WO2004005413A1 - Nano-encres conductrices frittees a basses temperatures et procede de production de ces dernieres - Google Patents

Nano-encres conductrices frittees a basses temperatures et procede de production de ces dernieres Download PDF

Info

Publication number
WO2004005413A1
WO2004005413A1 PCT/IL2003/000554 IL0300554W WO2004005413A1 WO 2004005413 A1 WO2004005413 A1 WO 2004005413A1 IL 0300554 W IL0300554 W IL 0300554W WO 2004005413 A1 WO2004005413 A1 WO 2004005413A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal
nano
conductive
powder
coated
Prior art date
Application number
PCT/IL2003/000554
Other languages
English (en)
Inventor
Arkady Garbar
Fernando De La Vega
Einat Matzner
Chariana Sokolinsky
Valery Rosenband
Anatoly Kiselev
Original Assignee
Nanopowders Industries Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanopowders Industries Ltd. filed Critical Nanopowders Industries Ltd.
Priority to AU2003237578A priority Critical patent/AU2003237578A1/en
Priority to JP2004519139A priority patent/JP2005531679A/ja
Priority to CN03815904XA priority patent/CN1671805B/zh
Publication of WO2004005413A1 publication Critical patent/WO2004005413A1/fr
Priority to US11/010,948 priority patent/US7736693B2/en
Priority to US11/010,949 priority patent/US7601406B2/en
Priority to US11/010,947 priority patent/US7566360B2/en
Priority to IL16573604A priority patent/IL165736A0/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing

Definitions

  • the present invention relates to low sintering temperatures conductive nano-inks and to a method for producing the same.
  • Metal nano-powder materials are single phase or multi-phase polycrystals, with particle size in the order of a few nanometers (typically 1-100) in at least one dimension. It is well acknowledged that wherein conventional polycrystalline materials grain boundaries account for less than 1% of the volume, in nano structured materials can occupy as much as 50%. Nano particles, specially metal nano particles have hence very special properties which are directly related to their dimensions and to the fact that a large ratio of the atoms in the particle are in the surface of the particle or at particle and grain boundaries. These properties include optical properties, diffusion properties, electrical properties like capacitance, impedance and resistance, catalytic activity and many others.
  • Nano-inks and nano-powders for coatings characterized by a significant electrical conductivity are useful, but not exclusively, for printing of electrical connections in circuits such as, antennas, smart tags, display panels, printed circuit boards, chips and others.
  • U.S. Pat. No. 6,395,214 to Kear et al. discloses another approach and presents a method for fabricating a nano-crystalline ceramic article at respectively low temperature yet by applying very high pressures.
  • their method comprises the steps of (i) synthesizing loosely-agglomerated ceramic nano-powder having a metastable structure; (if) forming the ceramic nano-powder into a compact; and than (Hi) sintering the ceramic nano-powder compact under a pressure of 3 GPa to 5.5 GPa and at a temperature no greater than about 0.6 times the melting temperature of the ceramic nano-powder to form the nano-crystalline article.
  • a useful and cost effective method for sintering nano-particles, and especially electrically conductive nano-ink powders at respectively low temperatures and at ambient pressure is thus a significant industrial need.
  • Fig.l The change of relative resistance for silver nano powders coated with surfactant (1) and washed from surfactant (2);
  • Fig. 2 Relative resistance dependence on temperature for the different particle size silver powders - and measured bulk silver in our measuring system
  • Fig. 3 Relative resistance dependence on temperature for the different particle size copper powders - and measured bulk copper in our measuring system.
  • Said method comprising inter alia the following four steps: (i) admixing metal nano powder in a solvent with at least one ingredient of the group selected from: binder, surfactant, additive, polymer, buffer, dispersant and/or coupling agent in the manner a homogenized solution is obtained; (if) applying the homogenized mixture obtained above on a surface to be coated; ( ) evaporating the solvent from said homogenized mixture; and lastly and most importantly, (iv) sintering the coated layer at temperature range of 50°C to 350°C, providing a conductive ink on top of said surface characterized by resistances between 0.005 ⁇ /square to 5 ⁇ /square.
  • Said sintering is preferably provided at ambient pressure (e.g., about atmospheric pressure).
  • the sintering step is provided at temperature of about 50°C. Alternatively or additionally, it is in the scope of the present invention wherein the sintering step is provided for 0.5 to 2 hours.
  • the present invention also relates to the aforementioned method, wherein the metal nano powder is selected from at least one of the group: metal nano powder; metal nano powder with metal colloids; metal nano powder with a metal reducible salt and/or organic metal complexes and/or organo-metal compounds which decompose to form conductive materials.
  • the concentration of the metal nano-powder in the admixed solution may be between 1% (wt) to 70% (wt). More specifically, the concentration of the metal nano powder in the admixed solution may be between 2% (wt) to 50% (wt).
  • the admixed solution comprising organic solvent or a mixture of organic solvents including UV and thermally curable monomers.
  • concentration of the organic solvent or the mixture of organic solvents in the admixed solution is between 20%) (wt) to 85%> (wt). Most specifically, said range is between 40% (wt) to 80% (wt).
  • the aforementioned solvent is preferably selected from at least one of the group of petroleum ether, hexane, heptanes, toluene, benzene, acrylates, dichloroethane, trichloroethylene, chloroform, dichloromethane, nitromethane, dibromomethane, cyclopentanone, cyclohexanone or any mixture thereof.
  • concentration of the aforementioned binder in the admixed solution is preferably between 0% (wt) to 5% (wt).
  • Said binder may be selected from ethyl cellulose and/or modified urea.
  • the surface to be coated is selected from ceramics, glass, either flexible or relatively non-flexible polymeric films or sheets, polyimides, kepton, polyethylene products, polypropylene, acrylate containing products, polymethyl metaacryalte, e.g., PMMA or Perspex, their co-polymers or any combination thereof, or any printable substrate.
  • the polymeric film comprising at least one of the group of polyesters, polyamides, polycarbonates, polyethylene, polypropylene, their copolymers or any combination thereof.
  • the method is additionally comprises of a step of treating the surface to be coated by a means of corona treatment and/or coating by primer.
  • a primer may be selected from at least one of the group of 3-aminopropyl triethoxy silane, phenyl trimethoxysilane, glycidyl trimethoxysilane, commercially available Tween products, Tween-80, neoalkoxy tri(dioctylpropylphosphato) titanate or any combination thereof.
  • the nano-powder comprising metal or a mixture of metals selected from silver, gold, platinum, palladium, nickel, cobalt, copper or any combination thereof or any other conductive metal.
  • said metal is admixed with metal colloids; metal nano powder with a metal reducible salt and/or organic metal complexes and/or organo-metal compounds which decompose to form conductive materials.
  • the aforementioned method may comprise the step of polymerizing a monomer in the presence of catalyst and/or oxidizing agent and/or reducing agent, in the manner a water miscible polymer is obtained in the homogenized solution.
  • the spreading of the homogenized mixture on a surface to be coated may be provided by a means selected from simple spreading; bar spreading, immersing; spin coating; doping and/or dipping.
  • the coating layer or layers provided by the spreading of the homogenized mixture on a surface to be coated may be characterized by a wet thickness of 1 to 200 microns.
  • the conductive nano-ink as defined above, printed or coated in a predetermined pattern, and to provide a self assembled conductive nano-ink.
  • the conductive nano-ink especially adapted for post treatment of surface; wherein said treatment is selected from scratch resistance, increasing adhesion or a combination thereof.
  • any conductive ink e.g., nano-powders characterized by resistances between 0.005 ⁇ /square to 5 ⁇ /square
  • metal nano-powders obtained by the method defined in any of the above.
  • a novel method of low temperature sintering useful for the production of conductive coatings and inks comprising metal nano-powders is hereby presented. It is according to the present invention that by coating a substrate with an ink, solution or paste that was previously dispersed, cost-effective nano conductive materials and/or conductive transparent coating are produced.
  • the term 'coating' is referring according to the present invention to any conductive layer produced in the manner of admixing metal nano powder in a solvent with at least one ingredient of the group: binder, surfactant, additive, polymer, buffer, dispersant and/or coupling agent in the manner a homogenized solution is obtained; and then sintering at respectively low temperatures of 50 to 300°C.
  • 'ink' is referring according to the present invention to any ink containing nano-powders of metal or metals, especially emulsion based compositions provided for coloring materials, or alternatively, to legend ink (marking ink) suitable for printing on printed circuit boards (PCB's).
  • the term 'ink' is referring according to the present invention to any conductive topical pattern produced in the manner of admixing metal nano powder in a solvent with at least one ingredient of the group: binder, additive, polymer, buffer, dispersant and/or coupling agent in the manner a homogenized solution is obtained; the solution can be admixed, but not essential, with water or water miscible solvent or mixture of water miscible solvents in the manner a W/O type emulsion is obtained; spreading or printing the homogenized mixture obtained above on said surface to be coated; evaporating the solvent from said homogenized mixture in the manner that a self-assembled network-like pattern is developed in situ or a printed pattern or a complete coverage is formed; and than sintering the network-like pattern at respectively low temperatures of 50 to 300°C so a conductive and nano-ink is obtained.
  • the inks can also especially be adapted for use in or on top of transparent substrates.
  • the aforementioned ink is adapted for coating, covering, immersing, dipping, and/or entrapping on top or into either solid or semi-solid matrix, or by means of any other suitable technique on such as glass or any polymer matrix, including flexible, semi-flexible or rigid materials.
  • the present invention discloses the novel properties of the nano metal powders and inks (i.e., conductive-polymers, as well as conductive metals, oxides characterized by D 50 ⁇ 60nm and D 0 ⁇ 100nm). Those properties enable the hereto-defined nano-powders to provide an industrial scale production of flexible electrical circuits on substrates such as polymer films and plastics.
  • nano sized particles and grains that have much larger surface area than bulk materials, characterized by special diffusion properties and can be processed so continuous conductive phase is produced at relative low temperatures and lower energy input.
  • nano metal powder or ink it is according to another embodiment of the present invention to coat a substrate with a nano metal powder or ink.
  • a solution or paste in which the nano metal powder were dispersed and sintered at low temperatures of about 50°C and preferably around 100°C to 220°C, in the manner conductive layers characterized by resistances between 0.005 ⁇ /square to 5 ⁇ /square are obtained
  • any type of substrates can be coated. More particularly, those substrates are selected, yet no limited to glass, poly-carbonate, polymer films or any combination thereof.
  • Silver powders of different sizes were produced through the procedure described in U.S. Pat. No. 5,476,535, which is hereto provided as a reference.
  • the powders are coated with organic materials and de-agglomerated.
  • the volume particle size distribution of these powders, measured in a Coulter Particle Size Analyzer LS 230, are presented in Table 1.
  • figure 1 presenting the change of relative resistance for silver nano powders coated with surfactant (1) and washed from surfactant (2).
  • figure 2 presenting the relative resistance dependence on temperature for the different particle size silver powders - and measured bulk silver in our measuring system.
  • Samples 1, 2 and 3 are nano silver powders; samples 4 and 5 are coarse silver powders with a particle size of over 2.5 ⁇ m (D 0 ). As can be seen nano silver powders achieve better conductivities at lower temperatures. A nano silver powder washed from its coating will give the same performance at even lower temperatures of about 100°C in comparison to around 220°C for the coated powder and over 700°C for coarse silver powders. Table 2: Electrical properties of silver powders
  • Table 3 Electrical properties of different particle size silver powders at different sintering temperatures.
  • Copper powders of different sizes were produced through the procedure described in U.S. Pat. No. 5,476,535, which is hereto provided as a reference.
  • the powders were coated with organic materials and de-agglomerated.
  • Nano metal powders in formulations are nano metal powders in formulations.
  • the formulations are inks or pastes, which facilitate the printing and/or coating process, were prepared according to the general procedures described bellow. Care has to be taken to achieve a good dispersion of the conductive additives (metal nano powders, salts and/or colloids).
  • ink/paste systems were tested. All three have been found to produce a conductive coating at low sintering temperatures.
  • the systems differ in the formulation concept, and main ingredients leading to the conductivity.
  • the main ingredients of the systems are: 1) metal nano powder, 2) metal nano powder with metal colloids, 3) metal nano powder with a metal reducible salt.
  • Admixing a binder e.g., ethyl cellulose), 13% (wt/wt) in a solvent (e.g., terpinol). Then, admixing a conductive nano powder metal (e.g., silver nano powder) (D90 ⁇ 0.1 ⁇ m); 50 parts by weight; terpinol 20 parts by weight, and a coupling agent such as isopropyl dioleic(dioctylphosphato)titanate, also know a the commercially available NDZ-101 KRTTS, 1 parts by weight, to some 25 parts by weight of the solution obtained above, by a means of a high rpm homogenizer.
  • a binder e.g., ethyl cellulose
  • a solvent e.g., terpinol
  • colloidal silver 12 parts by weight; a binder e.g., a binder which is an adhesion promoter, such as Polyvinyl Pyrrolidone (PVP), 2.5 parts by weight; water, 32 parts by weight by a means of an ultrasonic energy and or high rpm dispersing equipment.
  • a binder e.g., a binder which is an adhesion promoter, such as Polyvinyl Pyrrolidone (PVP), 2.5 parts by weight
  • water 32 parts by weight by a means of an ultrasonic energy and or high rpm dispersing equipment.
  • a conductive nano powder metal e.g., silver nano powder
  • solvent e.g., ethanol
  • a conductive nano powder metal e.g., silver nano powder
  • Table 5 Resistance data for nano metal powders ink formulations.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Composite Materials (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Powder Metallurgy (AREA)

Abstract

La présente invention concerne un procédé nouveau et économique de production d'encres conductrices comprenant des nano-poudres de métal. Le procédé comprend les quatre étapes qui consistent (i) à mélanger la poudre de nano-métal dans un solvant avec au moins un ingrédient sélectionné parmi: un liant, un tensioactif, un additif, un polymère, un tampon, un dispersant et/ou un agent de couplage, de manière à former une solution homogène; (ii) à appliquer le mélange homogène obtenu dans l'étape (i) sur une surface devant être recouverte; (iii) à laisser s'évaporer le solvant dudit mélange homogène; et enfin (iv) à fritter la couche déposée dans des conditions de température comprise entre 50 °C et 300 °C, ceci produisant une encre conductrice sur le dessus de ladite surface qui se caractérise par des résistances comprises entre 0,005 O/carré et 5 O/carré. La présente invention se rapporte également à une encre conductrice comprenant des nano-poudres de métal qu'on obtient par un procédé comprenant, entre autres, une étape de frittage à basse température dans des conditions de pression ambiante.
PCT/IL2003/000554 2002-06-13 2003-07-03 Nano-encres conductrices frittees a basses temperatures et procede de production de ces dernieres WO2004005413A1 (fr)

Priority Applications (7)

Application Number Priority Date Filing Date Title
AU2003237578A AU2003237578A1 (en) 2002-07-03 2003-07-03 Low sintering temperatures conductive nano-inks and a method for producing the same
JP2004519139A JP2005531679A (ja) 2002-07-03 2003-07-03 低温焼結導電性ナノインク及びその製造方法
CN03815904XA CN1671805B (zh) 2002-07-03 2003-07-03 烧结温度低的导电纳米油墨及其制备方法
US11/010,948 US7736693B2 (en) 2002-06-13 2004-12-13 Nano-powder-based coating and ink compositions
US11/010,949 US7601406B2 (en) 2002-06-13 2004-12-13 Nano-powder-based coating and ink compositions
US11/010,947 US7566360B2 (en) 2002-06-13 2004-12-13 Nano-powder-based coating and ink compositions
IL16573604A IL165736A0 (en) 2002-07-03 2004-12-13 Low sintering temperatures conductive nano-inks and a method for producing the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US39312302P 2002-07-03 2002-07-03
US60/393,123 2002-07-03

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
PCT/IL2003/000502 Continuation-In-Part WO2003106573A1 (fr) 2002-06-13 2003-06-12 Procede de fabrication de nano-revetements, de nano-encres et de revetements et de nano-poudres conducteurs et transparents et encres ainsi produites

Related Child Applications (4)

Application Number Title Priority Date Filing Date
PCT/IL2003/000502 Continuation-In-Part WO2003106573A1 (fr) 2002-06-13 2003-06-12 Procede de fabrication de nano-revetements, de nano-encres et de revetements et de nano-poudres conducteurs et transparents et encres ainsi produites
US11/010,949 Continuation-In-Part US7601406B2 (en) 2002-06-13 2004-12-13 Nano-powder-based coating and ink compositions
US11/010,947 Continuation-In-Part US7566360B2 (en) 2002-06-13 2004-12-13 Nano-powder-based coating and ink compositions
US11/010,948 Continuation-In-Part US7736693B2 (en) 2002-06-13 2004-12-13 Nano-powder-based coating and ink compositions

Publications (1)

Publication Number Publication Date
WO2004005413A1 true WO2004005413A1 (fr) 2004-01-15

Family

ID=30115548

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IL2003/000554 WO2004005413A1 (fr) 2002-06-13 2003-07-03 Nano-encres conductrices frittees a basses temperatures et procede de production de ces dernieres

Country Status (5)

Country Link
JP (1) JP2005531679A (fr)
KR (1) KR20060012545A (fr)
CN (1) CN1671805B (fr)
AU (1) AU2003237578A1 (fr)
WO (1) WO2004005413A1 (fr)

Cited By (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005229109A (ja) * 2004-02-10 2005-08-25 E I Du Pont De Nemours & Co インクジェット印刷可能な厚膜インク組成物および方法
WO2006049776A2 (fr) * 2004-10-29 2006-05-11 Hewlett-Packard Development Company, L.P. Impression a jet d'encre d'agent de couplages pour des modeles de depot de circuit ou de trace
JP2006152203A (ja) * 2004-12-01 2006-06-15 Mitsui Mining & Smelting Co Ltd Ｉｔｏインク
WO2006070747A1 (fr) * 2004-12-27 2006-07-06 Mitsui Mining & Smelting Co., Ltd. Encre conductrice
WO2006076611A2 (fr) * 2005-01-14 2006-07-20 Cabot Corporation Production de nanoparticules metalliques
WO2006076603A2 (fr) * 2005-01-14 2006-07-20 Cabot Corporation Conducteurs electriques imprimables
EP1716578A2 (fr) * 2004-02-18 2006-11-02 Virginia Tech Intellectual Properties, Inc. Pate metallique nanometrique pour interconnexion et procede d'utilisation
GB2411406B (en) * 2003-01-10 2006-12-06 Qinetiq Nanomaterials Ltd Ink jet deposition of nanoparticles
JP2006332051A (ja) * 2005-05-23 2006-12-07 Samsung Electro-Mechanics Co Ltd 導電性インク、その製造方法および導電性基板
WO2007038950A1 (fr) 2005-09-28 2007-04-12 Stichting Dutch Polymer Institute Procede de production de structures de surfaces metalliques et dispositif correspondant
KR100726592B1 (ko) * 2005-12-23 2007-06-12 재단법인 포항산업과학연구원 무기 전도성 잉크용 나노(ｎａｎｏ) 동(Ｃｕ)분말 제조방법
KR100726591B1 (ko) * 2005-12-22 2007-06-12 재단법인 포항산업과학연구원 무기전도성 잉크용 Ｎｉ계 나노 분말의 제조방법
EP1835512A1 (fr) * 2004-10-08 2007-09-19 Mitsui Mining & Smelting Co., Ltd. Encre conductrice
WO2007128015A2 (fr) * 2006-05-04 2007-11-15 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Procédé de production d'au moins un élément conducteur d'une carte de circuits imprimés, carte de circuits imprimés et utilisation d'un tel procédé
EP1896634A2 (fr) * 2005-06-10 2008-03-12 Cima Nano Tech Israel Ltd Revetements conducteurs transparents renforces et leurs procedes de fabrication
WO2009052120A1 (fr) * 2007-10-15 2009-04-23 Nanoink, Inc. Lithographie d'encres à base de nanoparticules
EP2074055A1 (fr) * 2006-09-29 2009-07-01 LG Chem, Ltd. Encre pour imprimante à jet d'encre et procédé de préparation de nanoparticules métalliques utilisées dans cette encre
US20090269505A1 (en) * 2008-01-31 2009-10-29 Industrial Technology Research Institute Method for manufacturing a substrate with surface structure by employing photothermal effect
KR100951697B1 (ko) 2009-10-30 2010-04-07 주식회사 연안테크놀로지 은 나노 메탈이 함유된 금속 도금층용 잉크 및 그 잉크의 제조방법
US7722786B2 (en) 2007-02-23 2010-05-25 Henkel Ag & Co. Kgaa Conductive materials
EP2194764A1 (fr) 2008-12-04 2010-06-09 Stichting Dutch Polymer Institute Procédé de génération de structures de surface conductrices électriques, appareil associé et utilisation
EP2207407A1 (fr) 2009-01-13 2010-07-14 Stichting Dutch Polymer Institute Procédé de génération de structures de surface conductrices électriques, dispositif et utilisation
EP2251389A1 (fr) * 2005-08-12 2010-11-17 Cambrios Technologies Corporation Conducteurs transparents basés sur des nanofils
CN101597440B (zh) * 2008-06-05 2011-07-27 富葵精密组件(深圳)有限公司 油墨、利用该油墨制作导电线路的方法及线路板
US8167393B2 (en) 2005-01-14 2012-05-01 Cabot Corporation Printable electronic features on non-uniform substrate and processes for making same
US20120114927A1 (en) * 2010-11-03 2012-05-10 Oscar Khaselev Sintering materials and attachment methods using same
US8257795B2 (en) 2004-02-18 2012-09-04 Virginia Tech Intellectual Properties, Inc. Nanoscale metal paste for interconnect and method of use
US8383014B2 (en) 2010-06-15 2013-02-26 Cabot Corporation Metal nanoparticle compositions
WO2013036519A1 (fr) * 2011-09-06 2013-03-14 Henkel Corporation Matériau conducteur et procédé associé
US8404160B2 (en) 2007-05-18 2013-03-26 Applied Nanotech Holdings, Inc. Metallic ink
US8422197B2 (en) 2009-07-15 2013-04-16 Applied Nanotech Holdings, Inc. Applying optical energy to nanoparticles to produce a specified nanostructure
US8506849B2 (en) 2008-03-05 2013-08-13 Applied Nanotech Holdings, Inc. Additives and modifiers for solvent- and water-based metallic conductive inks
US8632700B2 (en) 2008-02-26 2014-01-21 Cambrios Technologies Corporation Methods and compositions for ink jet deposition of conductive features
CN103525199A (zh) * 2013-10-24 2014-01-22 北京印刷学院 一种可免加热后处理纳米尺度铜油墨的制备方法
US8647979B2 (en) 2009-03-27 2014-02-11 Applied Nanotech Holdings, Inc. Buffer layer to enhance photo and/or laser sintering
US8659158B2 (en) 2006-08-16 2014-02-25 Funai Electric Co., Ltd. Thermally inkjettable acrylic dielectric ink formulation and process
EP2753667A1 (fr) * 2011-09-06 2014-07-16 Henkel IP & Holding GmbH Matériau conducteur et procédé associé
WO2014120093A1 (fr) * 2013-01-31 2014-08-07 Agency For Science, Technology And Research Composition d'encre électriquement conductrice et son procédé de préparation
US9145503B2 (en) 2010-12-02 2015-09-29 Korea Institute Of Machinery And Materials Low temperature sintering conductive metal film and preparation method thereof
USRE45802E1 (en) 2005-07-28 2015-11-17 High Voltage Graphics, Inc. Flocked articles having noncompatible insert and porous film
US9193214B2 (en) 2012-10-12 2015-11-24 High Voltage Graphics, Inc. Flexible heat sealable decorative articles and method for making the same
KR101610790B1 (ko) 2008-07-02 2016-04-12 어플라이드 나노테크 홀딩스, 인크. 금속 페이스트 및 잉크
US9730333B2 (en) 2008-05-15 2017-08-08 Applied Nanotech Holdings, Inc. Photo-curing process for metallic inks
US10301496B2 (en) 2013-08-16 2019-05-28 Henkel IP & Holding GmbH Submicron silver particle ink compositions, process and applications
US10384936B2 (en) 2002-12-09 2019-08-20 University Of Washington Methods of nanostructure formation and shape selection
US10981231B2 (en) 2006-02-01 2021-04-20 University Of Washington Methods for production of silver nanostructures
CN113831864A (zh) * 2021-11-11 2021-12-24 苏州诺菲纳米科技有限公司 单层纳米银线可剥导电胶及其制备方法
US11212916B2 (en) 2018-05-08 2021-12-28 W. L. Gore & Associates, Inc. Flexible printed circuits for dermal applications
US11330711B2 (en) 2018-05-08 2022-05-10 W. L. Gore & Associates, Inc. Flexible and durable printed circuits on stretchable and non-stretchable substrates
US11412609B2 (en) 2018-05-08 2022-08-09 W. L. Gore & Associates, Inc. Flexible and stretchable printed circuits on stretchable substrates
US11535017B2 (en) 2017-04-04 2022-12-27 W. L. Gore & Associates Gmbh Dielectric composite with reinforced elastomer and integrate electrode

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4721677B2 (ja) * 2004-09-06 2011-07-13 株式会社秀峰 印刷または塗布画像作成方法、およびそれによる、印刷または塗布画像体
JP5096735B2 (ja) 2006-12-05 2012-12-12 Ｊｘ日鉱日石エネルギー株式会社 ワイヤグリッド型偏光子及びその製造方法、並びにそれを用いた位相差フィルム及び液晶表示素子
KR100850771B1 (ko) 2007-02-21 2008-08-06 연세대학교 산학협력단 나노금속잉크 제조방법
KR100865124B1 (ko) * 2007-04-13 2008-10-24 삼성전기주식회사 잉크젯용 금속 잉크 조성물
US8308993B2 (en) * 2008-01-30 2012-11-13 Basf Se Conductive inks
JP2010012714A (ja) * 2008-07-04 2010-01-21 Toda Kogyo Corp 機能性薄膜の製造方法、機能性薄膜、機能性薄膜積層基材の製造方法及び機能性薄膜積層基材
KR101293914B1 (ko) * 2010-02-18 2013-08-07 (주)덕산테코피아 도전성 잉크 및 이를 이용한 전자소자
CN101805538B (zh) * 2010-04-08 2014-05-07 中国科学院宁波材料技术与工程研究所 可低温烧结的导电墨水
WO2012103285A2 (fr) * 2011-01-29 2012-08-02 Pchem Associates, Inc. Procédés et systèmes de réalisation d'un substrat sensiblement transparent et conducteur
CN102522342A (zh) * 2011-12-27 2012-06-27 日月光半导体制造股份有限公司 半导体结构及其制造方法
KR20150052083A (ko) * 2012-08-16 2015-05-13 시마 나노 테크 이스라엘 리미티드 투명한 전도성 코팅을 제조하기 위한 에멀션
US10040960B2 (en) * 2012-09-28 2018-08-07 Toppan Forms Co., Ltd. Silver ink composition, conductor and communication device
CN103627255B (zh) * 2013-05-06 2015-05-20 苏州冷石纳米材料科技有限公司 一种纳米银导电墨水及采用该墨水制备的导电薄膜
KR102490064B1 (ko) * 2020-11-27 2023-01-19 한국전자기술연구원 전도성 잉크 조성물 및 이를 이용한 전도성 기판

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0977212A2 (fr) * 1998-07-31 2000-02-02 International Business Machines Corporation Méthode de fabrication de nanoparticules en métaux de transition
WO2001030520A1 (fr) * 1999-10-22 2001-05-03 Chrysalis Technologies Incorporated Poudres intermetalliques nanometriques
US6379745B1 (en) * 1997-02-20 2002-04-30 Parelec, Inc. Low temperature method and compositions for producing electrical conductors

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2837910B2 (ja) * 1990-03-01 1998-12-16 チタン工業株式会社 エマルション型液膜法を利用する貴金属微粒子の製造方法
JPH0821254B2 (ja) * 1991-02-22 1996-03-04 旭化成工業株式会社 銅合金系組成物、それを用いて印刷された成形物、ペーストおよび接着剤
JP2955985B2 (ja) * 1994-08-31 1999-10-04 ナノパウダース インダストリーズ（イスラエル）リミテッド 高純度超微粒金属粉を製造する方法
CA2280115C (fr) * 1997-02-20 2007-11-13 Partnerships Limited, Inc. Procede et compositions a basse temperature pour la production de conducteurs electriques
JP3266066B2 (ja) * 1997-09-05 2002-03-18 三菱マテリアル株式会社 保存安定性に優れた金属微粒子含有導電膜形成用組成物
JP3646784B2 (ja) * 2000-03-31 2005-05-11 セイコーエプソン株式会社 薄膜パタ−ンの製造方法および微細構造体
JP2001325831A (ja) * 2000-05-12 2001-11-22 Bando Chem Ind Ltd 金属コロイド液、導電性インク、導電性被膜及び導電性被膜形成用基底塗膜
US6734029B2 (en) * 2000-06-30 2004-05-11 Seiko Epson Corporation Method for forming conductive film pattern, and electro-optical device and electronic apparatus
JP5008216B2 (ja) * 2000-10-13 2012-08-22 株式会社アルバック インクジェット用インクの製法
JP4355436B2 (ja) * 2000-10-25 2009-11-04 森村ケミカル株式会社 配線パターンの形成方法、回路基板の製造方法および遮光パターンの形成された透光体の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6379745B1 (en) * 1997-02-20 2002-04-30 Parelec, Inc. Low temperature method and compositions for producing electrical conductors
EP0977212A2 (fr) * 1998-07-31 2000-02-02 International Business Machines Corporation Méthode de fabrication de nanoparticules en métaux de transition
WO2001030520A1 (fr) * 1999-10-22 2001-05-03 Chrysalis Technologies Incorporated Poudres intermetalliques nanometriques

Cited By (79)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10384936B2 (en) 2002-12-09 2019-08-20 University Of Washington Methods of nanostructure formation and shape selection
US11471939B2 (en) 2002-12-09 2022-10-18 University Of Washington Methods of nanostructure formation and shape selection
GB2411406B (en) * 2003-01-10 2006-12-06 Qinetiq Nanomaterials Ltd Ink jet deposition of nanoparticles
JP2005229109A (ja) * 2004-02-10 2005-08-25 E I Du Pont De Nemours & Co インクジェット印刷可能な厚膜インク組成物および方法
EP1716578A4 (fr) * 2004-02-18 2009-11-11 Virginia Tech Intell Prop Pate metallique nanometrique pour interconnexion et procede d'utilisation
EP1716578A2 (fr) * 2004-02-18 2006-11-02 Virginia Tech Intellectual Properties, Inc. Pate metallique nanometrique pour interconnexion et procede d'utilisation
US8257795B2 (en) 2004-02-18 2012-09-04 Virginia Tech Intellectual Properties, Inc. Nanoscale metal paste for interconnect and method of use
EP1835512A1 (fr) * 2004-10-08 2007-09-19 Mitsui Mining & Smelting Co., Ltd. Encre conductrice
EP1835512A4 (fr) * 2004-10-08 2008-02-20 Mitsui Mining & Smelting Co Encre conductrice
WO2006049776A3 (fr) * 2004-10-29 2006-07-13 Hewlett Packard Development Co Impression a jet d'encre d'agent de couplages pour des modeles de depot de circuit ou de trace
WO2006049776A2 (fr) * 2004-10-29 2006-05-11 Hewlett-Packard Development Company, L.P. Impression a jet d'encre d'agent de couplages pour des modeles de depot de circuit ou de trace
JP2006152203A (ja) * 2004-12-01 2006-06-15 Mitsui Mining & Smelting Co Ltd Ｉｔｏインク
WO2006070747A1 (fr) * 2004-12-27 2006-07-06 Mitsui Mining & Smelting Co., Ltd. Encre conductrice
US8043535B2 (en) 2004-12-27 2011-10-25 Mitsui Mining & Smelting Co., Ltd. Conductive ink
WO2006076611A2 (fr) * 2005-01-14 2006-07-20 Cabot Corporation Production de nanoparticules metalliques
US8167393B2 (en) 2005-01-14 2012-05-01 Cabot Corporation Printable electronic features on non-uniform substrate and processes for making same
WO2006076611A3 (fr) * 2005-01-14 2007-03-01 Cabot Corp Production de nanoparticules metalliques
WO2006076603A3 (fr) * 2005-01-14 2006-11-16 Cabot Corp Conducteurs electriques imprimables
US7749299B2 (en) 2005-01-14 2010-07-06 Cabot Corporation Production of metal nanoparticles
WO2006076603A2 (fr) * 2005-01-14 2006-07-20 Cabot Corporation Conducteurs electriques imprimables
US8668848B2 (en) 2005-01-14 2014-03-11 Cabot Corporation Metal nanoparticle compositions for reflective features
JP4562688B2 (ja) * 2005-05-23 2010-10-13 サムソン エレクトロ−メカニックス カンパニーリミテッド． 導電性インク、その製造方法および導電性基板
JP2006332051A (ja) * 2005-05-23 2006-12-07 Samsung Electro-Mechanics Co Ltd 導電性インク、その製造方法および導電性基板
EP1896634A2 (fr) * 2005-06-10 2008-03-12 Cima Nano Tech Israel Ltd Revetements conducteurs transparents renforces et leurs procedes de fabrication
EP1896634A4 (fr) * 2005-06-10 2012-01-04 Cima Nano Tech Israel Ltd Revetements conducteurs transparents renforces et leurs procedes de fabrication
US8105472B2 (en) 2005-06-10 2012-01-31 Cima Nanotech Israel Ltd. Enhanced transparent conductive coatings and methods for making them
USRE45802E1 (en) 2005-07-28 2015-11-17 High Voltage Graphics, Inc. Flocked articles having noncompatible insert and porous film
US8618531B2 (en) 2005-08-12 2013-12-31 Cambrios Technologies Corporation Transparent conductors comprising metal nanowires
CN102250506A (zh) * 2005-08-12 2011-11-23 凯博瑞奥斯技术公司 基于纳米线的透明导体
EP2251389A1 (fr) * 2005-08-12 2010-11-17 Cambrios Technologies Corporation Conducteurs transparents basés sur des nanofils
US9899123B2 (en) 2005-08-12 2018-02-20 Jonathan S. Alden Nanowires-based transparent conductors
US8865027B2 (en) 2005-08-12 2014-10-21 Cambrios Technologies Corporation Nanowires-based transparent conductors
US8049333B2 (en) 2005-08-12 2011-11-01 Cambrios Technologies Corporation Transparent conductors comprising metal nanowires
WO2007038950A1 (fr) 2005-09-28 2007-04-12 Stichting Dutch Polymer Institute Procede de production de structures de surfaces metalliques et dispositif correspondant
KR100726591B1 (ko) * 2005-12-22 2007-06-12 재단법인 포항산업과학연구원 무기전도성 잉크용 Ｎｉ계 나노 분말의 제조방법
KR100726592B1 (ko) * 2005-12-23 2007-06-12 재단법인 포항산업과학연구원 무기 전도성 잉크용 나노(ｎａｎｏ) 동(Ｃｕ)분말 제조방법
US10981231B2 (en) 2006-02-01 2021-04-20 University Of Washington Methods for production of silver nanostructures
WO2007128015A3 (fr) * 2006-05-04 2008-03-27 Austria Tech & System Tech Procédé de production d'au moins un élément conducteur d'une carte de circuits imprimés, carte de circuits imprimés et utilisation d'un tel procédé
WO2007128015A2 (fr) * 2006-05-04 2007-11-15 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Procédé de production d'au moins un élément conducteur d'une carte de circuits imprimés, carte de circuits imprimés et utilisation d'un tel procédé
US8659158B2 (en) 2006-08-16 2014-02-25 Funai Electric Co., Ltd. Thermally inkjettable acrylic dielectric ink formulation and process
US11708503B2 (en) 2006-08-16 2023-07-25 Funai Electric Holdings Co., Ltd. Thermally inkjettable acrylic dielectric ink formulation and process
US10703922B2 (en) 2006-08-16 2020-07-07 Funai Electric Co., Ltd. Thermally inkjettable acrylic dielectric ink formulation and process
EP2074055A4 (fr) * 2006-09-29 2011-03-23 Lg Chemical Ltd Encre pour imprimante à jet d'encre et procédé de préparation de nanoparticules métalliques utilisées dans cette encre
EP2074055A1 (fr) * 2006-09-29 2009-07-01 LG Chem, Ltd. Encre pour imprimante à jet d'encre et procédé de préparation de nanoparticules métalliques utilisées dans cette encre
US7722786B2 (en) 2007-02-23 2010-05-25 Henkel Ag & Co. Kgaa Conductive materials
US8404160B2 (en) 2007-05-18 2013-03-26 Applied Nanotech Holdings, Inc. Metallic ink
WO2009052120A1 (fr) * 2007-10-15 2009-04-23 Nanoink, Inc. Lithographie d'encres à base de nanoparticules
US20090269505A1 (en) * 2008-01-31 2009-10-29 Industrial Technology Research Institute Method for manufacturing a substrate with surface structure by employing photothermal effect
US8632700B2 (en) 2008-02-26 2014-01-21 Cambrios Technologies Corporation Methods and compositions for ink jet deposition of conductive features
US8815126B2 (en) 2008-02-26 2014-08-26 Cambrios Technologies Corporation Method and composition for screen printing of conductive features
US8506849B2 (en) 2008-03-05 2013-08-13 Applied Nanotech Holdings, Inc. Additives and modifiers for solvent- and water-based metallic conductive inks
US9730333B2 (en) 2008-05-15 2017-08-08 Applied Nanotech Holdings, Inc. Photo-curing process for metallic inks
CN101597440B (zh) * 2008-06-05 2011-07-27 富葵精密组件(深圳)有限公司 油墨、利用该油墨制作导电线路的方法及线路板
KR101610790B1 (ko) 2008-07-02 2016-04-12 어플라이드 나노테크 홀딩스, 인크. 금속 페이스트 및 잉크
WO2010063481A1 (fr) * 2008-12-04 2010-06-10 Stichting Dutch Polymer Institute Procédé de génération de structures de surface électriquement conductrices, appareil associé et utilisation
EP2194764A1 (fr) 2008-12-04 2010-06-09 Stichting Dutch Polymer Institute Procédé de génération de structures de surface conductrices électriques, appareil associé et utilisation
WO2010081677A1 (fr) 2009-01-13 2010-07-22 Stichting Dutch Polymer Institute Procédé de réalisation de structures à surfaces électroconductrices, dispositif et utilisation
EP2207407A1 (fr) 2009-01-13 2010-07-14 Stichting Dutch Polymer Institute Procédé de génération de structures de surface conductrices électriques, dispositif et utilisation
US8647979B2 (en) 2009-03-27 2014-02-11 Applied Nanotech Holdings, Inc. Buffer layer to enhance photo and/or laser sintering
US9131610B2 (en) 2009-03-27 2015-09-08 Pen Inc. Buffer layer for sintering
US8422197B2 (en) 2009-07-15 2013-04-16 Applied Nanotech Holdings, Inc. Applying optical energy to nanoparticles to produce a specified nanostructure
KR100951697B1 (ko) 2009-10-30 2010-04-07 주식회사 연안테크놀로지 은 나노 메탈이 함유된 금속 도금층용 잉크 및 그 잉크의 제조방법
US8383014B2 (en) 2010-06-15 2013-02-26 Cabot Corporation Metal nanoparticle compositions
US10535628B2 (en) * 2010-11-03 2020-01-14 Alpha Assembly Solutions Inc. Sintering materials and attachment methods using same
US20120114927A1 (en) * 2010-11-03 2012-05-10 Oscar Khaselev Sintering materials and attachment methods using same
US9145503B2 (en) 2010-12-02 2015-09-29 Korea Institute Of Machinery And Materials Low temperature sintering conductive metal film and preparation method thereof
WO2013036519A1 (fr) * 2011-09-06 2013-03-14 Henkel Corporation Matériau conducteur et procédé associé
EP2753667A4 (fr) * 2011-09-06 2015-04-29 Henkel IP & Holding GmbH Matériau conducteur et procédé associé
EP2753667A1 (fr) * 2011-09-06 2014-07-16 Henkel IP & Holding GmbH Matériau conducteur et procédé associé
US10999933B2 (en) 2011-09-06 2021-05-04 Henkel IP & Holding GmbH Conductive material and process
US9193214B2 (en) 2012-10-12 2015-11-24 High Voltage Graphics, Inc. Flexible heat sealable decorative articles and method for making the same
WO2014120093A1 (fr) * 2013-01-31 2014-08-07 Agency For Science, Technology And Research Composition d'encre électriquement conductrice et son procédé de préparation
US10301496B2 (en) 2013-08-16 2019-05-28 Henkel IP & Holding GmbH Submicron silver particle ink compositions, process and applications
CN103525199A (zh) * 2013-10-24 2014-01-22 北京印刷学院 一种可免加热后处理纳米尺度铜油墨的制备方法
US11535017B2 (en) 2017-04-04 2022-12-27 W. L. Gore & Associates Gmbh Dielectric composite with reinforced elastomer and integrate electrode
US11330711B2 (en) 2018-05-08 2022-05-10 W. L. Gore & Associates, Inc. Flexible and durable printed circuits on stretchable and non-stretchable substrates
US11412609B2 (en) 2018-05-08 2022-08-09 W. L. Gore & Associates, Inc. Flexible and stretchable printed circuits on stretchable substrates
US11212916B2 (en) 2018-05-08 2021-12-28 W. L. Gore & Associates, Inc. Flexible printed circuits for dermal applications
CN113831864A (zh) * 2021-11-11 2021-12-24 苏州诺菲纳米科技有限公司 单层纳米银线可剥导电胶及其制备方法

Also Published As

Publication number Publication date
JP2005531679A (ja) 2005-10-20
CN1671805B (zh) 2010-05-26
AU2003237578A1 (en) 2004-01-23
CN1671805A (zh) 2005-09-21
KR20060012545A (ko) 2006-02-08

Similar Documents

Publication Publication Date Title
WO2004005413A1 (fr) Nano-encres conductrices frittees a basses temperatures et procede de production de ces dernieres
EP1521811B1 (fr) Procede de fabrication de nano-revetements, de revetements et de nano-poudres conducteurs et transparents
US10244628B2 (en) Printed electronics
AU2008229178B2 (en) Shielding based on metallic nanoparticle compositions and devices and methods thereof
KR101247431B1 (ko) 구리 도체막 및 그 제조방법, 도전성 기판 및 그 제조방법, 구리 도체 배선 및 그 제조방법, 및 처리액
US7566360B2 (en) Nano-powder-based coating and ink compositions
US7736693B2 (en) Nano-powder-based coating and ink compositions
CN102224190B (zh) 应用于rfid和其他应用的高导电性聚合物厚膜银导体组合物
EP2204824A1 (fr) Procédé de formation de motif de câblage en cuivre et dispersion de particules d'oxyde de cuivre pour l'utilisation dans celui-ci
KR20150064054A (ko) 은 하이브리드 구리분과 그의 제조법, 상기 은 하이브리드 구리분을 함유하는 도전성 페이스트, 도전성 접착제, 도전성 막 및 전기 회로
JP2009181946A (ja) 導電性基板及びその製造方法
CN101908388B (zh) 纳米点状材料的形成方法

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 2004519139

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 1020047021518

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 2003815904X

Country of ref document: CN

122 Ep: pct application non-entry in european phase
WWP Wipo information: published in national office

Ref document number: 1020047021518

Country of ref document: KR