KR20060012545A - 저온 소결처리한 전도성 나노 잉크 및 이것의 제조 방법 - Google Patents
저온 소결처리한 전도성 나노 잉크 및 이것의 제조 방법 Download PDFInfo
- Publication number
- KR20060012545A KR20060012545A KR1020047021518A KR20047021518A KR20060012545A KR 20060012545 A KR20060012545 A KR 20060012545A KR 1020047021518 A KR1020047021518 A KR 1020047021518A KR 20047021518 A KR20047021518 A KR 20047021518A KR 20060012545 A KR20060012545 A KR 20060012545A
- Authority
- KR
- South Korea
- Prior art keywords
- metal
- conductive
- coated
- nano
- ink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Composite Materials (AREA)
- Dispersion Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Conductive Materials (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Powder Metallurgy (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US39312302P | 2002-07-03 | 2002-07-03 | |
| US60/393,123 | 2002-07-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20060012545A true KR20060012545A (ko) | 2006-02-08 |
Family
ID=30115548
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020047021518A Ceased KR20060012545A (ko) | 2002-07-03 | 2003-07-03 | 저온 소결처리한 전도성 나노 잉크 및 이것의 제조 방법 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP2005531679A (enExample) |
| KR (1) | KR20060012545A (enExample) |
| CN (1) | CN1671805B (enExample) |
| AU (1) | AU2003237578A1 (enExample) |
| WO (1) | WO2004005413A1 (enExample) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100865124B1 (ko) * | 2007-04-13 | 2008-10-24 | 삼성전기주식회사 | 잉크젯용 금속 잉크 조성물 |
| WO2011102659A3 (ko) * | 2010-02-18 | 2012-02-02 | (주)덕산테코피아 | 도전성 잉크 및 이를 이용한 전자소자 |
| WO2012074200A3 (ko) * | 2010-12-02 | 2012-07-26 | 한국기계연구원 | 저온소결 전도성 금속막 및 이의 제조방법 |
| WO2012103285A3 (en) * | 2011-01-29 | 2012-11-15 | Pchem Associates, Inc. | Methods and systems for generating a substantially transparent and conductive substrate |
| KR20220074369A (ko) * | 2020-11-27 | 2022-06-03 | 한국전자기술연구원 | 전도성 잉크 조성물 및 이를 이용한 전도성 기판 |
Families Citing this family (65)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998036888A1 (en) | 1997-02-24 | 1998-08-27 | Superior Micropowders Llc | Aerosol method and apparatus, particulate products, and electronic devices made therefrom |
| US7344769B1 (en) | 2000-07-24 | 2008-03-18 | High Voltage Graphics, Inc. | Flocked transfer and article of manufacture including the flocked transfer |
| US7364782B2 (en) | 2000-07-24 | 2008-04-29 | High Voltage Graphics, Inc. | Flocked transfer and article of manufacture including the application of the transfer by thermoplastic polymer film |
| WO2004005415A2 (en) | 2002-07-03 | 2004-01-15 | High Voltage Graphics, Inc. | Flocked stretchable design or transfer |
| US7585349B2 (en) | 2002-12-09 | 2009-09-08 | The University Of Washington | Methods of nanostructure formation and shape selection |
| GB0300529D0 (en) * | 2003-01-10 | 2003-02-12 | Qinetiq Nanomaterials Ltd | Improvements in and relating to ink jet deposition |
| US7393576B2 (en) | 2004-01-16 | 2008-07-01 | High Voltage Graphics, Inc. | Process for printing and molding a flocked article |
| US20050173680A1 (en) * | 2004-02-10 | 2005-08-11 | Haixin Yang | Ink jet printable thick film ink compositions and processes |
| KR20070033329A (ko) * | 2004-02-18 | 2007-03-26 | 버지니아 테크 인터렉추얼 프라퍼티스, 인크. | 인터커넥트를 위한 나노 크기의 금속 페이스트 및 이의사용 방법 |
| US8257795B2 (en) | 2004-02-18 | 2012-09-04 | Virginia Tech Intellectual Properties, Inc. | Nanoscale metal paste for interconnect and method of use |
| JP4721677B2 (ja) * | 2004-09-06 | 2011-07-13 | 株式会社秀峰 | 印刷または塗布画像作成方法、およびそれによる、印刷または塗布画像体 |
| EP1835512B1 (en) * | 2004-10-08 | 2010-05-12 | Mitsui Mining & Smelting Co., Ltd. | Conductive ink |
| US20060093732A1 (en) * | 2004-10-29 | 2006-05-04 | David Schut | Ink-jet printing of coupling agents for trace or circuit deposition templating |
| JP4756628B2 (ja) * | 2004-12-01 | 2011-08-24 | 三井金属鉱業株式会社 | 水系itoインク |
| JP4799881B2 (ja) * | 2004-12-27 | 2011-10-26 | 三井金属鉱業株式会社 | 導電性インク |
| US8167393B2 (en) | 2005-01-14 | 2012-05-01 | Cabot Corporation | Printable electronic features on non-uniform substrate and processes for making same |
| US8383014B2 (en) | 2010-06-15 | 2013-02-26 | Cabot Corporation | Metal nanoparticle compositions |
| US20060163744A1 (en) * | 2005-01-14 | 2006-07-27 | Cabot Corporation | Printable electrical conductors |
| WO2006076612A2 (en) | 2005-01-14 | 2006-07-20 | Cabot Corporation | A process for manufacturing application specific printable circuits (aspc’s) and other custom electronic devices |
| KR100690360B1 (ko) * | 2005-05-23 | 2007-03-09 | 삼성전기주식회사 | 도전성 잉크, 그 제조방법 및 도전성 기판 |
| JP5009907B2 (ja) * | 2005-06-10 | 2012-08-29 | シーマ ナノ テック イスラエル リミティド | 向上透明導電性被膜及びそれらを作製する方法 |
| US7799164B2 (en) | 2005-07-28 | 2010-09-21 | High Voltage Graphics, Inc. | Flocked articles having noncompatible insert and porous film |
| EP2477230B1 (en) * | 2005-08-12 | 2015-02-25 | Cambrios Technologies Corporation | Nanowires-based transparent conductors on a flexible donor substrate |
| WO2007038950A1 (en) | 2005-09-28 | 2007-04-12 | Stichting Dutch Polymer Institute | Method for generation of metal surface structures and apparatus therefor |
| KR100726591B1 (ko) * | 2005-12-22 | 2007-06-12 | 재단법인 포항산업과학연구원 | 무기전도성 잉크용 Ni계 나노 분말의 제조방법 |
| KR100726592B1 (ko) * | 2005-12-23 | 2007-06-12 | 재단법인 포항산업과학연구원 | 무기 전도성 잉크용 나노(nano) 동(Cu)분말 제조방법 |
| US20080003130A1 (en) | 2006-02-01 | 2008-01-03 | University Of Washington | Methods for production of silver nanostructures |
| AT9473U1 (de) * | 2006-05-04 | 2007-10-15 | Austria Tech & System Tech | Verfahren zur herstellung wenigstens eines leitfähigen elements einer leiterplatte sowie leiterplatte und verwendung eines derartigen verfahrens |
| US8659158B2 (en) | 2006-08-16 | 2014-02-25 | Funai Electric Co., Ltd. | Thermally inkjettable acrylic dielectric ink formulation and process |
| KR101082146B1 (ko) * | 2006-09-29 | 2011-11-09 | 주식회사 엘지화학 | 잉크젯 프린트용 잉크 및 상기 잉크에 사용되는 금속나노입자의 제조방법 |
| JP5096735B2 (ja) | 2006-12-05 | 2012-12-12 | Jx日鉱日石エネルギー株式会社 | ワイヤグリッド型偏光子及びその製造方法、並びにそれを用いた位相差フィルム及び液晶表示素子 |
| KR100850771B1 (ko) | 2007-02-21 | 2008-08-06 | 연세대학교 산학협력단 | 나노금속잉크 제조방법 |
| US7722786B2 (en) | 2007-02-23 | 2010-05-25 | Henkel Ag & Co. Kgaa | Conductive materials |
| US8404160B2 (en) | 2007-05-18 | 2013-03-26 | Applied Nanotech Holdings, Inc. | Metallic ink |
| WO2009052120A1 (en) * | 2007-10-15 | 2009-04-23 | Nanoink, Inc. | Lithography of nanoparticle based inks |
| US8308993B2 (en) * | 2008-01-30 | 2012-11-13 | Basf Se | Conductive inks |
| TWI401205B (zh) * | 2008-01-31 | 2013-07-11 | Ind Tech Res Inst | 利用光熱效應製作應用基板的方法 |
| US8815126B2 (en) | 2008-02-26 | 2014-08-26 | Cambrios Technologies Corporation | Method and composition for screen printing of conductive features |
| US8506849B2 (en) | 2008-03-05 | 2013-08-13 | Applied Nanotech Holdings, Inc. | Additives and modifiers for solvent- and water-based metallic conductive inks |
| US9730333B2 (en) | 2008-05-15 | 2017-08-08 | Applied Nanotech Holdings, Inc. | Photo-curing process for metallic inks |
| CN101597440B (zh) * | 2008-06-05 | 2011-07-27 | 富葵精密组件(深圳)有限公司 | 油墨、利用该油墨制作导电线路的方法及线路板 |
| US20100000762A1 (en) | 2008-07-02 | 2010-01-07 | Applied Nanotech Holdings, Inc. | Metallic pastes and inks |
| JP2010012714A (ja) * | 2008-07-04 | 2010-01-21 | Toda Kogyo Corp | 機能性薄膜の製造方法、機能性薄膜、機能性薄膜積層基材の製造方法及び機能性薄膜積層基材 |
| EP2194764A1 (en) | 2008-12-04 | 2010-06-09 | Stichting Dutch Polymer Institute | Method for generation of electrically conducting surface structures, apparatus therefor and use |
| EP2207407A1 (en) | 2009-01-13 | 2010-07-14 | Stichting Dutch Polymer Institute | Method for generation of electrically conducting surface structures, device and use |
| KR101735710B1 (ko) | 2009-03-27 | 2017-05-15 | 어플라이드 나노테크 홀딩스, 인크. | 광 및/또는 레이저 소결을 향상시키기 위한 버퍼층 |
| US8422197B2 (en) | 2009-07-15 | 2013-04-16 | Applied Nanotech Holdings, Inc. | Applying optical energy to nanoparticles to produce a specified nanostructure |
| KR100951697B1 (ko) | 2009-10-30 | 2010-04-07 | 주식회사 연안테크놀로지 | 은 나노 메탈이 함유된 금속 도금층용 잉크 및 그 잉크의 제조방법 |
| CN101805538B (zh) * | 2010-04-08 | 2014-05-07 | 中国科学院宁波材料技术与工程研究所 | 可低温烧结的导电墨水 |
| WO2012061511A2 (en) * | 2010-11-03 | 2012-05-10 | Fry's Metals, Inc. | Sintering materials and attachment methods using same |
| KR102020914B1 (ko) * | 2011-09-06 | 2019-09-11 | 헨켈 아이피 앤드 홀딩 게엠베하 | 전도성 물질 및 방법 |
| KR101860603B1 (ko) * | 2011-09-06 | 2018-05-23 | 헨켈 아이피 앤드 홀딩 게엠베하 | 전도성 물질 및 방법 |
| CN102522342A (zh) * | 2011-12-27 | 2012-06-27 | 日月光半导体制造股份有限公司 | 半导体结构及其制造方法 |
| TWI623597B (zh) * | 2012-08-16 | 2018-05-11 | 西瑪奈米技術以色列有限公司 | 用於製造透明導電塗層之乳液 |
| US10040960B2 (en) * | 2012-09-28 | 2018-08-07 | Toppan Forms Co., Ltd. | Silver ink composition, conductor and communication device |
| WO2014059424A2 (en) | 2012-10-12 | 2014-04-17 | High Voltage Graphics, Inc. | Flexible heat sealable decorative articles and method for making the same |
| WO2014120093A1 (en) * | 2013-01-31 | 2014-08-07 | Agency For Science, Technology And Research | Electrically conductive ink composition and method of preparation thereof |
| CN103627255B (zh) * | 2013-05-06 | 2015-05-20 | 苏州冷石纳米材料科技有限公司 | 一种纳米银导电墨水及采用该墨水制备的导电薄膜 |
| EP3033401B1 (en) | 2013-08-16 | 2019-06-05 | Henkel IP & Holding GmbH | Submicron silver particle ink compositions, process and applications |
| CN103525199B (zh) * | 2013-10-24 | 2015-12-02 | 北京印刷学院 | 一种可免加热后处理纳米尺度铜油墨的制备方法 |
| EP3606740B1 (en) | 2017-04-04 | 2021-09-29 | W. L. Gore & Associates GmbH | Dielectric composite with reinforced elastomer and integrated electrode |
| US11330711B2 (en) | 2018-05-08 | 2022-05-10 | W. L. Gore & Associates, Inc. | Flexible and durable printed circuits on stretchable and non-stretchable substrates |
| WO2019216883A1 (en) | 2018-05-08 | 2019-11-14 | W.L. Gore & Associates, Inc. | Flexible printed circuits for dermal applications |
| JP7085022B2 (ja) | 2018-05-08 | 2022-06-15 | ダブリュ.エル.ゴア アンド アソシエイツ,インコーポレイティド | 伸長性基材上の可撓性かつ伸長性プリント回路 |
| CN113831864A (zh) * | 2021-11-11 | 2021-12-24 | 苏州诺菲纳米科技有限公司 | 单层纳米银线可剥导电胶及其制备方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2837910B2 (ja) * | 1990-03-01 | 1998-12-16 | チタン工業株式会社 | エマルション型液膜法を利用する貴金属微粒子の製造方法 |
| JPH0821254B2 (ja) * | 1991-02-22 | 1996-03-04 | 旭化成工業株式会社 | 銅合金系組成物、それを用いて印刷された成形物、ペーストおよび接着剤 |
| JP2955985B2 (ja) * | 1994-08-31 | 1999-10-04 | ナノパウダース インダストリーズ(イスラエル)リミテッド | 高純度超微粒金属粉を製造する方法 |
| EP0961809B1 (en) * | 1997-02-20 | 2007-02-07 | Partnerships Limited, Inc. | Low temperature method and compositions for producing electrical conductors |
| US6379745B1 (en) * | 1997-02-20 | 2002-04-30 | Parelec, Inc. | Low temperature method and compositions for producing electrical conductors |
| JP3266066B2 (ja) * | 1997-09-05 | 2002-03-18 | 三菱マテリアル株式会社 | 保存安定性に優れた金属微粒子含有導電膜形成用組成物 |
| US6262129B1 (en) * | 1998-07-31 | 2001-07-17 | International Business Machines Corporation | Method for producing nanoparticles of transition metals |
| AU1221801A (en) * | 1999-10-22 | 2001-05-08 | Chrysalis Technologies, Incorporated | Nanosized intermetallic powders |
| JP3646784B2 (ja) * | 2000-03-31 | 2005-05-11 | セイコーエプソン株式会社 | 薄膜パタ−ンの製造方法および微細構造体 |
| JP2001325831A (ja) * | 2000-05-12 | 2001-11-22 | Bando Chem Ind Ltd | 金属コロイド液、導電性インク、導電性被膜及び導電性被膜形成用基底塗膜 |
| US6734029B2 (en) * | 2000-06-30 | 2004-05-11 | Seiko Epson Corporation | Method for forming conductive film pattern, and electro-optical device and electronic apparatus |
| JP5008216B2 (ja) * | 2000-10-13 | 2012-08-22 | 株式会社アルバック | インクジェット用インクの製法 |
| JP4355436B2 (ja) * | 2000-10-25 | 2009-11-04 | 森村ケミカル株式会社 | 配線パターンの形成方法、回路基板の製造方法および遮光パターンの形成された透光体の製造方法 |
-
2003
- 2003-07-03 KR KR1020047021518A patent/KR20060012545A/ko not_active Ceased
- 2003-07-03 WO PCT/IL2003/000554 patent/WO2004005413A1/en not_active Ceased
- 2003-07-03 JP JP2004519139A patent/JP2005531679A/ja active Pending
- 2003-07-03 CN CN03815904XA patent/CN1671805B/zh not_active Expired - Fee Related
- 2003-07-03 AU AU2003237578A patent/AU2003237578A1/en not_active Abandoned
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100865124B1 (ko) * | 2007-04-13 | 2008-10-24 | 삼성전기주식회사 | 잉크젯용 금속 잉크 조성물 |
| WO2011102659A3 (ko) * | 2010-02-18 | 2012-02-02 | (주)덕산테코피아 | 도전성 잉크 및 이를 이용한 전자소자 |
| KR101293914B1 (ko) * | 2010-02-18 | 2013-08-07 | (주)덕산테코피아 | 도전성 잉크 및 이를 이용한 전자소자 |
| WO2012074200A3 (ko) * | 2010-12-02 | 2012-07-26 | 한국기계연구원 | 저온소결 전도성 금속막 및 이의 제조방법 |
| KR101276237B1 (ko) * | 2010-12-02 | 2013-06-20 | 한국기계연구원 | 저온소결 전도성 금속막 및 이의 제조방법 |
| WO2012103285A3 (en) * | 2011-01-29 | 2012-11-15 | Pchem Associates, Inc. | Methods and systems for generating a substantially transparent and conductive substrate |
| KR20220074369A (ko) * | 2020-11-27 | 2022-06-03 | 한국전자기술연구원 | 전도성 잉크 조성물 및 이를 이용한 전도성 기판 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2005531679A (ja) | 2005-10-20 |
| WO2004005413A1 (en) | 2004-01-15 |
| CN1671805B (zh) | 2010-05-26 |
| CN1671805A (zh) | 2005-09-21 |
| AU2003237578A1 (en) | 2004-01-23 |
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