KR101164671B1 - 층간 절연 물질 및 미리 도포되는 다이 부착 접착제 물질 - Google Patents

층간 절연 물질 및 미리 도포되는 다이 부착 접착제 물질 Download PDF

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KR101164671B1
KR101164671B1 KR1020047020440A KR20047020440A KR101164671B1 KR 101164671 B1 KR101164671 B1 KR 101164671B1 KR 1020047020440 A KR1020047020440 A KR 1020047020440A KR 20047020440 A KR20047020440 A KR 20047020440A KR 101164671 B1 KR101164671 B1 KR 101164671B1
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die
die attach
delete delete
attach adhesive
semiconductor chip
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KR20050010933A (ko
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베네딕토 델로스 산토스
제임스 티. 후네케
푸웨이 리우
캉 양
큉 지
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헨켈 코포레이션
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Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Die Bonding (AREA)
KR1020047020440A 2002-06-17 2003-06-17 층간 절연 물질 및 미리 도포되는 다이 부착 접착제 물질 Expired - Fee Related KR101164671B1 (ko)

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CN100449776C (zh) 2009-01-07
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