AU2003237578A1 - Low sintering temperatures conductive nano-inks and a method for producing the same - Google Patents

Low sintering temperatures conductive nano-inks and a method for producing the same

Info

Publication number
AU2003237578A1
AU2003237578A1 AU2003237578A AU2003237578A AU2003237578A1 AU 2003237578 A1 AU2003237578 A1 AU 2003237578A1 AU 2003237578 A AU2003237578 A AU 2003237578A AU 2003237578 A AU2003237578 A AU 2003237578A AU 2003237578 A1 AU2003237578 A1 AU 2003237578A1
Authority
AU
Australia
Prior art keywords
inks
producing
same
sintering temperatures
conductive nano
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003237578A
Other languages
English (en)
Inventor
Fernando De La Vega
Arkady Garbar
Anatoly Kiselev
Einat Matzner
Valery Rosenband
Chariana Sokolinsky
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nanopowders Industries Ltd
Original Assignee
Nanopowders Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanopowders Industries Ltd filed Critical Nanopowders Industries Ltd
Publication of AU2003237578A1 publication Critical patent/AU2003237578A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Composite Materials (AREA)
  • Dispersion Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Powder Metallurgy (AREA)
AU2003237578A 2002-07-03 2003-07-03 Low sintering temperatures conductive nano-inks and a method for producing the same Abandoned AU2003237578A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US39312302P 2002-07-03 2002-07-03
US60/393,123 2002-07-03
PCT/IL2003/000554 WO2004005413A1 (en) 2002-07-03 2003-07-03 Low sintering temperatures conductive nano-inks and a method for producing the same

Publications (1)

Publication Number Publication Date
AU2003237578A1 true AU2003237578A1 (en) 2004-01-23

Family

ID=30115548

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003237578A Abandoned AU2003237578A1 (en) 2002-07-03 2003-07-03 Low sintering temperatures conductive nano-inks and a method for producing the same

Country Status (5)

Country Link
JP (1) JP2005531679A (enExample)
KR (1) KR20060012545A (enExample)
CN (1) CN1671805B (enExample)
AU (1) AU2003237578A1 (enExample)
WO (1) WO2004005413A1 (enExample)

Families Citing this family (70)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998036888A1 (en) 1997-02-24 1998-08-27 Superior Micropowders Llc Aerosol method and apparatus, particulate products, and electronic devices made therefrom
US7344769B1 (en) 2000-07-24 2008-03-18 High Voltage Graphics, Inc. Flocked transfer and article of manufacture including the flocked transfer
US7364782B2 (en) 2000-07-24 2008-04-29 High Voltage Graphics, Inc. Flocked transfer and article of manufacture including the application of the transfer by thermoplastic polymer film
WO2004005415A2 (en) 2002-07-03 2004-01-15 High Voltage Graphics, Inc. Flocked stretchable design or transfer
US7585349B2 (en) 2002-12-09 2009-09-08 The University Of Washington Methods of nanostructure formation and shape selection
GB0300529D0 (en) * 2003-01-10 2003-02-12 Qinetiq Nanomaterials Ltd Improvements in and relating to ink jet deposition
US7393576B2 (en) 2004-01-16 2008-07-01 High Voltage Graphics, Inc. Process for printing and molding a flocked article
US20050173680A1 (en) * 2004-02-10 2005-08-11 Haixin Yang Ink jet printable thick film ink compositions and processes
KR20070033329A (ko) * 2004-02-18 2007-03-26 버지니아 테크 인터렉추얼 프라퍼티스, 인크. 인터커넥트를 위한 나노 크기의 금속 페이스트 및 이의사용 방법
US8257795B2 (en) 2004-02-18 2012-09-04 Virginia Tech Intellectual Properties, Inc. Nanoscale metal paste for interconnect and method of use
JP4721677B2 (ja) * 2004-09-06 2011-07-13 株式会社秀峰 印刷または塗布画像作成方法、およびそれによる、印刷または塗布画像体
EP1835512B1 (en) * 2004-10-08 2010-05-12 Mitsui Mining & Smelting Co., Ltd. Conductive ink
US20060093732A1 (en) * 2004-10-29 2006-05-04 David Schut Ink-jet printing of coupling agents for trace or circuit deposition templating
JP4756628B2 (ja) * 2004-12-01 2011-08-24 三井金属鉱業株式会社 水系ｉｔｏインク
JP4799881B2 (ja) * 2004-12-27 2011-10-26 三井金属鉱業株式会社 導電性インク
US8167393B2 (en) 2005-01-14 2012-05-01 Cabot Corporation Printable electronic features on non-uniform substrate and processes for making same
US8383014B2 (en) 2010-06-15 2013-02-26 Cabot Corporation Metal nanoparticle compositions
US20060163744A1 (en) * 2005-01-14 2006-07-27 Cabot Corporation Printable electrical conductors
WO2006076612A2 (en) 2005-01-14 2006-07-20 Cabot Corporation A process for manufacturing application specific printable circuits (aspc’s) and other custom electronic devices
KR100690360B1 (ko) * 2005-05-23 2007-03-09 삼성전기주식회사 도전성 잉크, 그 제조방법 및 도전성 기판
JP5009907B2 (ja) * 2005-06-10 2012-08-29 シーマ ナノ テック イスラエル リミティド 向上透明導電性被膜及びそれらを作製する方法
US7799164B2 (en) 2005-07-28 2010-09-21 High Voltage Graphics, Inc. Flocked articles having noncompatible insert and porous film
EP2477230B1 (en) * 2005-08-12 2015-02-25 Cambrios Technologies Corporation Nanowires-based transparent conductors on a flexible donor substrate
WO2007038950A1 (en) 2005-09-28 2007-04-12 Stichting Dutch Polymer Institute Method for generation of metal surface structures and apparatus therefor
KR100726591B1 (ko) * 2005-12-22 2007-06-12 재단법인 포항산업과학연구원 무기전도성 잉크용 Ｎｉ계 나노 분말의 제조방법
KR100726592B1 (ko) * 2005-12-23 2007-06-12 재단법인 포항산업과학연구원 무기 전도성 잉크용 나노(ｎａｎｏ) 동(Ｃｕ)분말 제조방법
US20080003130A1 (en) 2006-02-01 2008-01-03 University Of Washington Methods for production of silver nanostructures
AT9473U1 (de) * 2006-05-04 2007-10-15 Austria Tech & System Tech Verfahren zur herstellung wenigstens eines leitfähigen elements einer leiterplatte sowie leiterplatte und verwendung eines derartigen verfahrens
US8659158B2 (en) 2006-08-16 2014-02-25 Funai Electric Co., Ltd. Thermally inkjettable acrylic dielectric ink formulation and process
KR101082146B1 (ko) * 2006-09-29 2011-11-09 주식회사 엘지화학 잉크젯 프린트용 잉크 및 상기 잉크에 사용되는 금속나노입자의 제조방법
JP5096735B2 (ja) 2006-12-05 2012-12-12 Ｊｘ日鉱日石エネルギー株式会社 ワイヤグリッド型偏光子及びその製造方法、並びにそれを用いた位相差フィルム及び液晶表示素子
KR100850771B1 (ko) 2007-02-21 2008-08-06 연세대학교 산학협력단 나노금속잉크 제조방법
US7722786B2 (en) 2007-02-23 2010-05-25 Henkel Ag & Co. Kgaa Conductive materials
KR100865124B1 (ko) * 2007-04-13 2008-10-24 삼성전기주식회사 잉크젯용 금속 잉크 조성물
US8404160B2 (en) 2007-05-18 2013-03-26 Applied Nanotech Holdings, Inc. Metallic ink
WO2009052120A1 (en) * 2007-10-15 2009-04-23 Nanoink, Inc. Lithography of nanoparticle based inks
US8308993B2 (en) * 2008-01-30 2012-11-13 Basf Se Conductive inks
TWI401205B (zh) * 2008-01-31 2013-07-11 Ind Tech Res Inst 利用光熱效應製作應用基板的方法
US8815126B2 (en) 2008-02-26 2014-08-26 Cambrios Technologies Corporation Method and composition for screen printing of conductive features
US8506849B2 (en) 2008-03-05 2013-08-13 Applied Nanotech Holdings, Inc. Additives and modifiers for solvent- and water-based metallic conductive inks
US9730333B2 (en) 2008-05-15 2017-08-08 Applied Nanotech Holdings, Inc. Photo-curing process for metallic inks
CN101597440B (zh) * 2008-06-05 2011-07-27 富葵精密组件(深圳)有限公司 油墨、利用该油墨制作导电线路的方法及线路板
US20100000762A1 (en) 2008-07-02 2010-01-07 Applied Nanotech Holdings, Inc. Metallic pastes and inks
JP2010012714A (ja) * 2008-07-04 2010-01-21 Toda Kogyo Corp 機能性薄膜の製造方法、機能性薄膜、機能性薄膜積層基材の製造方法及び機能性薄膜積層基材
EP2194764A1 (en) 2008-12-04 2010-06-09 Stichting Dutch Polymer Institute Method for generation of electrically conducting surface structures, apparatus therefor and use
EP2207407A1 (en) 2009-01-13 2010-07-14 Stichting Dutch Polymer Institute Method for generation of electrically conducting surface structures, device and use
KR101735710B1 (ko) 2009-03-27 2017-05-15 어플라이드 나노테크 홀딩스, 인크. 광 및／또는 레이저 소결을 향상시키기 위한 버퍼층
US8422197B2 (en) 2009-07-15 2013-04-16 Applied Nanotech Holdings, Inc. Applying optical energy to nanoparticles to produce a specified nanostructure
KR100951697B1 (ko) 2009-10-30 2010-04-07 주식회사 연안테크놀로지 은 나노 메탈이 함유된 금속 도금층용 잉크 및 그 잉크의 제조방법
KR101293914B1 (ko) * 2010-02-18 2013-08-07 (주)덕산테코피아 도전성 잉크 및 이를 이용한 전자소자
CN101805538B (zh) * 2010-04-08 2014-05-07 中国科学院宁波材料技术与工程研究所 可低温烧结的导电墨水
WO2012061511A2 (en) * 2010-11-03 2012-05-10 Fry's Metals, Inc. Sintering materials and attachment methods using same
KR101276237B1 (ko) * 2010-12-02 2013-06-20 한국기계연구원 저온소결 전도성 금속막 및 이의 제조방법
WO2012103285A2 (en) * 2011-01-29 2012-08-02 Pchem Associates, Inc. Methods and systems for generating a substantially transparent and conductive substrate
KR102020914B1 (ko) * 2011-09-06 2019-09-11 헨켈 아이피 앤드 홀딩 게엠베하 전도성 물질 및 방법
KR101860603B1 (ko) * 2011-09-06 2018-05-23 헨켈 아이피 앤드 홀딩 게엠베하 전도성 물질 및 방법
CN102522342A (zh) * 2011-12-27 2012-06-27 日月光半导体制造股份有限公司 半导体结构及其制造方法
TWI623597B (zh) * 2012-08-16 2018-05-11 西瑪奈米技術以色列有限公司 用於製造透明導電塗層之乳液
US10040960B2 (en) * 2012-09-28 2018-08-07 Toppan Forms Co., Ltd. Silver ink composition, conductor and communication device
WO2014059424A2 (en) 2012-10-12 2014-04-17 High Voltage Graphics, Inc. Flexible heat sealable decorative articles and method for making the same
WO2014120093A1 (en) * 2013-01-31 2014-08-07 Agency For Science, Technology And Research Electrically conductive ink composition and method of preparation thereof
CN103627255B (zh) * 2013-05-06 2015-05-20 苏州冷石纳米材料科技有限公司 一种纳米银导电墨水及采用该墨水制备的导电薄膜
EP3033401B1 (en) 2013-08-16 2019-06-05 Henkel IP & Holding GmbH Submicron silver particle ink compositions, process and applications
CN103525199B (zh) * 2013-10-24 2015-12-02 北京印刷学院 一种可免加热后处理纳米尺度铜油墨的制备方法
EP3606740B1 (en) 2017-04-04 2021-09-29 W. L. Gore & Associates GmbH Dielectric composite with reinforced elastomer and integrated electrode
US11330711B2 (en) 2018-05-08 2022-05-10 W. L. Gore & Associates, Inc. Flexible and durable printed circuits on stretchable and non-stretchable substrates
WO2019216883A1 (en) 2018-05-08 2019-11-14 W.L. Gore & Associates, Inc. Flexible printed circuits for dermal applications
JP7085022B2 (ja) 2018-05-08 2022-06-15 ダブリュ．エル．ゴア アンド アソシエイツ，インコーポレイティド 伸長性基材上の可撓性かつ伸長性プリント回路
KR102490064B1 (ko) * 2020-11-27 2023-01-19 한국전자기술연구원 전도성 잉크 조성물 및 이를 이용한 전도성 기판
CN113831864A (zh) * 2021-11-11 2021-12-24 苏州诺菲纳米科技有限公司 单层纳米银线可剥导电胶及其制备方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2837910B2 (ja) * 1990-03-01 1998-12-16 チタン工業株式会社 エマルション型液膜法を利用する貴金属微粒子の製造方法
JPH0821254B2 (ja) * 1991-02-22 1996-03-04 旭化成工業株式会社 銅合金系組成物、それを用いて印刷された成形物、ペーストおよび接着剤
JP2955985B2 (ja) * 1994-08-31 1999-10-04 ナノパウダース インダストリーズ（イスラエル）リミテッド 高純度超微粒金属粉を製造する方法
EP0961809B1 (en) * 1997-02-20 2007-02-07 Partnerships Limited, Inc. Low temperature method and compositions for producing electrical conductors
US6379745B1 (en) * 1997-02-20 2002-04-30 Parelec, Inc. Low temperature method and compositions for producing electrical conductors
JP3266066B2 (ja) * 1997-09-05 2002-03-18 三菱マテリアル株式会社 保存安定性に優れた金属微粒子含有導電膜形成用組成物
US6262129B1 (en) * 1998-07-31 2001-07-17 International Business Machines Corporation Method for producing nanoparticles of transition metals
AU1221801A (en) * 1999-10-22 2001-05-08 Chrysalis Technologies, Incorporated Nanosized intermetallic powders
JP3646784B2 (ja) * 2000-03-31 2005-05-11 セイコーエプソン株式会社 薄膜パタ−ンの製造方法および微細構造体
JP2001325831A (ja) * 2000-05-12 2001-11-22 Bando Chem Ind Ltd 金属コロイド液、導電性インク、導電性被膜及び導電性被膜形成用基底塗膜
US6734029B2 (en) * 2000-06-30 2004-05-11 Seiko Epson Corporation Method for forming conductive film pattern, and electro-optical device and electronic apparatus
JP5008216B2 (ja) * 2000-10-13 2012-08-22 株式会社アルバック インクジェット用インクの製法
JP4355436B2 (ja) * 2000-10-25 2009-11-04 森村ケミカル株式会社 配線パターンの形成方法、回路基板の製造方法および遮光パターンの形成された透光体の製造方法

Also Published As

Publication number Publication date
JP2005531679A (ja) 2005-10-20
WO2004005413A1 (en) 2004-01-15
CN1671805B (zh) 2010-05-26
KR20060012545A (ko) 2006-02-08
CN1671805A (zh) 2005-09-21

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