JP2005320631A5 - - Google Patents

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Publication number
JP2005320631A5
JP2005320631A5 JP2005126027A JP2005126027A JP2005320631A5 JP 2005320631 A5 JP2005320631 A5 JP 2005320631A5 JP 2005126027 A JP2005126027 A JP 2005126027A JP 2005126027 A JP2005126027 A JP 2005126027A JP 2005320631 A5 JP2005320631 A5 JP 2005320631A5
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JP
Japan
Prior art keywords
plated
substrates
electrical appliances
products
packaging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005126027A
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English (en)
Japanese (ja)
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JP2005320631A (ja
JP4740632B2 (ja
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Application filed filed Critical
Publication of JP2005320631A publication Critical patent/JP2005320631A/ja
Publication of JP2005320631A5 publication Critical patent/JP2005320631A5/ja
Application granted granted Critical
Publication of JP4740632B2 publication Critical patent/JP4740632B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2005126027A 2004-04-26 2005-04-25 改善されたメッキ方法 Expired - Fee Related JP4740632B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US56541504P 2004-04-26 2004-04-26
US60/565415 2004-04-26

Publications (3)

Publication Number Publication Date
JP2005320631A JP2005320631A (ja) 2005-11-17
JP2005320631A5 true JP2005320631A5 (enExample) 2011-05-06
JP4740632B2 JP4740632B2 (ja) 2011-08-03

Family

ID=34941003

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005126027A Expired - Fee Related JP4740632B2 (ja) 2004-04-26 2005-04-25 改善されたメッキ方法

Country Status (7)

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US (2) US7582199B2 (enExample)
EP (1) EP1598449B1 (enExample)
JP (1) JP4740632B2 (enExample)
KR (1) KR101185194B1 (enExample)
CN (1) CN1749442B (enExample)
DE (1) DE602005022650D1 (enExample)
TW (1) TWI361639B (enExample)

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US10190232B2 (en) 2013-08-06 2019-01-29 Lam Research Corporation Apparatuses and methods for maintaining pH in nickel electroplating baths
CA2920523A1 (en) * 2013-08-07 2015-02-12 Xagenic Inc. Sensor growth controller
CN103409780B (zh) * 2013-08-13 2016-01-20 山东大学 一种对纳米多孔金进行表面合金修饰的方法
JP2015106653A (ja) * 2013-11-29 2015-06-08 イビデン株式会社 プリント配線板の製造方法
US9732434B2 (en) 2014-04-18 2017-08-15 Lam Research Corporation Methods and apparatuses for electroplating nickel using sulfur-free nickel anodes
US10154598B2 (en) * 2014-10-13 2018-12-11 Rohm And Haas Electronic Materials Llc Filling through-holes
JP6641717B2 (ja) * 2015-04-08 2020-02-05 日立化成株式会社 多層配線基板の製造方法
US20170016131A1 (en) * 2015-07-15 2017-01-19 Far East University Growth method of dendritic crystal structure that provides directional heat transfer
US10508357B2 (en) 2016-02-15 2019-12-17 Rohm And Haas Electronic Materials Llc Method of filling through-holes to reduce voids and other defects
CA3119028A1 (en) * 2018-11-07 2020-05-14 Coventya, Inc. Satin copper bath and method of depositing a satin copper layer
JP7107190B2 (ja) * 2018-11-28 2022-07-27 住友金属鉱山株式会社 銅張積層板の製造方法
US10612149B1 (en) * 2019-09-05 2020-04-07 Chow Sang Sang Jewellery Company Limited Platinum electrodeposition bath and uses thereof
CN115058757B (zh) * 2022-07-04 2024-05-24 厦门海辰新材料科技有限公司 电镀设备及镀膜机
CN120993822A (zh) * 2025-10-24 2025-11-21 广东硕成科技股份有限公司 一种直流电镀铜的电流控制方法与应用

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