JP2005532678A5 - - Google Patents

Download PDF

Info

Publication number
JP2005532678A5
JP2005532678A5 JP2004514137A JP2004514137A JP2005532678A5 JP 2005532678 A5 JP2005532678 A5 JP 2005532678A5 JP 2004514137 A JP2004514137 A JP 2004514137A JP 2004514137 A JP2004514137 A JP 2004514137A JP 2005532678 A5 JP2005532678 A5 JP 2005532678A5
Authority
JP
Japan
Prior art keywords
alkyl
aryl
product according
benzoxazine component
formula
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004514137A
Other languages
English (en)
Other versions
JP2005532678A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2003/019052 external-priority patent/WO2003107427A1/en
Publication of JP2005532678A publication Critical patent/JP2005532678A/ja
Publication of JP2005532678A5 publication Critical patent/JP2005532678A5/ja
Pending legal-status Critical Current

Links

Description

Figure 2005532678

Claims (2)

  1. 前記ベンズオキサジン成分が、
    Figure 2005532678
    〔式中、
    oは,1〜4、Xは直接結合(oが2のとき)、アルキル(oが1であるとき)、アルキレン(oが2〜4であるとき)、カルボニル(oが2であるとき)、チオール(oが1であるとき)、チオエーテル(oが2であるとき)、スルホキシド(oが2であるとき)およびスルホン(oが2であるとき)であり、そして、
    14はアルキルまたはアリールである。〕
    を含む請求項3記載の製品。
  2. 前記ベンズオキサジン成分が、下記式の化合物:
    Figure 2005532678
    Figure 2005532678
    (式中、R 14 、R 15 およびR 16 は、同一でも異なっていてもよく、メチル、エチ
    ル、プロピル、ブチルおよびアリールから選ばれる。)
    を含む請求項3記載の製品。
JP2004514137A 2002-06-17 2003-06-17 層間誘電体および事前塗布ダイ取り付け用接着性材料 Pending JP2005532678A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US38964202P 2002-06-17 2002-06-17
PCT/US2003/019052 WO2003107427A1 (en) 2002-06-17 2003-06-17 Interlayer dielectric and pre-applied die attach adhesive materials

Publications (2)

Publication Number Publication Date
JP2005532678A JP2005532678A (ja) 2005-10-27
JP2005532678A5 true JP2005532678A5 (ja) 2006-08-24

Family

ID=29736665

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004514137A Pending JP2005532678A (ja) 2002-06-17 2003-06-17 層間誘電体および事前塗布ダイ取り付け用接着性材料

Country Status (6)

Country Link
US (2) US7312534B2 (ja)
JP (1) JP2005532678A (ja)
KR (2) KR101164671B1 (ja)
CN (2) CN101488480A (ja)
AU (1) AU2003276729A1 (ja)
WO (1) WO2003107427A1 (ja)

Families Citing this family (63)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050288457A1 (en) * 2002-10-22 2005-12-29 Puwei Liu Co-curable compositions
JP2007522672A (ja) * 2004-02-17 2007-08-09 ナショナル スターチ アンド ケミカル インベストメント ホールディング コーポレイション ハイブリッドオキサゾリン化合物で基板に取り付けられた半導体ダイ
KR100690960B1 (ko) * 2004-06-24 2007-03-09 삼성전자주식회사 스크린 프린팅 공정을 갖는 반도체 칩 패키지 제조 방법
US7816487B2 (en) * 2004-09-30 2010-10-19 Intel Corporation Die-attach films for chip-scale packaging, packages made therewith, and methods of assembling same
JP4325531B2 (ja) * 2004-10-15 2009-09-02 住友ベークライト株式会社 樹脂封止型半導体装置
DE102005018704B4 (de) 2005-04-21 2019-05-29 Hexion GmbH Härtbare Mischung, Verfahren zu deren Herstellung und gehärtetes Produkt
US20060266496A1 (en) * 2005-05-31 2006-11-30 Sensis Corporation Method and apparatus for dissipating heat
WO2006138367A2 (en) * 2005-06-17 2006-12-28 Fry's Metals, Inc. Thermoplastic/thermoset composition material and method of attaching a wafer to a substrate
US20080315417A1 (en) * 2005-07-14 2008-12-25 Chipmos Technologies Inc. Chip package
US7456748B2 (en) * 2005-10-20 2008-11-25 National Starch And Chemical Investment Holding Corporation RFID antenna with pre-applied adhesives
US7835158B2 (en) * 2005-12-30 2010-11-16 Micron Technology, Inc. Connection verification technique
US20070256783A1 (en) * 2006-05-08 2007-11-08 Dietz Raymond L Thermally enhanced adhesive paste
US8344523B2 (en) 2006-05-08 2013-01-01 Diemat, Inc. Conductive composition
JP5422878B2 (ja) * 2006-10-24 2014-02-19 東レ株式会社 半導体用接着組成物、それを用いた半導体装置および半導体装置の製造方法
JP4988531B2 (ja) * 2006-12-18 2012-08-01 日東電工株式会社 半導体装置製造用の接着シート、及びそれを用いた半導体装置の製造方法
JP5380886B2 (ja) * 2007-04-18 2014-01-08 日立化成株式会社 接着剤付きウエハ及びその製造方法
US20090050266A1 (en) * 2007-08-21 2009-02-26 Kang Yang Crosslinked polymeric materials as filler and spacers in adhesives
JP2009111340A (ja) * 2007-10-11 2009-05-21 Hitachi Chem Co Ltd 接着剤付きウエハ、接着剤組成物及び接着剤付きウエハの製造方法
WO2009117345A2 (en) * 2008-03-17 2009-09-24 Henkel Corporation Adhesive compositions for use in die attach applications
US20090236757A1 (en) * 2008-03-24 2009-09-24 Infineon Technologies Ag Semiconductor device and method for manufacturing
US7851930B1 (en) * 2008-06-04 2010-12-14 Henkel Corporation Conductive adhesive compositions containing an alloy filler material for better dispense and thermal properties
JP5592081B2 (ja) * 2008-06-13 2014-09-17 ヘンケル コーポレイション 液晶滴下工法用シール剤および液晶表示装置の製造方法
KR20110045040A (ko) * 2008-08-08 2011-05-03 헨켈 코포레이션 저온 경화 조성물
EP2313452A1 (en) * 2008-08-12 2011-04-27 Huntsman Advanced Materials (Switzerland) GmbH Thermosetting composition
JP2010116531A (ja) * 2008-10-15 2010-05-27 Hitachi Chem Co Ltd 接着剤組成物、接着剤層及び多段パッケージ
US7851266B2 (en) * 2008-11-26 2010-12-14 Micron Technologies, Inc. Microelectronic device wafers including an in-situ molded adhesive, molds for in-situ molding adhesives on microelectronic device wafers, and methods of molding adhesives on microelectronic device wafers
JP2012516914A (ja) * 2009-02-02 2012-07-26 ロード コーポレイション マレイミド末端基を持つポリイミドを含む構造用接着剤
US8710682B2 (en) * 2009-09-03 2014-04-29 Designer Molecules Inc, Inc. Materials and methods for stress reduction in semiconductor wafer passivation layers
US8415812B2 (en) 2009-09-03 2013-04-09 Designer Molecules, Inc. Materials and methods for stress reduction in semiconductor wafer passivation layers
CN102549059B (zh) * 2009-10-15 2016-05-18 汉高知识产权控股有限责任公司 厌氧固化组合物
US8698320B2 (en) * 2009-12-07 2014-04-15 Henkel IP & Holding GmbH Curable resin compositions useful as underfill sealants for use with low-k dielectric-containing semiconductor devices
WO2011156228A2 (en) * 2010-06-08 2011-12-15 Henkel Corporation Coating adhesives onto dicing before grinding and micro-fabricated wafers
US20120100379A1 (en) * 2010-10-20 2012-04-26 Greene, Tweed Of Delaware, Inc. Fluoroelastomer bonding compositions suitable for high-temperature applications
JP2014511559A (ja) * 2011-02-01 2014-05-15 ヘンケル コーポレイション プレカットされウェハに塗布されるアンダーフィル膜
US8682169B2 (en) 2011-02-28 2014-03-25 Eldon Technology Limited Apparatus, systems and methods for detecting infrared signals at a media device configured to be positioned in different orientations
US8363411B2 (en) 2011-03-18 2013-01-29 Eldon Technology Limited Passive, low-profile heat transferring system
US8619427B2 (en) 2011-03-21 2013-12-31 Eldon Technology Limited Media content device chassis with internal extension members
US9047492B2 (en) 2011-03-22 2015-06-02 Echostar Uk Holdings Limited Apparatus, systems and methods for securely storing media content events on a flash memory device
US8681495B2 (en) 2011-03-29 2014-03-25 Eldon Technology Limited Media device having a piezoelectric fan
US9317079B2 (en) 2011-03-29 2016-04-19 Echostar Uk Holdings Limited Media content device with customized panel
US8638199B2 (en) 2011-03-29 2014-01-28 Eldon Technology Limited Apparatus, systems and methods for power line carrier data communication to DC powered electronic device
WO2012147828A1 (ja) * 2011-04-27 2012-11-01 富士フイルム株式会社 インプリント用硬化性組成物、パターン形成方法およびパターン
EP2736999B1 (en) * 2011-07-28 2018-11-07 Protavic Korea Co., Ltd. Flexible bismaleimide, benzoxazine, epoxy-anhydride adduct hybrid adhesive
US9550883B2 (en) 2012-01-25 2017-01-24 Henkel IP & Holding GmbH Cyanoacrylate compositions
KR101840906B1 (ko) * 2012-01-25 2018-03-21 헨켈 아이피 앤드 홀딩 게엠베하 시아노아크릴레이트 조성물
EP2995179A4 (en) * 2013-02-25 2016-11-02 Parker Hannifin Corp PRE-APPLIED CONDUCTIVE ADHESIVE FOR EMI SHIELDING
US9321245B2 (en) 2013-06-24 2016-04-26 Globalfoundries Inc. Injection of a filler material with homogeneous distribution of anisotropic filler particles through implosion
JP6301473B2 (ja) 2013-09-30 2018-03-28 エルジー・ケム・リミテッド 半導体パッケージ用の熱硬化性樹脂組成物とこれを用いたプリプレグおよび金属箔積層板
WO2015046921A1 (ko) * 2013-09-30 2015-04-02 주식회사 엘지화학 반도체 패키지용 열경화성 수지 조성물과 이를 이용한 프리프레그 및 금속박 적층판
JP5828881B2 (ja) * 2013-12-24 2015-12-09 日東電工株式会社 接着フィルム、ダイシング・ダイボンドフィルム、半導体装置の製造方法及び半導体装置
US9466632B2 (en) 2015-01-09 2016-10-11 Samsung Electronics Co., Ltd. Image sensor package and an image sensor module having the same
WO2016157394A1 (ja) 2015-03-30 2016-10-06 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
DE102016101887B4 (de) * 2016-02-03 2019-01-17 Infineon Technologies Ag Verfahren zum Herstellen eines Package mit Befestigung eines Chipbefestigungsmediums an einem bereits gekapselten elektronischen Chip
DE102017215303A1 (de) 2017-09-01 2018-07-19 Robert Bosch Gmbh Verfahren zum Herstellen eines Halbleiterbauelements
JP6926891B2 (ja) * 2017-09-25 2021-08-25 Jsr株式会社 対象物の処理方法、仮固定用組成物、半導体装置およびその製造方法
US11084913B2 (en) * 2017-10-12 2021-08-10 Texas Research International, Inc. Anaerobic composite matrix resins
US20190112438A1 (en) * 2017-10-12 2019-04-18 Texas Research International, Inc. Anaerobic composite matrix resins
TWI826625B (zh) * 2018-12-28 2023-12-21 美商帝克萊股份有限公司 耐高溫傳導性熱固型樹脂組合物
KR20220115953A (ko) * 2019-12-20 2022-08-19 헨켈 아게 운트 코. 카게아아 금속 결합을 위한 구리 합금을 함유하는 은 소결 조성물
US11639398B2 (en) 2019-12-30 2023-05-02 Rohm And Haas Electronic Materials Llc Photosensitive bismaleimide composition
US11424177B2 (en) 2020-05-07 2022-08-23 Wolfspeed, Inc. Integrated circuit having die attach materials with channels and process of implementing the same
US11830810B2 (en) * 2020-05-07 2023-11-28 Wolfspeed, Inc. Packaged transistor having die attach materials with channels and process of implementing the same
US20240047415A1 (en) * 2021-03-15 2024-02-08 Nano-X Imaging Ltd Systems and methods for fabricating silicon die stacks for electron emitter array chips

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2928446A (en) 1957-04-05 1960-03-15 Little Inc A Self-locking screw-threaded fastening member
US4325985A (en) 1980-03-31 1982-04-20 The Oakland Corporation Thread lock
AU566422B2 (en) 1981-10-15 1987-10-22 Thompson, W.H. A polymerisable fluid
US4851454A (en) 1986-07-17 1989-07-25 The Dow Chemical Company Photolytically crosslinkable thermally stable composition
US5215860A (en) * 1988-08-19 1993-06-01 Minnesota Mining And Manufacturing Company Energy-curable cyanate compositions
JP2678655B2 (ja) * 1989-03-20 1997-11-17 日東電工株式会社 半導体チップ固着キャリヤの製造方法及びウエハ固定部材
US5015695A (en) 1989-05-09 1991-05-14 Shell Oil Company Functionalized elastomeric polymer production
JPH0395225A (ja) * 1989-09-08 1991-04-19 Fujitsu Ltd マレイミド樹脂組成物
US5148265A (en) 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies with fan-in leads
US5177032A (en) 1990-10-24 1993-01-05 Micron Technology, Inc. Method for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tape
US5140404A (en) 1990-10-24 1992-08-18 Micron Technology, Inc. Semiconductor device manufactured by a method for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tape
US5300608A (en) 1992-03-31 1994-04-05 Loctite Corporation Process for preparing alkoxy-terminated organosiloxane fluids using organo-lithium reagents
US5323060A (en) 1993-06-02 1994-06-21 Micron Semiconductor, Inc. Multichip module having a stacked chip arrangement
EP0759946B1 (en) 1994-05-19 2005-01-26 E.I. Du Pont De Nemours And Company Coatings comprising self-stabilized lattices prepared in an aqueous carrier
US6034194A (en) 1994-09-02 2000-03-07 Quantum Materials/Dexter Corporation Bismaleimide-divinyl adhesive compositions and uses therefor
US5789757A (en) 1996-09-10 1998-08-04 The Dexter Corporation Malemide containing formulations and uses therefor
US6960636B2 (en) * 1994-09-02 2005-11-01 Henkel Corporation Thermosetting resin compositions containing maleimide and/or vinyl compounds
US5585671A (en) * 1994-10-07 1996-12-17 Nagesh; Voddarahalli K. Reliable low thermal resistance package for high power flip clip ICs
US5717034A (en) 1996-07-29 1998-02-10 Quantum Materials, Inc. Perfluorinated hydrocarbon polymer-filled adhesive formulations and uses therefor
US5973166A (en) 1998-03-02 1999-10-26 The Dexter Corporation Method for the preparation of maleimides
JPH11260839A (ja) * 1998-03-16 1999-09-24 Toray Ind Inc 半導体装置用接着剤組成物およびそれを用いた半導体装置用接着剤シート
JP2000001652A (ja) * 1998-06-12 2000-01-07 Tomoegawa Paper Co Ltd 接着テープ
SG105450A1 (en) 1998-07-02 2004-08-27 Nat Starch Chem Invest Allylated amide compounds and die attach adhesives prepared therefrom
US6355750B1 (en) * 1998-07-02 2002-03-12 National Starch And Chemical Investment Holding Corporation Dye attach adhesives for use in microelectronic devices
US6265530B1 (en) * 1998-07-02 2001-07-24 National Starch And Chemical Investment Holding Corporation Die attach adhesives for use in microelectronic devices
JP2000243831A (ja) * 1999-02-18 2000-09-08 Sony Corp 半導体装置とその製造方法
AR023110A1 (es) 1999-03-22 2002-09-04 Loctite Corp Articulos roscados con revestimiento deformable curado sobre los mismos
US6861670B1 (en) * 1999-04-01 2005-03-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having multi-layer wiring
EP1586615B1 (en) * 1999-06-18 2007-08-15 Hitachi Chemical Company, Ltd. Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same
US6522018B1 (en) * 2000-05-16 2003-02-18 Micron Technology, Inc. Ball grid array chip packages having improved testing and stacking characteristics
US6953984B2 (en) * 2000-06-23 2005-10-11 International Business Machines Corporation Hydrogenated oxidized silicon carbon material
US6963001B2 (en) * 2000-09-30 2005-11-08 Henkel Corporation Low shrinkage thermosetting resin compositions and methods of use therefor
US6620651B2 (en) 2001-10-23 2003-09-16 National Starch And Chemical Investment Holding Corporation Adhesive wafers for die attach application
US6743852B2 (en) * 2001-11-13 2004-06-01 Henkel Corporation Benzoxazines, thermosetting resins comprised thereof, and methods for use thereof
US6620905B1 (en) * 2002-02-23 2003-09-16 National Starch And Chemical Investment Holding Corporation Curable compositions containing benzoxazine
US6831132B2 (en) * 2002-03-28 2004-12-14 Henkel Corporation Film adhesives containing maleimide compounds and methods for use thereof
US7176044B2 (en) * 2002-11-25 2007-02-13 Henkel Corporation B-stageable die attach adhesives

Similar Documents

Publication Publication Date Title
JP2005532678A5 (ja)
EP2340830A3 (en) Hepatitis C Virus Inhibitors
JP2005053931A5 (ja)
JP2005504811A5 (ja) 置換ペンタセン化合物、半導体デバイス及び物品
EP2085391A3 (en) Inhibitors of factor XA and other serine proteases involved in the coagulation cascade
JP2007500753A5 (ja)
JP2005518413A5 (ja)
JP2007503202A5 (ja)
JP2005538089A5 (ja)
EP1335000A3 (en) Phthalocyanine compounds
JP2007510619A5 (ja)
JP2004532209A5 (ja)
EP1764099A3 (en) Diaminoalcohol derivatives for the treatment of Alzheimer, malaria, HIV
JP2005522505A5 (ja)
JP2008514655A5 (ja)
JP2007522220A5 (ja)
JP2009535462A5 (ja)
JP2006240292A5 (ja)
JP2006526031A5 (ja)
FR2884550B1 (fr) Piece pour proteger le bord d'attaque d'une pale
JP2007119504A5 (ja)
JP2007505773A5 (ja)
JP2008540542A5 (ja)
DE502005000428D1 (de) Verfahren zur Herstellung von 1,2-Diaminocyclohexan-Platin(II)-Komplexen
JP2007502817A5 (ja)