WO2012074200A3 - 저온소결 전도성 금속막 및 이의 제조방법 - Google Patents

저온소결 전도성 금속막 및 이의 제조방법 Download PDF

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Publication number
WO2012074200A3
WO2012074200A3 PCT/KR2011/007841 KR2011007841W WO2012074200A3 WO 2012074200 A3 WO2012074200 A3 WO 2012074200A3 KR 2011007841 W KR2011007841 W KR 2011007841W WO 2012074200 A3 WO2012074200 A3 WO 2012074200A3
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WO
WIPO (PCT)
Prior art keywords
metal
conductive metal
preparing
preparation
low temperature
Prior art date
Application number
PCT/KR2011/007841
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English (en)
French (fr)
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WO2012074200A2 (ko
Inventor
유지훈
양상선
김용진
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한국기계연구원
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Publication date
Application filed by 한국기계연구원 filed Critical 한국기계연구원
Priority to US13/991,130 priority Critical patent/US9145503B2/en
Publication of WO2012074200A2 publication Critical patent/WO2012074200A2/ko
Publication of WO2012074200A3 publication Critical patent/WO2012074200A3/ko

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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/52Electrically conductive inks
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05Metallic powder characterised by the size or surface area of the particles
    • B22F1/054Nanosized particles
    • B22F1/0545Dispersions or suspensions of nanosized particles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00Nanotechnology for materials or surface science, e.g. nanocomposites
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283After-treatment of the printed patterns, e.g. sintering or curing methods
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/105Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing inorganic lubricating or binding agents, e.g. metal salts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/107Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing organic material comprising solvents, e.g. for slip casting
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24893Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including particulate material
    • Y10T428/24909Free metal or mineral containing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/25Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/256Heavy metal or aluminum or compound thereof

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Composite Materials (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)

Abstract

본 발명은 저온소결 전도성 금속잉크 및 이의 제조방법에 관한 것으로서, 더 욱 상세하게는금속 나노콜로이드, 금속염 및 상기 금속염과 반응을 일으키는 고분 자를 포함하는 전도성 금속잉크를 인쇄하여 제조되는 전도성 막 또는 패턴 및 금속 나노콜로이드를 제조하는 단계(단계 1); 금속염 및 고분자를 혼합하여 혼합물을 제 조하는 단계(단계 2); 상기 단계 1 및 단계 2에서 제조된 금속 나노콜로이드와 금 속염/고분자 혼합물을 교반하여 금속잉크를 제조하는 단계(단계 3); 상기 단계 3에 서 제조된 금속 잉크를 인쇄하는 단계(단계 4); 및 상기 단계 4의 인쇄물을 건조하 고 열처리하는 단계(단계 5)를 포함하는 것을 특징으로 하는 전도성 금속막 또는 패턴의 제조방법을 제공한다.
PCT/KR2011/007841 2010-12-02 2011-10-20 저온소결 전도성 금속막 및 이의 제조방법 WO2012074200A2 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US13/991,130 US9145503B2 (en) 2010-12-02 2011-10-20 Low temperature sintering conductive metal film and preparation method thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020100121967A KR101276237B1 (ko) 2010-12-02 2010-12-02 저온소결 전도성 금속막 및 이의 제조방법
KR10-2010-0121967 2010-12-02

Publications (2)

Publication Number Publication Date
WO2012074200A2 WO2012074200A2 (ko) 2012-06-07
WO2012074200A3 true WO2012074200A3 (ko) 2012-07-26

Family

ID=46172337

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/007841 WO2012074200A2 (ko) 2010-12-02 2011-10-20 저온소결 전도성 금속막 및 이의 제조방법

Country Status (3)

Country Link
US (1) US9145503B2 (ko)
KR (1) KR101276237B1 (ko)
WO (1) WO2012074200A2 (ko)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DK2880662T3 (en) * 2012-07-30 2017-10-16 Ceram Gmbh Method of Metallization of Dotted Holes
KR101581041B1 (ko) * 2013-12-28 2015-12-29 전자부품연구원 레이저에 의해 선택적 전도체 패턴 형성이 되는 3d 프린팅용 복합재료, 이를 이용한 전도체 패턴을 포함하는 3차원 형상 전자부품의 제조방법 및 그 전자부품
KR101597651B1 (ko) 2013-12-30 2016-02-25 전자부품연구원 고내열성을 갖는 나노산화구리 잉크 조성물 및 이를 이용한 전극 형성방법
KR101697097B1 (ko) 2014-12-23 2017-01-18 전자부품연구원 나노구리 잉크 조성물, 그를 이용한 배선기판 및 그의 제조 방법
WO2015152625A1 (ko) 2014-04-01 2015-10-08 전자부품연구원 광 소결용 잉크 조성물, 그를 이용한 배선기판 및 그의 제조 방법
KR101594060B1 (ko) 2014-04-01 2016-02-16 전자부품연구원 나노산화구리 잉크 조성물, 그를 이용한 배선기판 및 그의 제조 방법
KR102084575B1 (ko) 2014-12-23 2020-03-05 전자부품연구원 광 소결용 잉크 조성물 및 그를 이용한 배선기판의 제조 방법
CN104053308B (zh) * 2014-06-06 2017-11-10 深圳市宇顺电子股份有限公司 触摸屏引线导电线路的制备方法
KR101715756B1 (ko) 2015-05-07 2017-03-15 전자부품연구원 광 소결용 잉크 조성물, 그를 이용한 배선기판 및 그의 제조 방법
JP6901549B2 (ja) 2016-07-28 2021-07-14 ナショナル リサーチ カウンシル オブ カナダ 銅インク及びそれから製造された導電性のはんだ付け可能な銅トレース
TW201842088A (zh) 2017-02-08 2018-12-01 加拿大國家研究委員會 可印刷分子油墨
TW201842087A (zh) 2017-02-08 2018-12-01 加拿大國家研究委員會 具改良之熱穩定性的分子油墨
JP7242557B2 (ja) 2017-02-08 2023-03-20 ナショナル リサーチ カウンシル オブ カナダ 低粘度及び低処理温度を有する銀分子インク
CN110892796A (zh) * 2017-08-01 2020-03-17 惠普发展公司,有限责任合伙企业 无芯片rfid打印方法
KR102105872B1 (ko) * 2018-05-18 2020-04-29 강원대학교산학협력단 열용융압출법을 이용하여 제조된 구리 나노콜로이드 분산체 및 이의 용도

Citations (4)

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JPH0377202A (ja) * 1989-08-18 1991-04-02 Daido Steel Co Ltd 導電性組成物
KR20000075549A (ko) * 1997-02-20 2000-12-15 파트너쉽 리미티드, 인코포레이티드 도전체 제조용 조성물 및 저온 방법
KR20060012545A (ko) * 2002-07-03 2006-02-08 나노파우더스 인더스트리어스 리미티드. 저온 소결처리한 전도성 나노 잉크 및 이것의 제조 방법
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KR100726713B1 (ko) * 2005-08-26 2007-06-12 한국전기연구원 액중 전기폭발에 의한 나노분말 제조 방법 및 장치
KR100833869B1 (ko) 2006-10-10 2008-06-02 삼성전기주식회사 내마이그레이션 잉크 조성물 및 이를 이용하여 제조된전도성 배선
KR100911439B1 (ko) 2007-08-17 2009-08-11 나노씨엠에스(주) 나노 은 콜로이드를 이용한 잉크젯용 수계 전도성 잉크 조성물 및 이를 이용한 디스플레이용 전극 형성방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0377202A (ja) * 1989-08-18 1991-04-02 Daido Steel Co Ltd 導電性組成物
KR20000075549A (ko) * 1997-02-20 2000-12-15 파트너쉽 리미티드, 인코포레이티드 도전체 제조용 조성물 및 저온 방법
KR20060012545A (ko) * 2002-07-03 2006-02-08 나노파우더스 인더스트리어스 리미티드. 저온 소결처리한 전도성 나노 잉크 및 이것의 제조 방법
KR20090131454A (ko) * 2008-06-18 2009-12-29 동부정밀화학 주식회사 액중 전기 폭발에 의한 금속 나노 분말의 제조 방법

Also Published As

Publication number Publication date
KR20120060450A (ko) 2012-06-12
KR101276237B1 (ko) 2013-06-20
WO2012074200A2 (ko) 2012-06-07
US20130251966A1 (en) 2013-09-26
US9145503B2 (en) 2015-09-29

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