JP2005532678A5 - - Google Patents
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- Publication number
- JP2005532678A5 JP2005532678A5 JP2004514137A JP2004514137A JP2005532678A5 JP 2005532678 A5 JP2005532678 A5 JP 2005532678A5 JP 2004514137 A JP2004514137 A JP 2004514137A JP 2004514137 A JP2004514137 A JP 2004514137A JP 2005532678 A5 JP2005532678 A5 JP 2005532678A5
- Authority
- JP
- Japan
- Prior art keywords
- alkyl
- aryl
- product according
- benzoxazine component
- formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US38964202P | 2002-06-17 | 2002-06-17 | |
| PCT/US2003/019052 WO2003107427A1 (en) | 2002-06-17 | 2003-06-17 | Interlayer dielectric and pre-applied die attach adhesive materials |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005532678A JP2005532678A (ja) | 2005-10-27 |
| JP2005532678A5 true JP2005532678A5 (enExample) | 2006-08-24 |
Family
ID=29736665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004514137A Pending JP2005532678A (ja) | 2002-06-17 | 2003-06-17 | 層間誘電体および事前塗布ダイ取り付け用接着性材料 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US7312534B2 (enExample) |
| JP (1) | JP2005532678A (enExample) |
| KR (2) | KR101164671B1 (enExample) |
| CN (2) | CN100449776C (enExample) |
| AU (1) | AU2003276729A1 (enExample) |
| WO (1) | WO2003107427A1 (enExample) |
Families Citing this family (67)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU2003301550A1 (en) * | 2002-10-22 | 2004-05-13 | Henkel Corporation | Co-curable compositions |
| US7528404B2 (en) * | 2004-02-17 | 2009-05-05 | Henkel Ag & Co. Kgaa | Assembly of a semiconductor die attached to substrate with oxazoline derivative bearing an electron donor or acceptor functionality |
| KR100690960B1 (ko) * | 2004-06-24 | 2007-03-09 | 삼성전자주식회사 | 스크린 프린팅 공정을 갖는 반도체 칩 패키지 제조 방법 |
| US7816487B2 (en) * | 2004-09-30 | 2010-10-19 | Intel Corporation | Die-attach films for chip-scale packaging, packages made therewith, and methods of assembling same |
| JP4325531B2 (ja) * | 2004-10-15 | 2009-09-02 | 住友ベークライト株式会社 | 樹脂封止型半導体装置 |
| DE102005018704B4 (de) | 2005-04-21 | 2019-05-29 | Hexion GmbH | Härtbare Mischung, Verfahren zu deren Herstellung und gehärtetes Produkt |
| US20060266496A1 (en) * | 2005-05-31 | 2006-11-30 | Sensis Corporation | Method and apparatus for dissipating heat |
| WO2006138367A2 (en) * | 2005-06-17 | 2006-12-28 | Fry's Metals, Inc. | Thermoplastic/thermoset composition material and method of attaching a wafer to a substrate |
| US20080315417A1 (en) * | 2005-07-14 | 2008-12-25 | Chipmos Technologies Inc. | Chip package |
| US7456748B2 (en) * | 2005-10-20 | 2008-11-25 | National Starch And Chemical Investment Holding Corporation | RFID antenna with pre-applied adhesives |
| US7835158B2 (en) * | 2005-12-30 | 2010-11-16 | Micron Technology, Inc. | Connection verification technique |
| US8344523B2 (en) | 2006-05-08 | 2013-01-01 | Diemat, Inc. | Conductive composition |
| US20070256783A1 (en) * | 2006-05-08 | 2007-11-08 | Dietz Raymond L | Thermally enhanced adhesive paste |
| JP5422878B2 (ja) * | 2006-10-24 | 2014-02-19 | 東レ株式会社 | 半導体用接着組成物、それを用いた半導体装置および半導体装置の製造方法 |
| JP4988531B2 (ja) * | 2006-12-18 | 2012-08-01 | 日東電工株式会社 | 半導体装置製造用の接着シート、及びそれを用いた半導体装置の製造方法 |
| JP5380886B2 (ja) * | 2007-04-18 | 2014-01-08 | 日立化成株式会社 | 接着剤付きウエハ及びその製造方法 |
| US20090050266A1 (en) * | 2007-08-21 | 2009-02-26 | Kang Yang | Crosslinked polymeric materials as filler and spacers in adhesives |
| JP2009111340A (ja) * | 2007-10-11 | 2009-05-21 | Hitachi Chem Co Ltd | 接着剤付きウエハ、接着剤組成物及び接着剤付きウエハの製造方法 |
| WO2009117345A2 (en) * | 2008-03-17 | 2009-09-24 | Henkel Corporation | Adhesive compositions for use in die attach applications |
| US20090236757A1 (en) * | 2008-03-24 | 2009-09-24 | Infineon Technologies Ag | Semiconductor device and method for manufacturing |
| US7851930B1 (en) * | 2008-06-04 | 2010-12-14 | Henkel Corporation | Conductive adhesive compositions containing an alloy filler material for better dispense and thermal properties |
| JP5592081B2 (ja) * | 2008-06-13 | 2014-09-17 | ヘンケル コーポレイション | 液晶滴下工法用シール剤および液晶表示装置の製造方法 |
| CN102149761B (zh) * | 2008-08-08 | 2016-10-12 | 汉高知识产权控股有限责任公司 | 低温固化的组合物 |
| JP5685189B2 (ja) * | 2008-08-12 | 2015-03-18 | ハンツマン・アドヴァンスト・マテリアルズ・(スイッツランド)・ゲーエムベーハー | 熱硬化性組成物 |
| JP2010116531A (ja) * | 2008-10-15 | 2010-05-27 | Hitachi Chem Co Ltd | 接着剤組成物、接着剤層及び多段パッケージ |
| US7851266B2 (en) * | 2008-11-26 | 2010-12-14 | Micron Technologies, Inc. | Microelectronic device wafers including an in-situ molded adhesive, molds for in-situ molding adhesives on microelectronic device wafers, and methods of molding adhesives on microelectronic device wafers |
| CN102300950A (zh) * | 2009-02-02 | 2011-12-28 | 洛德公司 | 含有马来酰亚胺封端的聚酰亚胺的结构粘合剂 |
| US8415812B2 (en) | 2009-09-03 | 2013-04-09 | Designer Molecules, Inc. | Materials and methods for stress reduction in semiconductor wafer passivation layers |
| US8710682B2 (en) * | 2009-09-03 | 2014-04-29 | Designer Molecules Inc, Inc. | Materials and methods for stress reduction in semiconductor wafer passivation layers |
| WO2011047123A2 (en) * | 2009-10-15 | 2011-04-21 | Henkel Corporation | Anaerobically curable compositions |
| US8698320B2 (en) * | 2009-12-07 | 2014-04-15 | Henkel IP & Holding GmbH | Curable resin compositions useful as underfill sealants for use with low-k dielectric-containing semiconductor devices |
| JP5993845B2 (ja) * | 2010-06-08 | 2016-09-14 | ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング | 先ダイシング法を行う微細加工されたウェーハへの接着剤の被覆 |
| US20120100379A1 (en) * | 2010-10-20 | 2012-04-26 | Greene, Tweed Of Delaware, Inc. | Fluoroelastomer bonding compositions suitable for high-temperature applications |
| EP2671249A4 (en) * | 2011-02-01 | 2015-10-07 | Henkel IP & Holding GmbH | UNDERLYING FILM APPLIED ON A PRECEDED WAFER |
| US8682169B2 (en) | 2011-02-28 | 2014-03-25 | Eldon Technology Limited | Apparatus, systems and methods for detecting infrared signals at a media device configured to be positioned in different orientations |
| US8363411B2 (en) | 2011-03-18 | 2013-01-29 | Eldon Technology Limited | Passive, low-profile heat transferring system |
| US8619427B2 (en) | 2011-03-21 | 2013-12-31 | Eldon Technology Limited | Media content device chassis with internal extension members |
| US9047492B2 (en) | 2011-03-22 | 2015-06-02 | Echostar Uk Holdings Limited | Apparatus, systems and methods for securely storing media content events on a flash memory device |
| US8638199B2 (en) | 2011-03-29 | 2014-01-28 | Eldon Technology Limited | Apparatus, systems and methods for power line carrier data communication to DC powered electronic device |
| US9317079B2 (en) | 2011-03-29 | 2016-04-19 | Echostar Uk Holdings Limited | Media content device with customized panel |
| US8681495B2 (en) | 2011-03-29 | 2014-03-25 | Eldon Technology Limited | Media device having a piezoelectric fan |
| WO2012147828A1 (ja) * | 2011-04-27 | 2012-11-01 | 富士フイルム株式会社 | インプリント用硬化性組成物、パターン形成方法およびパターン |
| WO2013015469A1 (en) * | 2011-07-28 | 2013-01-31 | Protavic Korea Co., Ltd. | Flexible bismaleimide, benzoxazine, epoxy-anhydride adduct hybrid adhesive |
| JP6246734B2 (ja) * | 2012-01-25 | 2017-12-13 | ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング | シアノアクリレート組成物 |
| US9550883B2 (en) | 2012-01-25 | 2017-01-24 | Henkel IP & Holding GmbH | Cyanoacrylate compositions |
| US20150382479A1 (en) * | 2013-02-25 | 2015-12-31 | Parker-Hannifin Corporation("Parker") | Pre-applied conductive adhesive for emi shielding |
| US9321245B2 (en) | 2013-06-24 | 2016-04-26 | Globalfoundries Inc. | Injection of a filler material with homogeneous distribution of anisotropic filler particles through implosion |
| CN105408418B (zh) | 2013-09-30 | 2017-04-26 | 株式会社Lg化学 | 用于半导体封装物的热固性树脂组合物以及使用其的半固化片和覆金属层压板 |
| WO2015046921A1 (ko) * | 2013-09-30 | 2015-04-02 | 주식회사 엘지화학 | 반도체 패키지용 열경화성 수지 조성물과 이를 이용한 프리프레그 및 금속박 적층판 |
| JP5828881B2 (ja) * | 2013-12-24 | 2015-12-09 | 日東電工株式会社 | 接着フィルム、ダイシング・ダイボンドフィルム、半導体装置の製造方法及び半導体装置 |
| US9466632B2 (en) | 2015-01-09 | 2016-10-11 | Samsung Electronics Co., Ltd. | Image sensor package and an image sensor module having the same |
| WO2016157394A1 (ja) * | 2015-03-30 | 2016-10-06 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
| DE102016101887B4 (de) * | 2016-02-03 | 2019-01-17 | Infineon Technologies Ag | Verfahren zum Herstellen eines Package mit Befestigung eines Chipbefestigungsmediums an einem bereits gekapselten elektronischen Chip |
| DE102017215303A1 (de) | 2017-09-01 | 2018-07-19 | Robert Bosch Gmbh | Verfahren zum Herstellen eines Halbleiterbauelements |
| JP6926891B2 (ja) * | 2017-09-25 | 2021-08-25 | Jsr株式会社 | 対象物の処理方法、仮固定用組成物、半導体装置およびその製造方法 |
| US20190112438A1 (en) * | 2017-10-12 | 2019-04-18 | Texas Research International, Inc. | Anaerobic composite matrix resins |
| US11084913B2 (en) * | 2017-10-12 | 2021-08-10 | Texas Research International, Inc. | Anaerobic composite matrix resins |
| TWI826625B (zh) * | 2018-12-28 | 2023-12-21 | 美商帝克萊股份有限公司 | 耐高溫傳導性熱固型樹脂組合物 |
| CN114830265B (zh) * | 2019-12-20 | 2026-01-20 | 汉高股份有限及两合公司 | 用于金属键合的包含铜合金的银烧结组合物 |
| US11639398B2 (en) | 2019-12-30 | 2023-05-02 | Rohm And Haas Electronic Materials Llc | Photosensitive bismaleimide composition |
| US11830810B2 (en) * | 2020-05-07 | 2023-11-28 | Wolfspeed, Inc. | Packaged transistor having die attach materials with channels and process of implementing the same |
| US11424177B2 (en) | 2020-05-07 | 2022-08-23 | Wolfspeed, Inc. | Integrated circuit having die attach materials with channels and process of implementing the same |
| CN117203743A (zh) | 2021-03-15 | 2023-12-08 | 纳欧克斯影像有限公司 | 用于制造电子发射体阵列芯片的硅管芯叠置体的系统和方法 |
| US20230197575A1 (en) * | 2021-12-20 | 2023-06-22 | Texas Instruments Incorporated | Die attach adhesive-ready lead frame design |
| JPWO2025079399A1 (enExample) * | 2023-10-13 | 2025-04-17 | ||
| KR20260111033A (ko) * | 2023-11-16 | 2026-07-14 | 헨켈 아게 운트 코. 카게아아 | 유연성 전도성 접착제 조성물 |
| CN118630027A (zh) * | 2024-04-29 | 2024-09-10 | 北京微电子技术研究所 | 一种用于传感器芯片的高平面度粘片结构的制作方法 |
Family Cites Families (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2928446A (en) | 1957-04-05 | 1960-03-15 | Little Inc A | Self-locking screw-threaded fastening member |
| US4325985A (en) | 1980-03-31 | 1982-04-20 | The Oakland Corporation | Thread lock |
| AU566422B2 (en) | 1981-10-15 | 1987-10-22 | Thompson, W.H. | A polymerisable fluid |
| US4851454A (en) | 1986-07-17 | 1989-07-25 | The Dow Chemical Company | Photolytically crosslinkable thermally stable composition |
| US5215860A (en) * | 1988-08-19 | 1993-06-01 | Minnesota Mining And Manufacturing Company | Energy-curable cyanate compositions |
| JP2678655B2 (ja) * | 1989-03-20 | 1997-11-17 | 日東電工株式会社 | 半導体チップ固着キャリヤの製造方法及びウエハ固定部材 |
| US5015695A (en) | 1989-05-09 | 1991-05-14 | Shell Oil Company | Functionalized elastomeric polymer production |
| JPH0395225A (ja) * | 1989-09-08 | 1991-04-19 | Fujitsu Ltd | マレイミド樹脂組成物 |
| US5148265A (en) | 1990-09-24 | 1992-09-15 | Ist Associates, Inc. | Semiconductor chip assemblies with fan-in leads |
| US5140404A (en) | 1990-10-24 | 1992-08-18 | Micron Technology, Inc. | Semiconductor device manufactured by a method for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tape |
| US5177032A (en) | 1990-10-24 | 1993-01-05 | Micron Technology, Inc. | Method for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tape |
| US5300608A (en) | 1992-03-31 | 1994-04-05 | Loctite Corporation | Process for preparing alkoxy-terminated organosiloxane fluids using organo-lithium reagents |
| US5323060A (en) | 1993-06-02 | 1994-06-21 | Micron Semiconductor, Inc. | Multichip module having a stacked chip arrangement |
| JP3884065B2 (ja) | 1994-05-19 | 2007-02-21 | イー・アイ・デュポン・ドゥ・ヌムール・アンド・カンパニー | 水系キャリア中で調製される自己安定化ラテックスを含有する塗料 |
| US6034194A (en) | 1994-09-02 | 2000-03-07 | Quantum Materials/Dexter Corporation | Bismaleimide-divinyl adhesive compositions and uses therefor |
| US5789757A (en) | 1996-09-10 | 1998-08-04 | The Dexter Corporation | Malemide containing formulations and uses therefor |
| US6960636B2 (en) * | 1994-09-02 | 2005-11-01 | Henkel Corporation | Thermosetting resin compositions containing maleimide and/or vinyl compounds |
| US5585671A (en) * | 1994-10-07 | 1996-12-17 | Nagesh; Voddarahalli K. | Reliable low thermal resistance package for high power flip clip ICs |
| US5717034A (en) | 1996-07-29 | 1998-02-10 | Quantum Materials, Inc. | Perfluorinated hydrocarbon polymer-filled adhesive formulations and uses therefor |
| US5973166A (en) | 1998-03-02 | 1999-10-26 | The Dexter Corporation | Method for the preparation of maleimides |
| JPH11260839A (ja) * | 1998-03-16 | 1999-09-24 | Toray Ind Inc | 半導体装置用接着剤組成物およびそれを用いた半導体装置用接着剤シート |
| JP2000001652A (ja) * | 1998-06-12 | 2000-01-07 | Tomoegawa Paper Co Ltd | 接着テープ |
| US6265530B1 (en) * | 1998-07-02 | 2001-07-24 | National Starch And Chemical Investment Holding Corporation | Die attach adhesives for use in microelectronic devices |
| SG105450A1 (en) | 1998-07-02 | 2004-08-27 | Nat Starch Chem Invest | Allylated amide compounds and die attach adhesives prepared therefrom |
| US6355750B1 (en) | 1998-07-02 | 2002-03-12 | National Starch And Chemical Investment Holding Corporation | Dye attach adhesives for use in microelectronic devices |
| JP2000243831A (ja) * | 1999-02-18 | 2000-09-08 | Sony Corp | 半導体装置とその製造方法 |
| AR023110A1 (es) | 1999-03-22 | 2002-09-04 | Loctite Corp | Articulos roscados con revestimiento deformable curado sobre los mismos |
| US6861670B1 (en) * | 1999-04-01 | 2005-03-01 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having multi-layer wiring |
| ATE316560T1 (de) * | 1999-06-18 | 2006-02-15 | Hitachi Chemical Co Ltd | Klebstoff, klebstoffgegenstand, schaltungssubstrat für halbleitermontage mit einem klebstoff und eine halbleiteranordnung die diesen enthält |
| US6522018B1 (en) * | 2000-05-16 | 2003-02-18 | Micron Technology, Inc. | Ball grid array chip packages having improved testing and stacking characteristics |
| US6953984B2 (en) * | 2000-06-23 | 2005-10-11 | International Business Machines Corporation | Hydrogenated oxidized silicon carbon material |
| US6963001B2 (en) * | 2000-09-30 | 2005-11-08 | Henkel Corporation | Low shrinkage thermosetting resin compositions and methods of use therefor |
| US6620651B2 (en) | 2001-10-23 | 2003-09-16 | National Starch And Chemical Investment Holding Corporation | Adhesive wafers for die attach application |
| US6743852B2 (en) * | 2001-11-13 | 2004-06-01 | Henkel Corporation | Benzoxazines, thermosetting resins comprised thereof, and methods for use thereof |
| US6620905B1 (en) * | 2002-02-23 | 2003-09-16 | National Starch And Chemical Investment Holding Corporation | Curable compositions containing benzoxazine |
| US6831132B2 (en) * | 2002-03-28 | 2004-12-14 | Henkel Corporation | Film adhesives containing maleimide compounds and methods for use thereof |
| US7176044B2 (en) * | 2002-11-25 | 2007-02-13 | Henkel Corporation | B-stageable die attach adhesives |
-
2003
- 2003-06-17 CN CNB038140942A patent/CN100449776C/zh not_active Expired - Fee Related
- 2003-06-17 US US10/502,976 patent/US7312534B2/en not_active Expired - Fee Related
- 2003-06-17 KR KR1020047020440A patent/KR101164671B1/ko not_active Expired - Fee Related
- 2003-06-17 JP JP2004514137A patent/JP2005532678A/ja active Pending
- 2003-06-17 CN CNA2008101733589A patent/CN101488480A/zh active Pending
- 2003-06-17 WO PCT/US2003/019052 patent/WO2003107427A1/en not_active Ceased
- 2003-06-17 KR KR1020107024075A patent/KR101136719B1/ko not_active Expired - Fee Related
- 2003-06-17 AU AU2003276729A patent/AU2003276729A1/en not_active Abandoned
-
2007
- 2007-06-05 US US11/758,089 patent/US7550825B2/en not_active Expired - Fee Related
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