WO2012074200A3 - 저온소결 전도성 금속막 및 이의 제조방법 - Google Patents
저온소결 전도성 금속막 및 이의 제조방법 Download PDFInfo
- Publication number
- WO2012074200A3 WO2012074200A3 PCT/KR2011/007841 KR2011007841W WO2012074200A3 WO 2012074200 A3 WO2012074200 A3 WO 2012074200A3 KR 2011007841 W KR2011007841 W KR 2011007841W WO 2012074200 A3 WO2012074200 A3 WO 2012074200A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- metal
- conductive metal
- preparing
- preparation
- low temperature
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/054—Nanosized particles
- B22F1/0545—Dispersions or suspensions of nanosized particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/105—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing inorganic lubricating or binding agents, e.g. metal salts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/107—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing organic material comprising solvents, e.g. for slip casting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24893—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including particulate material
- Y10T428/24909—Free metal or mineral containing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/256—Heavy metal or aluminum or compound thereof
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Wood Science & Technology (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Composite Materials (AREA)
- Dispersion Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Electric Cables (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
Abstract
본 발명은 저온소결 전도성 금속잉크 및 이의 제조방법에 관한 것으로서, 더 욱 상세하게는금속 나노콜로이드, 금속염 및 상기 금속염과 반응을 일으키는 고분 자를 포함하는 전도성 금속잉크를 인쇄하여 제조되는 전도성 막 또는 패턴 및 금속 나노콜로이드를 제조하는 단계(단계 1); 금속염 및 고분자를 혼합하여 혼합물을 제 조하는 단계(단계 2); 상기 단계 1 및 단계 2에서 제조된 금속 나노콜로이드와 금 속염/고분자 혼합물을 교반하여 금속잉크를 제조하는 단계(단계 3); 상기 단계 3에 서 제조된 금속 잉크를 인쇄하는 단계(단계 4); 및 상기 단계 4의 인쇄물을 건조하 고 열처리하는 단계(단계 5)를 포함하는 것을 특징으로 하는 전도성 금속막 또는 패턴의 제조방법을 제공한다.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/991,130 US9145503B2 (en) | 2010-12-02 | 2011-10-20 | Low temperature sintering conductive metal film and preparation method thereof |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020100121967A KR101276237B1 (ko) | 2010-12-02 | 2010-12-02 | 저온소결 전도성 금속막 및 이의 제조방법 |
KR10-2010-0121967 | 2010-12-02 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2012074200A2 WO2012074200A2 (ko) | 2012-06-07 |
WO2012074200A3 true WO2012074200A3 (ko) | 2012-07-26 |
Family
ID=46172337
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2011/007841 WO2012074200A2 (ko) | 2010-12-02 | 2011-10-20 | 저온소결 전도성 금속막 및 이의 제조방법 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9145503B2 (ko) |
KR (1) | KR101276237B1 (ko) |
WO (1) | WO2012074200A2 (ko) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DK2880662T3 (en) * | 2012-07-30 | 2017-10-16 | Ceram Gmbh | Method of Metallization of Dotted Holes |
KR101581041B1 (ko) * | 2013-12-28 | 2015-12-29 | 전자부품연구원 | 레이저에 의해 선택적 전도체 패턴 형성이 되는 3d 프린팅용 복합재료, 이를 이용한 전도체 패턴을 포함하는 3차원 형상 전자부품의 제조방법 및 그 전자부품 |
KR101597651B1 (ko) | 2013-12-30 | 2016-02-25 | 전자부품연구원 | 고내열성을 갖는 나노산화구리 잉크 조성물 및 이를 이용한 전극 형성방법 |
KR101697097B1 (ko) | 2014-12-23 | 2017-01-18 | 전자부품연구원 | 나노구리 잉크 조성물, 그를 이용한 배선기판 및 그의 제조 방법 |
WO2015152625A1 (ko) | 2014-04-01 | 2015-10-08 | 전자부품연구원 | 광 소결용 잉크 조성물, 그를 이용한 배선기판 및 그의 제조 방법 |
KR101594060B1 (ko) | 2014-04-01 | 2016-02-16 | 전자부품연구원 | 나노산화구리 잉크 조성물, 그를 이용한 배선기판 및 그의 제조 방법 |
KR102084575B1 (ko) | 2014-12-23 | 2020-03-05 | 전자부품연구원 | 광 소결용 잉크 조성물 및 그를 이용한 배선기판의 제조 방법 |
CN104053308B (zh) * | 2014-06-06 | 2017-11-10 | 深圳市宇顺电子股份有限公司 | 触摸屏引线导电线路的制备方法 |
KR101715756B1 (ko) | 2015-05-07 | 2017-03-15 | 전자부품연구원 | 광 소결용 잉크 조성물, 그를 이용한 배선기판 및 그의 제조 방법 |
JP6901549B2 (ja) | 2016-07-28 | 2021-07-14 | ナショナル リサーチ カウンシル オブ カナダ | 銅インク及びそれから製造された導電性のはんだ付け可能な銅トレース |
TW201842088A (zh) | 2017-02-08 | 2018-12-01 | 加拿大國家研究委員會 | 可印刷分子油墨 |
TW201842087A (zh) | 2017-02-08 | 2018-12-01 | 加拿大國家研究委員會 | 具改良之熱穩定性的分子油墨 |
JP7242557B2 (ja) | 2017-02-08 | 2023-03-20 | ナショナル リサーチ カウンシル オブ カナダ | 低粘度及び低処理温度を有する銀分子インク |
CN110892796A (zh) * | 2017-08-01 | 2020-03-17 | 惠普发展公司,有限责任合伙企业 | 无芯片rfid打印方法 |
KR102105872B1 (ko) * | 2018-05-18 | 2020-04-29 | 강원대학교산학협력단 | 열용융압출법을 이용하여 제조된 구리 나노콜로이드 분산체 및 이의 용도 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0377202A (ja) * | 1989-08-18 | 1991-04-02 | Daido Steel Co Ltd | 導電性組成物 |
KR20000075549A (ko) * | 1997-02-20 | 2000-12-15 | 파트너쉽 리미티드, 인코포레이티드 | 도전체 제조용 조성물 및 저온 방법 |
KR20060012545A (ko) * | 2002-07-03 | 2006-02-08 | 나노파우더스 인더스트리어스 리미티드. | 저온 소결처리한 전도성 나노 잉크 및 이것의 제조 방법 |
KR20090131454A (ko) * | 2008-06-18 | 2009-12-29 | 동부정밀화학 주식회사 | 액중 전기 폭발에 의한 금속 나노 분말의 제조 방법 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4799881B2 (ja) * | 2004-12-27 | 2011-10-26 | 三井金属鉱業株式会社 | 導電性インク |
KR100726713B1 (ko) * | 2005-08-26 | 2007-06-12 | 한국전기연구원 | 액중 전기폭발에 의한 나노분말 제조 방법 및 장치 |
KR100833869B1 (ko) | 2006-10-10 | 2008-06-02 | 삼성전기주식회사 | 내마이그레이션 잉크 조성물 및 이를 이용하여 제조된전도성 배선 |
KR100911439B1 (ko) | 2007-08-17 | 2009-08-11 | 나노씨엠에스(주) | 나노 은 콜로이드를 이용한 잉크젯용 수계 전도성 잉크 조성물 및 이를 이용한 디스플레이용 전극 형성방법 |
-
2010
- 2010-12-02 KR KR1020100121967A patent/KR101276237B1/ko active IP Right Grant
-
2011
- 2011-10-20 US US13/991,130 patent/US9145503B2/en active Active
- 2011-10-20 WO PCT/KR2011/007841 patent/WO2012074200A2/ko active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0377202A (ja) * | 1989-08-18 | 1991-04-02 | Daido Steel Co Ltd | 導電性組成物 |
KR20000075549A (ko) * | 1997-02-20 | 2000-12-15 | 파트너쉽 리미티드, 인코포레이티드 | 도전체 제조용 조성물 및 저온 방법 |
KR20060012545A (ko) * | 2002-07-03 | 2006-02-08 | 나노파우더스 인더스트리어스 리미티드. | 저온 소결처리한 전도성 나노 잉크 및 이것의 제조 방법 |
KR20090131454A (ko) * | 2008-06-18 | 2009-12-29 | 동부정밀화학 주식회사 | 액중 전기 폭발에 의한 금속 나노 분말의 제조 방법 |
Also Published As
Publication number | Publication date |
---|---|
KR20120060450A (ko) | 2012-06-12 |
KR101276237B1 (ko) | 2013-06-20 |
WO2012074200A2 (ko) | 2012-06-07 |
US20130251966A1 (en) | 2013-09-26 |
US9145503B2 (en) | 2015-09-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2012074200A3 (ko) | 저온소결 전도성 금속막 및 이의 제조방법 | |
WO2012026791A3 (ko) | 전도성 금속 잉크 조성물 및 전도성 패턴의 형성방법 | |
WO2008115530A3 (en) | Polymer composition for preparing electronic devices by microcontact printing processes and products prepared by the processes | |
EP2732976A3 (en) | Post-treatment solution for digital inkjet printing | |
EP2582214A3 (en) | Method for Forming Conductive Circuit | |
MX2012000655A (es) | Materiales de componentes multiples que tienen una composicion que cambia de color. | |
EP2486452A4 (en) | PATTERN FORMATION METHOD, CHEM AMPLIFICATION RESERVE COMPOSITION, AND RESIST FILM | |
IL198646A0 (en) | Printable compositions containing silver nanoparticles, processes for producing electrically conductive coatings using the same, and coating prepared thereby | |
EP2695672A3 (en) | Process for preparing acrolein by dehydration of glycerin in the presence of a catalyst | |
WO2012120088A3 (en) | Ink composition for continuous deflected jet printing | |
BRPI0909025A2 (pt) | composições de polímeros vinílicos aromáticos expansíveis, artigos expandidos, folhas estrusadas espandidas, e, processos para preparar as composições de polímeros vinílicos aromáticos expansíveis, e para a produção de folhas estrusadas expandidas | |
TWI370160B (en) | Conductive polymer coating composition, method of preparing coating film using the conductive polymer coating composition, and coating film prepared using the method | |
EP2374612A4 (en) | Surface metal film material, process for producing surface metal film material, process for producing metal pattern material, and metal pattern material | |
WO2011126706A3 (en) | Printable materials and methods of manufacture thereof | |
BR112013007376A2 (pt) | método para alimentação de um composto antiestático a uma reação de polimerização. | |
EP2479226A4 (en) | POROUS STRUCTURE FOR FORMING A FINGERPRINT-RESISTANT COATING, METHOD FOR FORMING A FINGERPRINT-RESISTANT COATING WITH THE POROUS STRUCTURE, SUBSTRATE WITH THE FINGERPRINT-RESISTANT COATING MADE IN THIS PROCESS AND PRODUCTS WITH THE SUBSTRATE | |
WO2012124979A3 (ko) | 도전성 잉크 조성물, 이를 이용한 인쇄 방법 및 이에 의하여 제조된 도전성 패턴 | |
BRPI0918094A2 (pt) | método de preparação de dispersões aquosas, dispersão aquosa de partículas metálicas, dispersão aquosa livre de ácido de partículas metalicas, composição de tinta, e substrato impresso | |
WO2010011841A3 (en) | Metal nanoparticle ink compositions | |
EP2628603A4 (en) | RESIN COMPOSITION FOR FORMING RECEPTOR LAYER, RECEIVER SUBSTRATE OBTAINED USING THE SAME, PRINTED MATERIAL, CONDUCTIVE PATTERN, AND ELECTRIC CIRCUIT | |
WO2009040648A3 (en) | Polyaniline, method for manufacturing same, and polyaniline-containing solution and coating material | |
WO2013102607A3 (en) | Hot melt ink composition, method for preparing a hot melt ink composition and use thereof | |
EP1980544A3 (en) | Process for producing powder | |
WO2013102675A3 (fr) | Electrode poreuse pour membrane echangeuse de protons | |
WO2011025229A3 (ko) | 전도성 금속 잉크 조성물 및 전도성 패턴의 형성 방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 11845406 Country of ref document: EP Kind code of ref document: A2 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 13991130 Country of ref document: US |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 11845406 Country of ref document: EP Kind code of ref document: A2 |