诸如约1:5至约5:1,期望地约1:2至约2:1。
在又一方式中,本发明组合物可包括该(a)的树脂的另一化合物。亦即,除(i)具有选自马来酰亚胺、纳迪酰亚胺或衣康酰亚胺的一或多个官能基的第一化合物;(ii)具有选自马来酰亚胺、纳迪酰亚胺或衣康酰亚胺的一或多个官能基的第二化合物,其中该第二化合物不同于该第一化合物;及(iii)经烯丙基官能化的酚化合物以外,该(a)的树脂可包括乙炔基芳基化合物。
或除(i)具有选自马来酰亚胺、纳迪酰亚胺或衣康酰亚胺的一或多个官能基的第一化合物;及(ii)经一或多个醚基及一或多个烯丙基官能化的芳族化合物以外,该(a)的树脂可包括乙炔基芳基化合物。
乙炔基芳基化合物可由以下表示:
其中Ar为芳环或芳环系统残基,且l选自1至约10范围内的整数,诸如约2。
乙炔基芳基化合物的实例包括:
本发明组合物可通过以任何次序将构成树脂(a)、导热填料(b)及溶剂(c)的化合物混合在一起制备。应将此等组分在足以使导热填料在溶剂中分散于树脂溶液中的温度下混合在一起持续一段足以分散的时间。一旦混合完成,可将组合物施用至基板表面上。可使溶剂在室温下蒸发,或可在真空下或在适当高温下或在两者下经由活性蒸发措施驱除溶剂,以在基板表面上得到树脂及导热填料的B阶段薄膜。
当将组合物施用至基层以便与电路形成组合时,应加热呈薄膜形式的组合物以使树脂反应且形成本发明薄膜的反应产物。在此类组态中,可形成包括(a)电路;(b)本发明组合物的反应产物;及(c)基层的组合。电路可通常由铜构成。且基层通常由金属(诸如铝或铜)构成。
参考以下实例部分可甚至更多地了解本发明。
实例
实例1:
使用下表1中所列的组分以所指出的量制备在本发明范畴内的组合物(样品A)。
表1
组分 | 份 |
4,4'-双马来酰亚胺二苯基甲烷 | 3.46 |
2,4-双马来酰亚胺甲苯 | 1.90 |
o,o'-二烯丙基双酚A | 3.94 |
聚酰亚胺-硅氧烷共聚物(STM1700) | 0.62 |
环氧硅烷黏着促进剂(Araldite DY 1158) | 0.08 |
氧化铝 | 74.82 |
环己酮 | 15.17 |
使用300微米间隙将样品A涂布于铜箔(来自Circuit Foil Trading,Inc.的TW-YE)上,在120℃的温度下干燥约2小时的时段。在215℃的温度下将经样品A涂布的箔在约1000psi(6.89MPa)的压力下层压至镀锡铜(经烯基硅烷预处理)持续约3小时的时段。在一系列温度下评估如此形成的层压物的剥离强度且记录于下表2中。
表2
期望超过0.88N/mm的剥离强度。如表2中所示,样品A至少在高达200℃的温度下实现此水准的剥离强度。
实例2:
将样品A施用至两个其他铜箔且层压至未经处理的铜底板。在各者中,所有均展现在室温下的足够剥离强度,如下表3中所示。
表3
铜箔 | 剥离强度(N/mm) | 失效模式 |
TWLS | 1.26 | 黏着至箔失效 |
BF-TZA | 1.31 | 部分黏着至铜板失效 |
TW-YE | 1.09 | 黏着至箔失效 |
实例3:
在各种温度下干燥样品A持续75分钟的时段,随后在与上文实例1中所描述相同的条件下层压。所观测到的各种干燥温度及剥离强度记录于下表4中。在150℃的温度的干燥/溶剂移除条件下黏着力在75分钟时完全损失指示固化反应发生,其为不合需要的。
表4
实例4:
经由将环戊酮用作样品B中的溶剂作为环己酮的替代物重复实例1。在制备之后,使用300微米间隙将样品B涂布于铜箔TW-YE上,且随后在120℃的温度下干燥2小时的时段。在约1000psi(6.89MPa)的压力下将经样品B涂布的箔A层压至215℃温度的镀锡铜(表面上未经硅烷处理)持续约3小时的时段。评估如此形成的层压物的剥离强度为1.09N/mm。
实例5:
在与实例4相同的条件下制备含有二甲基甲酰胺或二甲基乙酰胺作为溶剂的调配物,其中组分列举于下表5中。
表5
如上施用至铜箔TW-YE及层压之后,观测到具有所指出的溶剂的调配物在室温下的剥离强度分别为1.40N/mm及0.98N/mm。两种样品均提供足够黏着力且证明此等为适合溶剂。
实例6:
为评估热稳定性,量测固化样品的热重量指数(TGI)。TGI是基于在空气中使用热重量分析器(TGA)的国家电器制造商协会(National Electrical Manufacturer'sAssociation)测试方法RE-1。出于内部比较目的,TGI经定义为:TGI=0.35T20+0.07T50,其中T20=发生20%重量损失的温度且T50=发生50%重量损失的温度。
TGI为针对特定材料在产品使用期限内的最大使用温度的指示。目标TGI超过200℃。发现样品A具有211℃的TGI指数。
实例7:
使用下表6中所列的组分以所指出的量制备在本发明范畴内的组合物(样品C)。
表6
使用300微米间隙将样品C涂布于铜箔TW-YW上,在120℃的温度下干燥约2小时的时段。在约1000psi(6.89MPa)的压力下将经样品C涂布的箔A层压至215℃温度的镀锡铜(未经硅烷表面处理)上持续约3小时的时段。在室温下评估如此形成的层压物的剥离强度且测定为1.70N/mm。
实例8:
使用下表7中所列的组分以所指出的量制备本发明范畴内的数种组合物(样品D-H)。将样品中的各者溶解于丙二醇单醚醋酸酯(「PGMEA」)中。
表7
将样品各自施用至基板且暴露于120℃的温度下约2小时的时段,其后蒸发溶剂。通过暴露于250℃的温度下约2小时的时段来使组合物固化。针对各样品测定TGI且记录于如下表8中。
表8
样品 | TGI |
D | 218 |
E | 225 |
F | 225 |
G | 227 |
H | 223 |
将乙炔基芳基化合物添加至样品中将TGI改良5℃或更高,即使在低量下亦如此。
Claims (33)
1.一种组合物,其包含:
(a)树脂,其包含:
(i)具有一或多个选自马来酰亚胺、纳迪酰亚胺或衣康酰亚胺的官能基的第一化合物;
(ii)具有一或多个选自马来酰亚胺、纳迪酰亚胺或衣康酰亚胺的官能基的第二化合物,该第二化合物不同于该第一化合物;及
(iii)经烯丙基官能化的酚化合物;
(b)呈总树脂的约0.01至约20重量当量的量的导热填料;及
(c)选自环烷酮、二烷基甲酰胺、二烷基乙酰胺及其组合的溶剂。
2.一种组合物,其包含:
(a)树脂,其包含:
(i)具有一或多个选自马来酰亚胺、纳迪酰亚胺或衣康酰亚胺的官能基的第一化合物;及
(ii)经一或多个醚基及一或多个烯丙基官能化的芳族化合物;
(b)呈总树脂的约0.01至约20重量当量的量的导热填料;及
(c)选自环烷酮、二烷基甲酰胺、二烷基乙酰胺及其组合的溶剂。
3.如权利要求1的组合物,其中该(a)的树脂包含:
(i)具有两个选自马来酰亚胺、纳迪酰亚胺或衣康酰亚胺的官能基的第一化合物;
(ii)具有两个选自马来酰亚胺、纳迪酰亚胺或衣康酰亚胺的官能基的第二化合物,该第二化合物不同于该第一化合物;及
(iii)经二烯丙基官能化的酚化合物,其中该酚化合物具有两个羟基。
4.如权利要求2的组合物,其中该(a)的树脂包含:
(i)具有两个选自马来酰亚胺、纳迪酰亚胺或衣康酰亚胺的官能基的第一化合物;及
(ii)经两个醚基及两个烯丙基官能化的芳族化合物。
6.如权利要求2的组合物,其中该(a)的树脂进一步包含乙炔基芳基化合物。
8.如权利要求2的组合物,其中该(a)的树脂进一步包含乙炔基芳基化合物。
9.如权利要求1的组合物,其中该(a)的树脂包含该第一化合物(a)(i)及该第二化合物(a)(ii)与该经烯丙基官能化的酚化合物(a)(iii)的摩尔比为约1:10至约10:1。
10.如权利要求2的组合物,其中该(a)的树脂包含该第一化合物(a)(i)与该经一或多个醚基及一或多个烯丙基官能化的芳族化合物(a)(ii)的摩尔比为约1:10至约10:1。
11.如权利要求2的组合物,其中该(a)的树脂包含该第一化合物(a)(i)与该经一或多个醚基及一或多个烯丙基官能化的芳族化合物(a)(ii)的摩尔比为约1:2至约2:1。
12.如权利要求1的组合物,其中该(c)的溶剂具有在1大气压下低于或等于约165℃的沸点。
13.如权利要求2的组合物,其中该(c)的溶剂具有在1大气压下低于或等于约165℃的沸点。
14.如权利要求1的组合物,其中该(c)的溶剂选自由环戊酮、环己酮及其组合组成的组。
15.如权利要求2的组合物,其中该(c)的溶剂选自由环戊酮、环己酮及其组合组成的组。
16.如权利要求1的组合物,其中按总组合物计,该(c)的溶剂以约10至约90重量%的量存在。
17.如权利要求2的组合物,其中按总组合物计,该(c)的溶剂以约10至约90重量%的量存在。
22.一种物质的组合物,其包含:
(a)具有两个选自马来酰亚胺、纳迪酰亚胺或衣康酰亚胺的官能基的第一化合物;及
(b)经醚基及烯丙基官能化的芳族化合物,其中该芳族化合物具有两个醚官能基及两个烯丙基。
25.如权利要求22的物质的组合物,其中该(a)的树脂包含:
该第一化合物(a)(i)与该经一或多个醚基及一或多个烯丙基官能化的芳族化合物(a)(ii)的摩尔比为约1:10至约10:1。
26.一种组合,其包含:
(a)电路;
(b)如权利要求1的组合物的反应产物;及
(c)基层。
27.一种组合,其包含:
(a)电路;
(b)如权利要求2的组合物的反应产物;及
(c)基层。
28.如权利要求26的组合,其中该电路由铜构成。
29.如权利要求27的组合,其中该电路由铜构成。
30.如权利要求26的组合,其中该基层由金属构成。
31.如权利要求27的组合,其中该基层由金属构成。
32.如权利要求26的组合,其中该基层由铝或铜构成。
33.如权利要求27的组合,其中该基层由铝或铜构成。
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US201862785940P | 2018-12-28 | 2018-12-28 | |
US62/785,940 | 2018-12-28 | ||
PCT/US2019/068880 WO2020140109A1 (en) | 2018-12-28 | 2019-12-30 | High temperature, conductive thermosetting resin compositions |
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CN113891905A true CN113891905A (zh) | 2022-01-04 |
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CN201980086780.7A Pending CN113891905A (zh) | 2018-12-28 | 2019-12-30 | 耐高温传导性热固型树脂组合物 |
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US (1) | US20220064352A1 (zh) |
KR (1) | KR20210149030A (zh) |
CN (1) | CN113891905A (zh) |
DE (1) | DE112019006442T8 (zh) |
TW (1) | TWI826625B (zh) |
WO (1) | WO2020140109A1 (zh) |
Cited By (1)
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CN115819765A (zh) * | 2022-12-27 | 2023-03-21 | 苏州生益科技有限公司 | 环氧基化合物改性马来酰亚胺预聚物、树脂组合物及树脂组合物的应用 |
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EP4310123A1 (de) | 2022-07-19 | 2024-01-24 | Siemens Aktiengesellschaft | Hochtemperaturharz, formkörper daraus und verbund aus dem formkörper und einem element eines leistungselektronischen bauteils |
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US6187416B1 (en) * | 1997-11-06 | 2001-02-13 | Mitsui Mining & Smelting Co., Ltd. | Resin composition for copper-clad laminate, resin-coated copper foil, multilayered copper-clad laminate, and multilayered printed circuit board |
US20010020071A1 (en) * | 1997-10-10 | 2001-09-06 | Capote Miguel Albert | High performance cyanate-bismaleimide-epoxy resin compositions for printed circuits and encapsulants |
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CN102149761A (zh) * | 2008-08-08 | 2011-08-10 | 汉高公司 | 低温固化的组合物 |
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JPH07206991A (ja) * | 1994-01-21 | 1995-08-08 | Maruzen Petrochem Co Ltd | 熱硬化性樹脂組成物 |
JP3444199B2 (ja) | 1998-06-17 | 2003-09-08 | 信越化学工業株式会社 | 熱伝導性シリコーンゴム組成物及びその製造方法 |
-
2019
- 2019-12-27 TW TW108148073A patent/TWI826625B/zh active
- 2019-12-30 KR KR1020217023970A patent/KR20210149030A/ko not_active Application Discontinuation
- 2019-12-30 WO PCT/US2019/068880 patent/WO2020140109A1/en active Application Filing
- 2019-12-30 US US17/418,735 patent/US20220064352A1/en active Pending
- 2019-12-30 CN CN201980086780.7A patent/CN113891905A/zh active Pending
- 2019-12-30 DE DE112019006442.8T patent/DE112019006442T8/de active Active
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US4806419A (en) * | 1983-11-04 | 1989-02-21 | The Boots Company Plc | Bisimide/polyhydantoin curable resins |
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US6187416B1 (en) * | 1997-11-06 | 2001-02-13 | Mitsui Mining & Smelting Co., Ltd. | Resin composition for copper-clad laminate, resin-coated copper foil, multilayered copper-clad laminate, and multilayered printed circuit board |
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CN102149761A (zh) * | 2008-08-08 | 2011-08-10 | 汉高公司 | 低温固化的组合物 |
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Cited By (1)
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CN115819765A (zh) * | 2022-12-27 | 2023-03-21 | 苏州生益科技有限公司 | 环氧基化合物改性马来酰亚胺预聚物、树脂组合物及树脂组合物的应用 |
Also Published As
Publication number | Publication date |
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TW202104532A (zh) | 2021-02-01 |
WO2020140109A1 (en) | 2020-07-02 |
US20220064352A1 (en) | 2022-03-03 |
DE112019006442T5 (de) | 2021-09-09 |
DE112019006442T8 (de) | 2021-10-28 |
KR20210149030A (ko) | 2021-12-08 |
TWI826625B (zh) | 2023-12-21 |
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