JP2005531679A - 低温焼結導電性ナノインク及びその製造方法 - Google Patents

低温焼結導電性ナノインク及びその製造方法 Download PDF

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Publication number
JP2005531679A
JP2005531679A JP2004519139A JP2004519139A JP2005531679A JP 2005531679 A JP2005531679 A JP 2005531679A JP 2004519139 A JP2004519139 A JP 2004519139A JP 2004519139 A JP2004519139 A JP 2004519139A JP 2005531679 A JP2005531679 A JP 2005531679A
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metal
nanopowder
mixture
conductive
sintering
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JP2004519139A
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Japanese (ja)
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JP2005531679A5 (fr
Inventor
ガーバー，アーケディ
ラ ヴェガ，フェルナンド デ
マッツナー，エイナット
ソコリンスカイ，チャリアナ
ローゼンバンド，ヴァレリー
キセレフ，アナトリー
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ナノパウダーズ インダストリーズ リミテッド
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Publication of JP2005531679A publication Critical patent/JP2005531679A/ja
Publication of JP2005531679A5 publication Critical patent/JP2005531679A5/ja
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Composite Materials (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Powder Metallurgy (AREA)
JP2004519139A 2002-07-03 2003-07-03 低温焼結導電性ナノインク及びその製造方法 Pending JP2005531679A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US39312302P 2002-07-03 2002-07-03
PCT/IL2003/000554 WO2004005413A1 (fr) 2002-07-03 2003-07-03 Nano-encres conductrices frittees a basses temperatures et procede de production de ces dernieres

Publications (2)

Publication Number Publication Date
JP2005531679A true JP2005531679A (ja) 2005-10-20
JP2005531679A5 JP2005531679A5 (fr) 2006-08-10

Family

ID=30115548

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004519139A Pending JP2005531679A (ja) 2002-07-03 2003-07-03 低温焼結導電性ナノインク及びその製造方法

Country Status (5)

Country Link
JP (1) JP2005531679A (fr)
KR (1) KR20060012545A (fr)
CN (1) CN1671805B (fr)
AU (1) AU2003237578A1 (fr)
WO (1) WO2004005413A1 (fr)

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JP2006069167A (ja) * 2004-09-06 2006-03-16 Shuho:Kk 印刷または塗布画像作成方法、およびそれによる、印刷または塗布画像体
JP2006210301A (ja) * 2004-12-27 2006-08-10 Mitsui Mining & Smelting Co Ltd 導電性インク
WO2008069008A1 (fr) 2006-12-05 2008-06-12 Nippon Oil Corporation Polariseur à grille de fils et procédé de fabrication du polariseur à grille de fils, et film à différence de phase et élément d'affichage à cristaux liquides utilisant le polariseur à grille de fils
KR100850771B1 (ko) 2007-02-21 2008-08-06 연세대학교 산학협력단 나노금속잉크 제조방법
JP2010012714A (ja) * 2008-07-04 2010-01-21 Toda Kogyo Corp 機能性薄膜の製造方法、機能性薄膜、機能性薄膜積層基材の製造方法及び機能性薄膜積層基材
JP2011514397A (ja) * 2008-01-30 2011-05-06 ビーエーエスエフ ソシエタス・ヨーロピア 導電性インク
CN103627255A (zh) * 2013-05-06 2014-03-12 苏州冷石纳米材料科技有限公司 一种纳米银导电墨水及采用该墨水制备的导电薄膜
JP2014529875A (ja) * 2011-09-06 2014-11-13 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング 導電性材料およびプロセス
JP2015532669A (ja) * 2012-08-16 2015-11-12 シーマ ナノテック イスラエル リミテッド 透明な導電性コーティングを調製するためのエマルション

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US7585349B2 (en) 2002-12-09 2009-09-08 The University Of Washington Methods of nanostructure formation and shape selection
GB0300529D0 (en) * 2003-01-10 2003-02-12 Qinetiq Nanomaterials Ltd Improvements in and relating to ink jet deposition
US20050173680A1 (en) * 2004-02-10 2005-08-11 Haixin Yang Ink jet printable thick film ink compositions and processes
US8257795B2 (en) 2004-02-18 2012-09-04 Virginia Tech Intellectual Properties, Inc. Nanoscale metal paste for interconnect and method of use
KR20070033329A (ko) * 2004-02-18 2007-03-26 버지니아 테크 인터렉추얼 프라퍼티스, 인크. 인터커넥트를 위한 나노 크기의 금속 페이스트 및 이의사용 방법
EP1835512B1 (fr) * 2004-10-08 2010-05-12 Mitsui Mining & Smelting Co., Ltd. Encre conductrice
US20060093732A1 (en) * 2004-10-29 2006-05-04 David Schut Ink-jet printing of coupling agents for trace or circuit deposition templating
JP4756628B2 (ja) * 2004-12-01 2011-08-24 三井金属鉱業株式会社 水系ｉｔｏインク
US8167393B2 (en) 2005-01-14 2012-05-01 Cabot Corporation Printable electronic features on non-uniform substrate and processes for making same
US8383014B2 (en) 2010-06-15 2013-02-26 Cabot Corporation Metal nanoparticle compositions
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WO2006076603A2 (fr) * 2005-01-14 2006-07-20 Cabot Corporation Conducteurs electriques imprimables
KR100690360B1 (ko) * 2005-05-23 2007-03-09 삼성전기주식회사 도전성 잉크, 그 제조방법 및 도전성 기판
KR101300442B1 (ko) 2005-06-10 2013-08-27 시마 나노 테크 이스라엘 리미티드 강화 투명 전도성 코팅 및 이의 제조 방법
WO2007016342A2 (fr) 2005-07-28 2007-02-08 High Voltage Graphics, Inc. Articles floques comprenant un insert non compatible et un film poreux
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WO2007038950A1 (fr) 2005-09-28 2007-04-12 Stichting Dutch Polymer Institute Procede de production de structures de surfaces metalliques et dispositif correspondant
KR100726591B1 (ko) * 2005-12-22 2007-06-12 재단법인 포항산업과학연구원 무기전도성 잉크용 Ｎｉ계 나노 분말의 제조방법
KR100726592B1 (ko) * 2005-12-23 2007-06-12 재단법인 포항산업과학연구원 무기 전도성 잉크용 나노(ｎａｎｏ) 동(Ｃｕ)분말 제조방법
US20080003130A1 (en) 2006-02-01 2008-01-03 University Of Washington Methods for production of silver nanostructures
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JPH04268381A (ja) * 1991-02-22 1992-09-24 Asahi Chem Ind Co Ltd 銅合金系組成物、それを用いて印刷された成形物、ペーストおよび接着剤
JPH08302405A (ja) * 1994-08-31 1996-11-19 Ultrafine Technol Ltd 高純度超微粒金属粉を製造する方法
JP2001515645A (ja) * 1997-02-20 2001-09-18 パレレック，インコーポレイテッド 導電体製造のための低温方法および組成物
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JP2002164635A (ja) * 2000-06-30 2002-06-07 Seiko Epson Corp 導電膜パターンの形成方法および電気光学装置、電子機器
JP2002121437A (ja) * 2000-10-13 2002-04-23 Ulvac Corporate Center:Kk インクジェット用インク及びその製法
JP2002134878A (ja) * 2000-10-25 2002-05-10 Morimura Chemicals Ltd 配線パターンの形成方法、回路基板の製造方法および遮光パターンの形成された透光体の製造方法

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JP2006210301A (ja) * 2004-12-27 2006-08-10 Mitsui Mining & Smelting Co Ltd 導電性インク
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KR100850771B1 (ko) 2007-02-21 2008-08-06 연세대학교 산학협력단 나노금속잉크 제조방법
JP2011514397A (ja) * 2008-01-30 2011-05-06 ビーエーエスエフ ソシエタス・ヨーロピア 導電性インク
JP2010012714A (ja) * 2008-07-04 2010-01-21 Toda Kogyo Corp 機能性薄膜の製造方法、機能性薄膜、機能性薄膜積層基材の製造方法及び機能性薄膜積層基材
JP2014529875A (ja) * 2011-09-06 2014-11-13 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング 導電性材料およびプロセス
JP2015532669A (ja) * 2012-08-16 2015-11-12 シーマ ナノテック イスラエル リミテッド 透明な導電性コーティングを調製するためのエマルション
JP2018048324A (ja) * 2012-08-16 2018-03-29 シーマ ナノテック イスラエル リミテッド 透明な導電性コーティングを調製するためのエマルション
CN103627255A (zh) * 2013-05-06 2014-03-12 苏州冷石纳米材料科技有限公司 一种纳米银导电墨水及采用该墨水制备的导电薄膜

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