JP2005532678A - 層間誘電体および事前塗布ダイ取り付け用接着性材料 - Google Patents

層間誘電体および事前塗布ダイ取り付け用接着性材料 Download PDF

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JP2005532678A
JP2005532678A JP2004514137A JP2004514137A JP2005532678A JP 2005532678 A JP2005532678 A JP 2005532678A JP 2004514137 A JP2004514137 A JP 2004514137A JP 2004514137 A JP2004514137 A JP 2004514137A JP 2005532678 A JP2005532678 A JP 2005532678A
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die
adhesive material
product
die attach
chip
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JP2005532678A5 (enExample
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ベネディクト ディロース サントス、
ジェイムズ ティー． ハニク、
プウェイ リウー、
カン ヤン、
クィン ジ、
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Henkel Corp
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Henkel Corp
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Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
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JP2008177550A (ja) * 2006-12-18 2008-07-31 Nitto Denko Corp 半導体装置製造用の接着シート、及びそれを用いた半導体装置の製造方法
JP2008288571A (ja) * 2007-04-18 2008-11-27 Hitachi Chem Co Ltd 接着剤付きウエハ及びその製造方法、並びに、接着剤組成物
JP2009111340A (ja) * 2007-10-11 2009-05-21 Hitachi Chem Co Ltd 接着剤付きウエハ、接着剤組成物及び接着剤付きウエハの製造方法
JP2010020286A (ja) * 2008-06-13 2010-01-28 Henkel Corp 液晶滴下工法用シール剤および液晶表示装置の製造方法
JP2010116531A (ja) * 2008-10-15 2010-05-27 Hitachi Chem Co Ltd 接着剤組成物、接着剤層及び多段パッケージ
JP2013531889A (ja) * 2010-06-08 2013-08-08 ヘンケル コーポレイション 先ダイシング法を行う微細加工されたウェーハへの接着剤の被覆
JP2014523953A (ja) * 2011-07-28 2014-09-18 プロタヴィック コリア カンパニー リミテッド フレキシブルなビスマレイミド、ベンズオキサジン、エポキシ−無水物付加生成物複合接着剤
JP2015510003A (ja) * 2012-01-25 2015-04-02 ヘンケル ユーエス アイピー エルエルシー シアノアクリレート組成物
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