WO2012026791A3 - 전도성 금속 잉크 조성물 및 전도성 패턴의 형성방법 - Google Patents

전도성 금속 잉크 조성물 및 전도성 패턴의 형성방법 Download PDF

Info

Publication number
WO2012026791A3
WO2012026791A3 PCT/KR2011/006343 KR2011006343W WO2012026791A3 WO 2012026791 A3 WO2012026791 A3 WO 2012026791A3 KR 2011006343 W KR2011006343 W KR 2011006343W WO 2012026791 A3 WO2012026791 A3 WO 2012026791A3
Authority
WO
WIPO (PCT)
Prior art keywords
ink composition
conductive metal
metal ink
conductive
preparing
Prior art date
Application number
PCT/KR2011/006343
Other languages
English (en)
French (fr)
Other versions
WO2012026791A2 (ko
Inventor
성지현
전경수
허수연
이종택
황지영
황인석
이승헌
Original Assignee
주식회사 엘지화학
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 엘지화학 filed Critical 주식회사 엘지화학
Priority to JP2013525840A priority Critical patent/JP5788003B2/ja
Priority to CN201180041472.6A priority patent/CN103080247B/zh
Priority to US13/819,313 priority patent/US9449734B2/en
Publication of WO2012026791A2 publication Critical patent/WO2012026791A2/ko
Publication of WO2012026791A3 publication Critical patent/WO2012026791A3/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/12—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C09D11/033—Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0272—Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0534—Offset printing, i.e. transfer of a pattern from a carrier onto the substrate by using an intermediate member
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Dispersion Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Nanotechnology (AREA)
  • Manufacturing & Machinery (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Conductive Materials (AREA)
  • Printing Methods (AREA)

Abstract

본 발명은 전도성을 갖는 제1 금속 분말 비수용매 부착 증진제 및 고분자 코팅성 향상제를 포함하는 전도성 금속 잉크 조성물과, 이러한 전도성 금속 잉크 조성물을 이용한 전도성 패턴의 형성방법에 관한 것으로서, 이러한 전도성 금속 잉크 조성물은 롤프린팅 공정 등에 적합하게 적용될 수 있으며, 보다 향상된 전도도 및 기재에 대한 우수한 부착력을 나타내는 전도성 패턴을 형성할 수 있다.
PCT/KR2011/006343 2010-08-27 2011-08-26 전도성 금속 잉크 조성물 및 전도성 패턴의 형성방법 WO2012026791A2 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2013525840A JP5788003B2 (ja) 2010-08-27 2011-08-26 導電性金属インク組成物および導電性パターンの形成方法
CN201180041472.6A CN103080247B (zh) 2010-08-27 2011-08-26 导电金属墨水组合物及制备导电图形的方法
US13/819,313 US9449734B2 (en) 2010-08-27 2011-08-26 Conductive metal ink composition, and method for preparing a conductive pattern

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20100083589 2010-08-27
KR10-2010-0083589 2010-08-27

Publications (2)

Publication Number Publication Date
WO2012026791A2 WO2012026791A2 (ko) 2012-03-01
WO2012026791A3 true WO2012026791A3 (ko) 2012-06-28

Family

ID=45723950

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/006343 WO2012026791A2 (ko) 2010-08-27 2011-08-26 전도성 금속 잉크 조성물 및 전도성 패턴의 형성방법

Country Status (5)

Country Link
US (1) US9449734B2 (ko)
JP (1) JP5788003B2 (ko)
KR (1) KR101302345B1 (ko)
CN (1) CN103080247B (ko)
WO (1) WO2012026791A2 (ko)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6132716B2 (ja) * 2013-09-10 2017-05-24 株式会社東芝 金属粒子ペースト、これを用いた硬化物、および半導体装置
US9540734B2 (en) * 2013-11-13 2017-01-10 Xerox Corporation Conductive compositions comprising metal carboxylates
CN103680680A (zh) * 2013-12-10 2014-03-26 张明 一种热塑性导电浆料
CN106416432B (zh) * 2014-01-24 2020-03-24 凸版资讯股份有限公司 配线板
KR101582407B1 (ko) * 2014-04-14 2016-01-04 주식회사 두산 저점도 금속 잉크 조성물, 이를 이용한 적층시트, 연성 금속박 적층판 및 인쇄회로기판
KR102387043B1 (ko) 2014-06-19 2022-04-14 내셔날 리서치 카운실 오브 캐나다 분자 잉크
JP6101403B2 (ja) * 2014-11-25 2017-03-22 バンドー化学株式会社 導電性インク
WO2017019480A1 (en) * 2015-07-24 2017-02-02 Sun Chemical Corporation Dispersant effect on aluminum pigments
CN105694598A (zh) * 2016-04-21 2016-06-22 华东理工大学 一种纳米银3d喷墨导电墨水及其制备方法
KR101897619B1 (ko) * 2016-04-22 2018-09-12 창원대학교 산학협력단 인쇄장치 및 그 작동 방법
WO2018031235A1 (en) * 2016-08-09 2018-02-15 Eastman Kodak Company Silver ion carboxylate n-heteroaromatic complexes and uses
CN109563106B (zh) * 2016-08-09 2021-07-27 柯达公司 银离子羧酸根烷基伯胺络合物
US10314173B2 (en) * 2016-08-09 2019-06-04 Eastman Kodak Company Articles with reducible silver ions or silver metal
US10356899B2 (en) * 2016-08-09 2019-07-16 Eastman Kodak Company Articles having reducible silver ion complexes or silver metal
JP6780457B2 (ja) 2016-11-10 2020-11-04 株式会社デンソー 半導体装置およびその製造方法
TW201842088A (zh) 2017-02-08 2018-12-01 加拿大國家研究委員會 可印刷分子油墨
CA3052747A1 (en) 2017-02-08 2018-08-16 National Research Council Of Canada Silver molecular ink with low viscosity and low processing temperature
TW201842087A (zh) 2017-02-08 2018-12-01 加拿大國家研究委員會 具改良之熱穩定性的分子油墨
US10582631B2 (en) * 2017-07-20 2020-03-03 Apple Inc. Housings formed from three-dimensional circuits
WO2019098196A1 (ja) * 2017-11-14 2019-05-23 日立化成株式会社 組成物、導体及びその製造方法、並びに構造体
JP2021530087A (ja) * 2018-07-06 2021-11-04 昭和電工マテリアルズ株式会社 金属粒子層の材料特性を改質するための金属系添加剤を含む印刷可能なペースト
WO2020038641A1 (en) 2018-08-20 2020-02-27 Basf Se Transparent electroconductive films and ink for production thereof
US11905424B2 (en) 2019-04-01 2024-02-20 General Electric Company Fabrication of chromium metal mixtures in the form of core-shell nanoparticles
US11311941B2 (en) * 2019-04-01 2022-04-26 General Electric Company Fabrication of palladium-chromium alloy microparticles
US20220187953A1 (en) * 2020-12-16 2022-06-16 Tpk Touch Solutions (Xiamen) Inc. Ink component and method for forming insulation layer and touch panel

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050113489A1 (en) * 2003-11-25 2005-05-26 3M Innovative Properties Company Solution containing surface-modified nanoparticles
KR20060017686A (ko) * 2004-08-21 2006-02-27 학교법인연세대학교 잉크젯 프린터용 전도성 잉크 조성물, 잉크젯 프린팅에의한 금속패턴 형성 방법 및 이에 의해 제조된 인쇄회로기판
JP2006335995A (ja) * 2005-06-06 2006-12-14 Hitachi Maxell Ltd インクジェット用導電性インク、導電性パターンおよび導電体
KR20080029826A (ko) * 2006-09-29 2008-04-03 주식회사 엘지화학 도전배선 형성용 페이스트에 사용되는 유기 은 착화합물
KR20080088712A (ko) * 2007-03-30 2008-10-06 삼성전자주식회사 전도성 잉크 조성물 및 이를 이용한 전도성 패턴의 형성방법
KR20100088483A (ko) * 2009-01-30 2010-08-09 삼성전자주식회사 전도성 금속이온 잉크 조성물 및 이의 제조방법

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2726001B1 (fr) * 1994-10-19 1996-11-29 Solaic Sa Encre conductrice comprenant des grains metalliques ayant des points de fusion differents
JP4828791B2 (ja) * 2003-10-24 2011-11-30 光村印刷株式会社 精密パターニング用インキ組成物
KR100768341B1 (ko) 2005-11-09 2007-10-17 주식회사 나노신소재 금속성 잉크, 그리고 이를 이용한 전극형성방법 및 기판
KR101263003B1 (ko) * 2006-02-13 2013-05-09 주식회사 이그잭스 도전선 패턴 형성을 위한 은 오르가노 졸 잉크
JP5068468B2 (ja) * 2006-03-24 2012-11-07 Ｄｉｃ株式会社 導電性インキ組成物および印刷物
WO2008038976A1 (en) * 2006-09-29 2008-04-03 Lg Chem, Ltd. Organic silver complex compound used in paste for conductive pattern forming
JP2008243600A (ja) * 2007-03-27 2008-10-09 Sekisui Chem Co Ltd 透明導電材料、透明導電膜、透明導電膜の製造方法、及び、表示素子
JP2008280592A (ja) * 2007-05-11 2008-11-20 Nakan Corp 導電性金属ナノ粒子の製造方法、導電性金属ナノ粒子およびそれを用いたインク組成物、配線形成方法
JP5200515B2 (ja) * 2007-12-03 2013-06-05 Ｄｉｃ株式会社 ニッケルインキの製造方法、ニッケルインキパターンの形成方法、及び積層セラミックコンデンサの製造方法
US20090274834A1 (en) * 2008-05-01 2009-11-05 Xerox Corporation Bimetallic nanoparticles for conductive ink applications
JP2010059409A (ja) 2008-08-06 2010-03-18 Toyo Ink Mfg Co Ltd 導電性インキ
JP2013503234A (ja) * 2009-08-28 2013-01-31 エルジー・ケム・リミテッド 導電性金属インク組成物および導電性パターンの形成方法
SG183160A1 (en) * 2010-02-17 2012-09-27 Basf Se Process for producing electrically conductive bonds between solar cells
KR20120014500A (ko) * 2010-08-09 2012-02-17 삼성전자주식회사 탈착판, 탈착판의 제조방법, 및 롤프린팅 방식으로 형성된 패턴
EP2444148A1 (de) * 2010-10-25 2012-04-25 Bayer Material Science AG Metallpartikelsol mit dotierten Silbernanopartikeln

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050113489A1 (en) * 2003-11-25 2005-05-26 3M Innovative Properties Company Solution containing surface-modified nanoparticles
KR20060017686A (ko) * 2004-08-21 2006-02-27 학교법인연세대학교 잉크젯 프린터용 전도성 잉크 조성물, 잉크젯 프린팅에의한 금속패턴 형성 방법 및 이에 의해 제조된 인쇄회로기판
JP2006335995A (ja) * 2005-06-06 2006-12-14 Hitachi Maxell Ltd インクジェット用導電性インク、導電性パターンおよび導電体
KR20080029826A (ko) * 2006-09-29 2008-04-03 주식회사 엘지화학 도전배선 형성용 페이스트에 사용되는 유기 은 착화합물
KR20080088712A (ko) * 2007-03-30 2008-10-06 삼성전자주식회사 전도성 잉크 조성물 및 이를 이용한 전도성 패턴의 형성방법
KR20100088483A (ko) * 2009-01-30 2010-08-09 삼성전자주식회사 전도성 금속이온 잉크 조성물 및 이의 제조방법

Also Published As

Publication number Publication date
US9449734B2 (en) 2016-09-20
JP5788003B2 (ja) 2015-09-30
WO2012026791A2 (ko) 2012-03-01
CN103080247B (zh) 2016-05-25
CN103080247A (zh) 2013-05-01
US20130277096A1 (en) 2013-10-24
JP2013541602A (ja) 2013-11-14
KR101302345B1 (ko) 2013-08-30
KR20120020086A (ko) 2012-03-07

Similar Documents

Publication Publication Date Title
WO2012026791A3 (ko) 전도성 금속 잉크 조성물 및 전도성 패턴의 형성방법
WO2011142558A3 (ko) 전도성 금속 잉크 조성물 및 전도성 패턴의 형성 방법
WO2011126706A3 (en) Printable materials and methods of manufacture thereof
IL198646A0 (en) Printable compositions containing silver nanoparticles, processes for producing electrically conductive coatings using the same, and coating prepared thereby
WO2012124979A3 (ko) 도전성 잉크 조성물, 이를 이용한 인쇄 방법 및 이에 의하여 제조된 도전성 패턴
GB2515934B (en) Manufacturing of high resolution conductive patterns using organometallic ink and banded anilox rolls
WO2008115530A3 (en) Polymer composition for preparing electronic devices by microcontact printing processes and products prepared by the processes
EP2332883A4 (en) METAL NANOBANDE, METHOD FOR PRODUCING THE SAME, AND CONDUCTIVE INK COMPOSITION AND CONDUCTIVE FILM COMPRISING SAME
WO2012023691A3 (ko) 인쇄 조성물 및 이를 이용한 인쇄방법
WO2010024564A3 (ko) 금속박편의 제조방법
HK1173475A1 (zh) 金屬墨水組合物、導電性圖案、方法和器件
WO2012074200A3 (ko) 저온소결 전도성 금속막 및 이의 제조방법
IL206805A0 (en) Printable composition for producing electroconductive coatings, and method for the production thereof
EP2540515A4 (en) INK COMPOSITION FOR CLEAN LAYERING, COATING METHOD AND PRINTED PRODUCT THEREWITH
BRPI1011514A2 (pt) método para fabricar partículas conformadas de metal de transição, partículas conformadas de metal de transição, dispersão, produto antimicrobiano, uso de partículas conformadas de metal de transição, e, tinta de impressão ou composição de revestimento.
WO2014009927A3 (en) Composition for forming a seed layer
MX2010010229A (es) Recubrimientos protectores para metales.
WO2013128449A3 (en) Inks containing metal precursors nanoparticles
EP2366271A4 (en) PRINTED ANTENNAS, PRINTING METHOD FOR ANTENNA AND DEVICE WITH THE PRINTED ANTENNA
EP2233230A4 (en) SILVER MICROPOW, SILVER INK, SILVER COATING AND PROCESSES FOR PRODUCING SUCH MATERIALS
EP2208559A4 (en) SILVER-MICROPARTICLE-CONTAINING COMPOSITION, METHOD FOR THE PRODUCTION OF THE COMPOSITION, METHOD FOR THE PRODUCTION OF SILVER MICROPARTICLES AND PASTE WITH THE SILVER MICROPARTICLES
WO2010051941A3 (en) Composition comprising propylene-olefin-copolymer waxes and carbon black
WO2011022655A8 (en) Methods for patterning substrates using heterogeneous stamps and stencils and methods of making the stamps and stencils
WO2012004082A3 (de) Quartäre-aminoalkoholfunktionelle, siliciumorganische verbindungen, diese enthaltende zusammensetzung sowie deren herstellung und verwendung
EP2479226A4 (en) POROUS STRUCTURE FOR FORMING A FINGERPRINT-RESISTANT COATING, METHOD FOR FORMING A FINGERPRINT-RESISTANT COATING WITH THE POROUS STRUCTURE, SUBSTRATE WITH THE FINGERPRINT-RESISTANT COATING MADE IN THIS PROCESS AND PRODUCTS WITH THE SUBSTRATE

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 201180041472.6

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 11820218

Country of ref document: EP

Kind code of ref document: A2

ENP Entry into the national phase

Ref document number: 2013525840

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 13819313

Country of ref document: US

122 Ep: pct application non-entry in european phase

Ref document number: 11820218

Country of ref document: EP

Kind code of ref document: A2