TWI361639B - Plating method and article comprising substrate having metal layer - Google Patents

Plating method and article comprising substrate having metal layer Download PDF

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Publication number
TWI361639B
TWI361639B TW094113202A TW94113202A TWI361639B TW I361639 B TWI361639 B TW I361639B TW 094113202 A TW094113202 A TW 094113202A TW 94113202 A TW94113202 A TW 94113202A TW I361639 B TWI361639 B TW I361639B
Authority
TW
Taiwan
Prior art keywords
metal
substrate
copper
current
electrolyte
Prior art date
Application number
TW094113202A
Other languages
English (en)
Chinese (zh)
Other versions
TW200610454A (en
Inventor
Jacek M Knop
John G Carter
Donald E Cleary
Original Assignee
Rohm & Haas Elect Mat
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm & Haas Elect Mat filed Critical Rohm & Haas Elect Mat
Publication of TW200610454A publication Critical patent/TW200610454A/zh
Application granted granted Critical
Publication of TWI361639B publication Critical patent/TWI361639B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
TW094113202A 2004-04-26 2005-04-26 Plating method and article comprising substrate having metal layer TWI361639B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US56541504P 2004-04-26 2004-04-26

Publications (2)

Publication Number Publication Date
TW200610454A TW200610454A (en) 2006-03-16
TWI361639B true TWI361639B (en) 2012-04-01

Family

ID=34941003

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094113202A TWI361639B (en) 2004-04-26 2005-04-26 Plating method and article comprising substrate having metal layer

Country Status (7)

Country Link
US (2) US7582199B2 (enExample)
EP (1) EP1598449B1 (enExample)
JP (1) JP4740632B2 (enExample)
KR (1) KR101185194B1 (enExample)
CN (1) CN1749442B (enExample)
DE (1) DE602005022650D1 (enExample)
TW (1) TWI361639B (enExample)

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US10154598B2 (en) * 2014-10-13 2018-12-11 Rohm And Haas Electronic Materials Llc Filling through-holes
JP6641717B2 (ja) * 2015-04-08 2020-02-05 日立化成株式会社 多層配線基板の製造方法
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JP7107190B2 (ja) * 2018-11-28 2022-07-27 住友金属鉱山株式会社 銅張積層板の製造方法
US10612149B1 (en) * 2019-09-05 2020-04-07 Chow Sang Sang Jewellery Company Limited Platinum electrodeposition bath and uses thereof
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Also Published As

Publication number Publication date
CN1749442A (zh) 2006-03-22
KR101185194B1 (ko) 2012-09-24
TW200610454A (en) 2006-03-16
US8945362B2 (en) 2015-02-03
EP1598449A3 (en) 2007-01-31
US20060012044A1 (en) 2006-01-19
US20090188804A1 (en) 2009-07-30
EP1598449B1 (en) 2010-08-04
US7582199B2 (en) 2009-09-01
JP2005320631A (ja) 2005-11-17
JP4740632B2 (ja) 2011-08-03
EP1598449A2 (en) 2005-11-23
KR20060045837A (ko) 2006-05-17
DE602005022650D1 (de) 2010-09-16
CN1749442B (zh) 2013-01-02

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