|
US6918731B2
(en)
|
2001-07-02 |
2005-07-19 |
Brooks Automation, Incorporated |
Fast swap dual substrate transport for load lock
|
|
WO2004010476A2
(en)
|
2002-07-22 |
2004-01-29 |
Brooks Automation, Inc. |
Substrate processing apparatus
|
|
US20070183871A1
(en)
*
|
2002-07-22 |
2007-08-09 |
Christopher Hofmeister |
Substrate processing apparatus
|
|
US7988398B2
(en)
|
2002-07-22 |
2011-08-02 |
Brooks Automation, Inc. |
Linear substrate transport apparatus
|
|
US7959395B2
(en)
|
2002-07-22 |
2011-06-14 |
Brooks Automation, Inc. |
Substrate processing apparatus
|
|
US8960099B2
(en)
*
|
2002-07-22 |
2015-02-24 |
Brooks Automation, Inc |
Substrate processing apparatus
|
|
FR2844258B1
(fr)
*
|
2002-09-06 |
2005-06-03 |
Recif Sa |
Systeme de transport et stockage de conteneurs de plaques de semi-conducteur, et mecanisme de transfert
|
|
FR2851946B1
(fr)
*
|
2003-03-05 |
2005-05-27 |
Airbus France |
Dispositif pour le deplacement d'une machine
|
|
JP4648190B2
(ja)
*
|
2003-03-28 |
2011-03-09 |
平田機工株式会社 |
基板搬送システム
|
|
US7458763B2
(en)
|
2003-11-10 |
2008-12-02 |
Blueshift Technologies, Inc. |
Mid-entry load lock for semiconductor handling system
|
|
US8696298B2
(en)
*
|
2003-11-10 |
2014-04-15 |
Brooks Automation, Inc. |
Semiconductor manufacturing process modules
|
|
US20070269297A1
(en)
*
|
2003-11-10 |
2007-11-22 |
Meulen Peter V D |
Semiconductor wafer handling and transport
|
|
US8812150B2
(en)
*
|
2003-11-10 |
2014-08-19 |
Brooks Automation, Inc. |
Semiconductor manufacturing process modules
|
|
US8313277B2
(en)
*
|
2003-11-10 |
2012-11-20 |
Brooks Automation, Inc. |
Semiconductor manufacturing process modules
|
|
US10086511B2
(en)
|
2003-11-10 |
2018-10-02 |
Brooks Automation, Inc. |
Semiconductor manufacturing systems
|
|
JP4122521B2
(ja)
*
|
2005-01-17 |
2008-07-23 |
村田機械株式会社 |
天井走行車システム
|
|
US9339900B2
(en)
*
|
2005-08-18 |
2016-05-17 |
Futrfab, Inc. |
Apparatus to support a cleanspace fabricator
|
|
US9457442B2
(en)
*
|
2005-06-18 |
2016-10-04 |
Futrfab, Inc. |
Method and apparatus to support process tool modules in a cleanspace fabricator
|
|
WO2006136187A1
(de)
*
|
2005-06-22 |
2006-12-28 |
Applied Materials Gmbh & Co. Kg |
Vorrichtung für die sukzessive beschichtung mehrerer substrate
|
|
KR20070008192A
(ko)
*
|
2005-07-13 |
2007-01-17 |
삼성전자주식회사 |
평판 표시 장치 제조용 반송 시스템
|
|
US7826924B2
(en)
*
|
2006-05-10 |
2010-11-02 |
Vinpower, Inc. |
Standalone intelligent autoloader with modularization architectures and self-adaptive motion control ability for mass optical disks duplication
|
|
US8398355B2
(en)
*
|
2006-05-26 |
2013-03-19 |
Brooks Automation, Inc. |
Linearly distributed semiconductor workpiece processing tool
|
|
US7925380B2
(en)
*
|
2006-07-19 |
2011-04-12 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Integrated transportation control for wafer fabrication facility
|
|
US7901539B2
(en)
*
|
2006-09-19 |
2011-03-08 |
Intevac, Inc. |
Apparatus and methods for transporting and processing substrates
|
|
US9524896B2
(en)
*
|
2006-09-19 |
2016-12-20 |
Brooks Automation Inc. |
Apparatus and methods for transporting and processing substrates
|
|
US8419341B2
(en)
|
2006-09-19 |
2013-04-16 |
Brooks Automation, Inc. |
Linear vacuum robot with Z motion and articulated arm
|
|
US8293066B2
(en)
*
|
2006-09-19 |
2012-10-23 |
Brooks Automation, Inc. |
Apparatus and methods for transporting and processing substrates
|
|
DE102006054846C5
(de)
*
|
2006-11-20 |
2012-05-03 |
Permatecs Gmbh |
Produktionsanlage zur Herstellung von Solarzellen im Inline-Verfahren, sowie Verfahren zur Integration eines Batch-Prozesses in eine mehrspurige Inline-Produktionsanlage für Solarzellen
|
|
US8950998B2
(en)
*
|
2007-02-27 |
2015-02-10 |
Brooks Automation, Inc. |
Batch substrate handling
|
|
US20090022572A1
(en)
*
|
2007-07-19 |
2009-01-22 |
Thomas Pass |
Cluster tool with a linear source
|
|
US20090065995A1
(en)
*
|
2007-09-11 |
2009-03-12 |
Atmel Corporation |
Ambidexturous Shuttle Spoon
|
|
JP5247094B2
(ja)
*
|
2007-09-14 |
2013-07-24 |
インテヴァック インコーポレイテッド |
基板処理システム
|
|
JP5330721B2
(ja)
*
|
2007-10-23 |
2013-10-30 |
オルボテック エルティ ソラー，エルエルシー |
処理装置および処理方法
|
|
JP5419384B2
(ja)
*
|
2008-05-20 |
2014-02-19 |
東京エレクトロン株式会社 |
真空処理装置
|
|
WO2009152365A1
(en)
*
|
2008-06-11 |
2009-12-17 |
Solar Implant Technologies Inc. |
Solar cell fabrication with faceting and ion implantation
|
|
CN102105384B
(zh)
*
|
2008-07-23 |
2013-07-17 |
株式会社大福 |
物品输送设备的学习装置及学习方法
|
|
JP5470770B2
(ja)
*
|
2008-08-07 |
2014-04-16 |
シンフォニアテクノロジー株式会社 |
真空処理装置
|
|
EP2161826B1
(de)
*
|
2008-09-09 |
2011-03-16 |
Siemens Aktiengesellschaft |
Transfervorrichtung mit dynamisch veränderbaren Antriebsbereichen
|
|
EP2187433B1
(en)
*
|
2008-11-12 |
2018-10-24 |
Intevac, Inc. |
Apparatus and method for transporting and processing substrates
|
|
CN101740439B
(zh)
*
|
2008-11-14 |
2014-05-07 |
布鲁克斯自动技术公司 |
用于传输和处理衬底的装置和方法
|
|
US20100162954A1
(en)
*
|
2008-12-31 |
2010-07-01 |
Lawrence Chung-Lai Lei |
Integrated facility and process chamber for substrate processing
|
|
US8367565B2
(en)
*
|
2008-12-31 |
2013-02-05 |
Archers Inc. |
Methods and systems of transferring, docking and processing substrates
|
|
US8110511B2
(en)
*
|
2009-01-03 |
2012-02-07 |
Archers Inc. |
Methods and systems of transferring a substrate to minimize heat loss
|
|
US7897525B2
(en)
*
|
2008-12-31 |
2011-03-01 |
Archers Inc. |
Methods and systems of transferring, docking and processing substrates
|
|
US20100162955A1
(en)
*
|
2008-12-31 |
2010-07-01 |
Lawrence Chung-Lai Lei |
Systems and methods for substrate processing
|
|
US8317934B2
(en)
*
|
2009-05-13 |
2012-11-27 |
Lam Research Corporation |
Multi-stage substrate cleaning method and apparatus
|
|
DE102009038756A1
(de)
*
|
2009-05-28 |
2010-12-09 |
Semilev Gmbh |
Vorrichtung zur partikelfreien Handhabung von Substraten
|
|
US8749053B2
(en)
|
2009-06-23 |
2014-06-10 |
Intevac, Inc. |
Plasma grid implant system for use in solar cell fabrications
|
|
US8602706B2
(en)
*
|
2009-08-17 |
2013-12-10 |
Brooks Automation, Inc. |
Substrate processing apparatus
|
|
EP2293321A1
(en)
*
|
2009-09-08 |
2011-03-09 |
Applied Materials, Inc. |
Mechanical modularity chambers
|
|
TWI436831B
(zh)
|
2009-12-10 |
2014-05-11 |
沃博提克Ｌｔ太陽公司 |
真空處理裝置之噴灑頭總成
|
|
TWI377162B
(en)
*
|
2010-04-19 |
2012-11-21 |
Gudeng Prec Industral Co Ltd |
Reticle pod
|
|
TWI451521B
(zh)
*
|
2010-06-21 |
2014-09-01 |
細美事有限公司 |
基板處理設備及基板處理方法
|
|
DE102010048909A1
(de)
*
|
2010-10-11 |
2012-04-12 |
Ekra Automatisierungssysteme Gmbh |
Prozessmaschine, insbesondere zum Bearbeiten und/oder Inspizieren von Substraten
|
|
SG180034A1
(en)
*
|
2010-10-14 |
2012-05-30 |
Rokko Ventures Pte Ltd |
System and method for offloading ic units
|
|
CN102054910B
(zh)
*
|
2010-11-19 |
2013-07-31 |
理想能源设备(上海)有限公司 |
Led芯片工艺集成系统及其处理方法
|
|
JP5785712B2
(ja)
*
|
2010-12-28 |
2015-09-30 |
株式会社日立ハイテクノロジーズ |
真空処理装置
|
|
US8459276B2
(en)
|
2011-05-24 |
2013-06-11 |
Orbotech LT Solar, LLC. |
Broken wafer recovery system
|
|
US9837294B2
(en)
|
2011-09-16 |
2017-12-05 |
Persimmon Technologies Corporation |
Wafer transport system
|
|
SG10201508582WA
(en)
|
2011-11-08 |
2015-11-27 |
Intevac Inc |
Substrate processing system and method
|
|
CN104094394A
(zh)
*
|
2012-02-08 |
2014-10-08 |
应用材料公司 |
用于分散的基板的具有蜂巢式结构的动态负载锁定
|
|
US20130218518A1
(en)
*
|
2012-02-21 |
2013-08-22 |
International Business Machines Corporation |
Automated, three dimensional mappable environmental sampling system and methods of use
|
|
JP2014036025A
(ja)
*
|
2012-08-07 |
2014-02-24 |
Hitachi High-Technologies Corp |
真空処理装置または真空処理装置の運転方法
|
|
US9558974B2
(en)
|
2012-09-27 |
2017-01-31 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Semiconductor processing station and method for processing semiconductor wafer
|
|
US20140119858A1
(en)
*
|
2012-10-31 |
2014-05-01 |
Sandisk 3D Llc |
Semiconductor Device Manufacturing Line
|
|
WO2014100506A1
(en)
|
2012-12-19 |
2014-06-26 |
Intevac, Inc. |
Grid for plasma ion implant
|
|
US10424498B2
(en)
|
2013-09-09 |
2019-09-24 |
Persimmon Technologies Corporation |
Substrate transport vacuum platform
|
|
TWI560125B
(en)
|
2013-10-15 |
2016-12-01 |
Inotera Memories Inc |
Overhead hoist transport system
|
|
CN103523555A
(zh)
*
|
2013-10-31 |
2014-01-22 |
京东方科技集团股份有限公司 |
一种基板反转装置
|
|
CN113270350A
(zh)
*
|
2014-01-17 |
2021-08-17 |
布鲁克斯自动化公司 |
衬底运输设备
|
|
JP6215785B2
(ja)
*
|
2014-06-30 |
2017-10-18 |
ファナック株式会社 |
ワーク搬送システム
|
|
US9818633B2
(en)
|
2014-10-17 |
2017-11-14 |
Lam Research Corporation |
Equipment front end module for transferring wafers and method of transferring wafers
|
|
US9673071B2
(en)
|
2014-10-23 |
2017-06-06 |
Lam Research Corporation |
Buffer station for thermal control of semiconductor substrates transferred therethrough and method of transferring semiconductor substrates
|
|
EP3016136B1
(en)
*
|
2014-10-27 |
2021-07-21 |
Robert Bosch GmbH |
Transport system with magnetically driven transport elements and according transportation method
|
|
EP3029723B1
(en)
*
|
2014-12-05 |
2020-09-16 |
Robert Bosch GmbH |
Transport device and transport method for transporting a fragile object
|
|
TWI676227B
(zh)
*
|
2015-01-23 |
2019-11-01 |
美商應用材料股份有限公司 |
半導體工藝設備
|
|
JP2017518626A
(ja)
*
|
2015-02-17 |
2017-07-06 |
ソーラーシティ コーポレーション |
太陽電池の製造歩留まりを向上させる方法及びシステム
|
|
US20160359080A1
(en)
|
2015-06-07 |
2016-12-08 |
Solarcity Corporation |
System, method and apparatus for chemical vapor deposition
|
|
CN104894527A
(zh)
*
|
2015-06-11 |
2015-09-09 |
科瑞自动化技术（苏州）有限公司 |
硬盘盘片真空溅射镀膜夹持工装
|
|
AT517532B1
(de)
*
|
2015-07-28 |
2017-06-15 |
Bernecker + Rainer Industrie-Elektronik Ges M B H |
Aufnahme
|
|
JP6455404B2
(ja)
*
|
2015-11-17 |
2019-01-23 |
株式会社ダイフク |
容器搬送設備
|
|
US20170194181A1
(en)
*
|
2016-01-04 |
2017-07-06 |
Micron Technology, Inc. |
Overhead traveling vehicle, transportation system with the same, and method of operating the same
|
|
CN105483619B
(zh)
*
|
2016-01-26 |
2018-01-02 |
京东方科技集团股份有限公司 |
移动靶镀膜装置及镀膜方法
|
|
US9633878B1
(en)
|
2016-04-21 |
2017-04-25 |
Texas Instuments Incorporated |
Conveyor apparatus and method for transporting leadframe
|
|
US9748434B1
(en)
|
2016-05-24 |
2017-08-29 |
Tesla, Inc. |
Systems, method and apparatus for curing conductive paste
|
|
US9954136B2
(en)
|
2016-08-03 |
2018-04-24 |
Tesla, Inc. |
Cassette optimized for an inline annealing system
|
|
US10115856B2
(en)
|
2016-10-31 |
2018-10-30 |
Tesla, Inc. |
System and method for curing conductive paste using induction heating
|
|
US10014201B1
(en)
|
2016-12-16 |
2018-07-03 |
Solarcity Corporation |
Magnetic wafer gripper
|
|
WO2019208337A1
(ja)
*
|
2018-04-27 |
2019-10-31 |
東京エレクトロン株式会社 |
基板処理システム、および基板処理方法
|
|
KR101892129B1
(ko)
*
|
2018-05-25 |
2018-10-04 |
주식회사 디엠티 |
진공 챔버 이송 장치
|
|
DE102018006259A1
(de)
*
|
2018-06-14 |
2019-12-19 |
Robert Bosch Gmbh |
Beförderungsvorrichtung zum Befördern mindestens eines Wafers
|
|
DE102018211839A1
(de)
*
|
2018-07-17 |
2020-01-23 |
Bausch + Ströbel Maschinenfabrik Ilshofen GmbH + Co. KG |
Transportsystem
|
|
CN109192687B
(zh)
*
|
2018-08-16 |
2022-05-27 |
北京华卓精科科技股份有限公司 |
一种传输硅片的机械装置
|
|
KR102531483B1
(ko)
|
2018-10-04 |
2023-05-10 |
어플라이드 머티어리얼스, 인코포레이티드 |
이송 시스템
|
|
JP7261000B2
(ja)
*
|
2018-12-03 |
2023-04-19 |
キヤノン株式会社 |
容器、処理装置、異物除去方法、および物品の製造方法
|
|
KR102733538B1
(ko)
*
|
2018-12-21 |
2024-11-21 |
어플라이드 머티어리얼스, 인코포레이티드 |
자기 부상 시스템, 자기 부상 시스템을 위한 캐리어, 진공 시스템, 및 캐리어를 이송하는 방법
|
|
WO2020147929A1
(en)
*
|
2019-01-15 |
2020-07-23 |
Applied Materials, Inc. |
Transport system for transporting a carrier, vacuum processing system and method for transportation of a carrier
|
|
KR102884991B1
(ko)
*
|
2019-02-14 |
2025-11-11 |
퍼시몬 테크놀로지스 코포레이션 |
2-링크 아암을 가진 선형 로봇
|
|
KR20250060934A
(ko)
*
|
2019-02-14 |
2025-05-07 |
퍼시몬 테크놀로지스 코포레이션 |
이송 장치 및 이송 장치를 제조하는 방법
|
|
KR20220010710A
(ko)
|
2019-02-14 |
2022-01-26 |
퍼시몬 테크놀로지스 코포레이션 |
기계적으로 안내되는 자재 취급 로봇
|
|
EP3699953B1
(en)
*
|
2019-02-21 |
2024-08-21 |
FEI Company |
Transport apparatus and method for transferring a sample between two devices, and system for sample manipulation
|
|
KR102211252B1
(ko)
*
|
2019-06-26 |
2021-02-04 |
세메스 주식회사 |
기판 처리 장치
|
|
US12389580B2
(en)
*
|
2019-09-20 |
2025-08-12 |
Fuji Corporation |
Storage
|
|
US11049740B1
(en)
*
|
2019-12-05 |
2021-06-29 |
Applied Materials, Inc. |
Reconfigurable mainframe with replaceable interface plate
|
|
TWI870551B
(zh)
|
2020-02-20 |
2025-01-21 |
美商布魯克斯自動機械美國公司 |
線性電機、電磁輸送帶基板輸送裝置、及用於線性電機的方法
|
|
US11527424B2
(en)
|
2020-03-20 |
2022-12-13 |
Applied Materials, Inc. |
Substrate transfer systems and methods of use thereof
|
|
WO2021192001A1
(ja)
|
2020-03-24 |
2021-09-30 |
株式会社日立ハイテク |
真空処理装置
|
|
US11521870B2
(en)
|
2020-07-08 |
2022-12-06 |
Applied Materials, Inc. |
Annealing chamber
|
|
DE102020212223A1
(de)
*
|
2020-09-29 |
2022-03-31 |
Robert Bosch Gesellschaft mit beschränkter Haftung |
Berührungslose Beförderungsvorrichtung
|
|
CN112736000A
(zh)
*
|
2020-12-31 |
2021-04-30 |
上海广川科技有限公司 |
一种真空传送装置及传送方法
|
|
JP7608898B2
(ja)
*
|
2021-03-16 |
2025-01-07 |
東京エレクトロン株式会社 |
基板を処理する装置及び基板を搬送する方法
|
|
DE102021202915A1
(de)
*
|
2021-03-25 |
2022-09-29 |
Robert Bosch Gesellschaft mit beschränkter Haftung |
Berührungslose Beförderungsvorrichtung
|
|
CN113707585A
(zh)
*
|
2021-08-23 |
2021-11-26 |
上海引万光电科技有限公司 |
一种磁悬浮式衬底传送腔及传送方法
|
|
US12106991B2
(en)
|
2021-09-22 |
2024-10-01 |
Applied Materials, Inc. |
Substrate transfer systems and methods of use thereof
|
|
DE102021211426A1
(de)
|
2021-10-11 |
2023-04-13 |
Robert Bosch Gesellschaft mit beschränkter Haftung |
Anlage zur Durchführung von Arbeitsprozessen an Werkstücken oder dgl.
|
|
DE102021211428A1
(de)
|
2021-10-11 |
2023-04-13 |
Robert Bosch Gesellschaft mit beschränkter Haftung |
Anlage zur Durchführung von Arbeitsprozessen an Werkstücken oder dgl.
|
|
US12206342B2
(en)
|
2021-10-29 |
2025-01-21 |
Brooks Automation Us, Llc |
Substrate processing apparatus
|
|
JP7771651B2
(ja)
*
|
2021-11-12 |
2025-11-18 |
東京エレクトロン株式会社 |
基板搬送装置及び基板搬送方法
|
|
CN114551309A
(zh)
*
|
2022-01-28 |
2022-05-27 |
上海广川科技有限公司 |
一种晶圆传输的过渡装置及其形成的晶圆传输系统
|
|
JP7710380B2
(ja)
*
|
2022-01-31 |
2025-07-18 |
東京エレクトロン株式会社 |
基板処理システム及びパーティクル除去方法
|
|
JP2024023152A
(ja)
*
|
2022-08-08 |
2024-02-21 |
エーエスエム・アイピー・ホールディング・ベー・フェー |
半導体ウエハ収容カセットを処理するためのシステム、組み合わせ、および搬送する方法
|
|
US20240153803A1
(en)
|
2022-11-07 |
2024-05-09 |
Applied Materials, Inc. |
Semiconductor process equipment
|
|
US12273051B2
(en)
|
2022-12-14 |
2025-04-08 |
Applied Materials, Inc. |
Apparatus and method for contactless transportation of a carrier
|
|
JP2024131483A
(ja)
*
|
2023-03-16 |
2024-09-30 |
キオクシア株式会社 |
半導体製造装置
|
|
US12548743B2
(en)
|
2023-09-01 |
2026-02-10 |
Applied Materials, Inc. |
Passive lift pin assembly
|
|
USD1122216S1
(en)
|
2023-10-02 |
2026-04-14 |
Applied Materials, Inc. |
Substrate carrier
|
|
USD1118552S1
(en)
|
2023-10-24 |
2026-03-17 |
Applied Materials, Inc. |
Substrate carrier
|
|
DE102023134169B3
(de)
*
|
2023-12-06 |
2025-05-08 |
Physik Instrumente (PI) SE & Co KG |
Verfahren zur Ausrichtung einer Kopplungskomponente an einer optischen oder elektronischen Anwendungskomponente
|
|
WO2025230876A1
(en)
*
|
2024-04-30 |
2025-11-06 |
Applied Materials, Inc. |
Semiconductor process equipment
|
|
US12628612B2
(en)
|
2024-06-06 |
2026-05-12 |
Applied Materials, Inc. |
Magnetic sensor assembly for a substrate process station
|
|
CN118700016A
(zh)
*
|
2024-07-23 |
2024-09-27 |
吉姆西半导体科技(无锡)股份有限公司 |
一种晶圆加工设备
|
|
MY209314A
(en)
|
2025-01-03 |
2025-07-02 |
Srm Integration Malaysia Sdn Bhd |
Wireless shuttle, system and method for automated handling electronic devices
|
|
CN120887230B
(zh)
*
|
2025-10-09 |
2025-12-09 |
苏州和自兴智能科技有限公司 |
一种输送线自适应调节对接机构
|