GB710375A - Improvements in or relating to electroplating - Google Patents

Improvements in or relating to electroplating

Info

Publication number
GB710375A
GB710375A GB25078/51A GB2507851A GB710375A GB 710375 A GB710375 A GB 710375A GB 25078/51 A GB25078/51 A GB 25078/51A GB 2507851 A GB2507851 A GB 2507851A GB 710375 A GB710375 A GB 710375A
Authority
GB
United Kingdom
Prior art keywords
plating
copper
current
metal
plated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB25078/51A
Inventor
George William Jernstedt
James Douglas Patrick
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Westinghouse Electric International Co
Original Assignee
Westinghouse Electric International Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Electric International Co filed Critical Westinghouse Electric International Co
Priority to GB25078/51A priority Critical patent/GB710375A/en
Publication of GB710375A publication Critical patent/GB710375A/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60Electroplating characterised by the structure or texture of the layers
    • C25D5/605Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611Smooth layers
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18Electroplating using modulated, pulsed or reversing current
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60Electroplating characterised by the structure or texture of the layers
    • C25D5/623Porosity of the layers
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance

Abstract

710,375. Electro-plating. WESTING- HOUSE ELECTRIC INTERNATIONAL CO. Oct. 26, 1951, No. 25078/51. Drawings to Specification. Class 41. A process of electro-plating on a base member a metal from the group consisting of copper, silver, zinc, cadmium, tin, gold and alloys in which these metals predominate, utilizes a plurality of cycles of periodically-reversed current, each cycle comprising a plating electrical current for at least 45 seconds to plate metal on the base members, and a de-plating electrical current for a period of time at least 30 per cent of the plating period, the average de-plating current density on the member being less than the average plating current density, and the coulombs delivered by the deplating current being between 30 per cent and 95 per cent of the coulombs delivered during the plating portion of the cycle, whereby a substantial portion of the previously-plated metal is de-plated, the plurality of cycles producing a smooth level deposit of plated metal. In the plating of copper an alkaline cyanide electrolyte containing from .0038 to .57 ozs. per gallon of zinc and from i to 10 ozs. per gallon of thiocyanate as addition agents may be used. The electrolyte and base member may have a relative movement of at least one foot a minute. Examples are given of aqueous cyanide baths for the plating of copper, brass, cadmium, silver and gold, and an acid bath for the plating of copper. Electrotypes and electroforming base members consisting of wax or resinous patterns plated or coated with powdered graphite or precipitated silver may be electroplated by the process claimed, and the electrodeposited metal stripped off. Plating in accordance with the invention may be followed by plating of nickel and chromium by direct current, without need for buffing. Specification 630,165 is referred to.
GB25078/51A 1951-10-26 1951-10-26 Improvements in or relating to electroplating Expired GB710375A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB25078/51A GB710375A (en) 1951-10-26 1951-10-26 Improvements in or relating to electroplating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB25078/51A GB710375A (en) 1951-10-26 1951-10-26 Improvements in or relating to electroplating

Publications (1)

Publication Number Publication Date
GB710375A true GB710375A (en) 1954-06-09

Family

ID=10221847

Family Applications (1)

Application Number Title Priority Date Filing Date
GB25078/51A Expired GB710375A (en) 1951-10-26 1951-10-26 Improvements in or relating to electroplating

Country Status (1)

Country Link
GB (1) GB710375A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1598449A3 (en) * 2004-04-26 2007-01-31 Rohm and Haas Electronic Materials, L.L.C. Improved plating method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1598449A3 (en) * 2004-04-26 2007-01-31 Rohm and Haas Electronic Materials, L.L.C. Improved plating method
US7582199B2 (en) 2004-04-26 2009-09-01 Rohm And Haas Electronic Materials Llc Plating method
US8945362B2 (en) 2004-04-26 2015-02-03 Rohm And Haas Electronic Materials Llc Plating method

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