JP2005531679A - 低温焼結導電性ナノインク及びその製造方法 - Google Patents

低温焼結導電性ナノインク及びその製造方法 Download PDF

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Publication number
JP2005531679A
JP2005531679A JP2004519139A JP2004519139A JP2005531679A JP 2005531679 A JP2005531679 A JP 2005531679A JP 2004519139 A JP2004519139 A JP 2004519139A JP 2004519139 A JP2004519139 A JP 2004519139A JP 2005531679 A JP2005531679 A JP 2005531679A
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metal
nanopowder
mixture
conductive
sintering
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JP2005531679A5 (enExample
Inventor
ガーバー，アーケディ
ラ ヴェガ，フェルナンド デ
マッツナー，エイナット
ソコリンスカイ，チャリアナ
ローゼンバンド，ヴァレリー
キセレフ，アナトリー
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ナノパウダーズ インダストリーズ リミテッド
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Publication of JP2005531679A publication Critical patent/JP2005531679A/ja
Publication of JP2005531679A5 publication Critical patent/JP2005531679A5/ja
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Composite Materials (AREA)
  • Dispersion Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Powder Metallurgy (AREA)
JP2004519139A 2002-07-03 2003-07-03 低温焼結導電性ナノインク及びその製造方法 Pending JP2005531679A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US39312302P 2002-07-03 2002-07-03
PCT/IL2003/000554 WO2004005413A1 (en) 2002-07-03 2003-07-03 Low sintering temperatures conductive nano-inks and a method for producing the same

Publications (2)

Publication Number Publication Date
JP2005531679A true JP2005531679A (ja) 2005-10-20
JP2005531679A5 JP2005531679A5 (enExample) 2006-08-10

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Family Applications (1)

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JP2004519139A Pending JP2005531679A (ja) 2002-07-03 2003-07-03 低温焼結導電性ナノインク及びその製造方法

Country Status (5)

Country Link
JP (1) JP2005531679A (enExample)
KR (1) KR20060012545A (enExample)
CN (1) CN1671805B (enExample)
AU (1) AU2003237578A1 (enExample)
WO (1) WO2004005413A1 (enExample)

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JP2006069167A (ja) * 2004-09-06 2006-03-16 Shuho:Kk 印刷または塗布画像作成方法、およびそれによる、印刷または塗布画像体
JP2006210301A (ja) * 2004-12-27 2006-08-10 Mitsui Mining & Smelting Co Ltd 導電性インク
WO2008069008A1 (ja) 2006-12-05 2008-06-12 Nippon Oil Corporation ワイヤグリッド型偏光子及びその製造方法、並びにそれを用いた位相差フィルム及び液晶表示素子
KR100850771B1 (ko) 2007-02-21 2008-08-06 연세대학교 산학협력단 나노금속잉크 제조방법
JP2010012714A (ja) * 2008-07-04 2010-01-21 Toda Kogyo Corp 機能性薄膜の製造方法、機能性薄膜、機能性薄膜積層基材の製造方法及び機能性薄膜積層基材
JP2011514397A (ja) * 2008-01-30 2011-05-06 ビーエーエスエフ ソシエタス・ヨーロピア 導電性インク
CN103627255A (zh) * 2013-05-06 2014-03-12 苏州冷石纳米材料科技有限公司 一种纳米银导电墨水及采用该墨水制备的导电薄膜
JP2014529875A (ja) * 2011-09-06 2014-11-13 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング 導電性材料およびプロセス
JP2015532669A (ja) * 2012-08-16 2015-11-12 シーマ ナノテック イスラエル リミテッド 透明な導電性コーティングを調製するためのエマルション

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WO1998036888A1 (en) 1997-02-24 1998-08-27 Superior Micropowders Llc Aerosol method and apparatus, particulate products, and electronic devices made therefrom
US7344769B1 (en) 2000-07-24 2008-03-18 High Voltage Graphics, Inc. Flocked transfer and article of manufacture including the flocked transfer
US7364782B2 (en) 2000-07-24 2008-04-29 High Voltage Graphics, Inc. Flocked transfer and article of manufacture including the application of the transfer by thermoplastic polymer film
WO2004005415A2 (en) 2002-07-03 2004-01-15 High Voltage Graphics, Inc. Flocked stretchable design or transfer
US7585349B2 (en) 2002-12-09 2009-09-08 The University Of Washington Methods of nanostructure formation and shape selection
GB0300529D0 (en) * 2003-01-10 2003-02-12 Qinetiq Nanomaterials Ltd Improvements in and relating to ink jet deposition
US7393576B2 (en) 2004-01-16 2008-07-01 High Voltage Graphics, Inc. Process for printing and molding a flocked article
US20050173680A1 (en) * 2004-02-10 2005-08-11 Haixin Yang Ink jet printable thick film ink compositions and processes
KR20070033329A (ko) * 2004-02-18 2007-03-26 버지니아 테크 인터렉추얼 프라퍼티스, 인크. 인터커넥트를 위한 나노 크기의 금속 페이스트 및 이의사용 방법
US8257795B2 (en) 2004-02-18 2012-09-04 Virginia Tech Intellectual Properties, Inc. Nanoscale metal paste for interconnect and method of use
EP1835512B1 (en) * 2004-10-08 2010-05-12 Mitsui Mining & Smelting Co., Ltd. Conductive ink
US20060093732A1 (en) * 2004-10-29 2006-05-04 David Schut Ink-jet printing of coupling agents for trace or circuit deposition templating
JP4756628B2 (ja) * 2004-12-01 2011-08-24 三井金属鉱業株式会社 水系ｉｔｏインク
US8167393B2 (en) 2005-01-14 2012-05-01 Cabot Corporation Printable electronic features on non-uniform substrate and processes for making same
US8383014B2 (en) 2010-06-15 2013-02-26 Cabot Corporation Metal nanoparticle compositions
US20060163744A1 (en) * 2005-01-14 2006-07-27 Cabot Corporation Printable electrical conductors
WO2006076612A2 (en) 2005-01-14 2006-07-20 Cabot Corporation A process for manufacturing application specific printable circuits (aspc’s) and other custom electronic devices
KR100690360B1 (ko) * 2005-05-23 2007-03-09 삼성전기주식회사 도전성 잉크, 그 제조방법 및 도전성 기판
JP5009907B2 (ja) * 2005-06-10 2012-08-29 シーマ ナノ テック イスラエル リミティド 向上透明導電性被膜及びそれらを作製する方法
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KR100726592B1 (ko) * 2005-12-23 2007-06-12 재단법인 포항산업과학연구원 무기 전도성 잉크용 나노(ｎａｎｏ) 동(Ｃｕ)분말 제조방법
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JP2011514397A (ja) * 2008-01-30 2011-05-06 ビーエーエスエフ ソシエタス・ヨーロピア 導電性インク
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JP2014529875A (ja) * 2011-09-06 2014-11-13 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング 導電性材料およびプロセス
JP2015532669A (ja) * 2012-08-16 2015-11-12 シーマ ナノテック イスラエル リミテッド 透明な導電性コーティングを調製するためのエマルション
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