KR101185194B1 - 개선된 도금 방법 - Google Patents

개선된 도금 방법 Download PDF

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Publication number
KR101185194B1
KR101185194B1 KR1020050033996A KR20050033996A KR101185194B1 KR 101185194 B1 KR101185194 B1 KR 101185194B1 KR 1020050033996 A KR1020050033996 A KR 1020050033996A KR 20050033996 A KR20050033996 A KR 20050033996A KR 101185194 B1 KR101185194 B1 KR 101185194B1
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KR
South Korea
Prior art keywords
metal
current
minutes
copper
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020050033996A
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English (en)
Korean (ko)
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KR20060045837A (ko
Inventor
제이섹 엠. 놉
존 지. 카터
도날드 이. 클리어리
Original Assignee
롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨.
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Application filed by 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨. filed Critical 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨.
Publication of KR20060045837A publication Critical patent/KR20060045837A/ko
Application granted granted Critical
Publication of KR101185194B1 publication Critical patent/KR101185194B1/ko
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
KR1020050033996A 2004-04-26 2005-04-25 개선된 도금 방법 Expired - Fee Related KR101185194B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US56541504P 2004-04-26 2004-04-26
US60/565,415 2004-04-26

Publications (2)

Publication Number Publication Date
KR20060045837A KR20060045837A (ko) 2006-05-17
KR101185194B1 true KR101185194B1 (ko) 2012-09-24

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050033996A Expired - Fee Related KR101185194B1 (ko) 2004-04-26 2005-04-25 개선된 도금 방법

Country Status (7)

Country Link
US (2) US7582199B2 (enExample)
EP (1) EP1598449B1 (enExample)
JP (1) JP4740632B2 (enExample)
KR (1) KR101185194B1 (enExample)
CN (1) CN1749442B (enExample)
DE (1) DE602005022650D1 (enExample)
TW (1) TWI361639B (enExample)

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JP4759416B2 (ja) * 2006-03-20 2011-08-31 新光電気工業株式会社 非シアン無電解金めっき液及び無電解金めっき方法
US7575666B2 (en) 2006-04-05 2009-08-18 James Watkowski Process for electrolytically plating copper
US20090038947A1 (en) * 2007-08-07 2009-02-12 Emat Technology, Llc. Electroplating aqueous solution and method of making and using same
JP5010685B2 (ja) * 2007-10-26 2012-08-29 クムホ エレクトリック インコーポレイテッド 電界放出装置
US20090188553A1 (en) * 2008-01-25 2009-07-30 Emat Technology, Llc Methods of fabricating solar-cell structures and resulting solar-cell structures
US20090250352A1 (en) * 2008-04-04 2009-10-08 Emat Technology, Llc Methods for electroplating copper
JP5084766B2 (ja) * 2009-03-11 2012-11-28 住友電気工業株式会社 薄膜超電導線材および超電導ケーブル導体
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US9816193B2 (en) 2011-01-07 2017-11-14 Novellus Systems, Inc. Configuration and method of operation of an electrodeposition system for improved process stability and performance
JP5981455B2 (ja) * 2011-01-26 2016-08-31 エンソン インコーポレイテッド マイクロ電子工業におけるビアホール充填方法
EP2568063A1 (en) * 2011-09-09 2013-03-13 Rohm and Haas Electronic Materials LLC Low internal stress copper electroplating method
CN102510668B (zh) * 2011-11-08 2014-02-19 深圳市景旺电子股份有限公司 一种超厚铜pcb板制作方法及其电路板
US20130220819A1 (en) * 2012-02-27 2013-08-29 Faraday Technology, Inc. Electrodeposition of chromium from trivalent chromium using modulated electric fields
US9816196B2 (en) 2012-04-27 2017-11-14 Novellus Systems, Inc. Method and apparatus for electroplating semiconductor wafer when controlling cations in electrolyte
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US9611550B2 (en) 2012-12-26 2017-04-04 Rohm And Haas Electronic Materials Llc Formaldehyde free electroless copper plating compositions and methods
US10190232B2 (en) 2013-08-06 2019-01-29 Lam Research Corporation Apparatuses and methods for maintaining pH in nickel electroplating baths
CA2920523A1 (en) * 2013-08-07 2015-02-12 Xagenic Inc. Sensor growth controller
CN103409780B (zh) * 2013-08-13 2016-01-20 山东大学 一种对纳米多孔金进行表面合金修饰的方法
JP2015106653A (ja) * 2013-11-29 2015-06-08 イビデン株式会社 プリント配線板の製造方法
US9732434B2 (en) 2014-04-18 2017-08-15 Lam Research Corporation Methods and apparatuses for electroplating nickel using sulfur-free nickel anodes
US10154598B2 (en) * 2014-10-13 2018-12-11 Rohm And Haas Electronic Materials Llc Filling through-holes
JP6641717B2 (ja) * 2015-04-08 2020-02-05 日立化成株式会社 多層配線基板の製造方法
US20170016131A1 (en) * 2015-07-15 2017-01-19 Far East University Growth method of dendritic crystal structure that provides directional heat transfer
US10508357B2 (en) 2016-02-15 2019-12-17 Rohm And Haas Electronic Materials Llc Method of filling through-holes to reduce voids and other defects
CA3119028A1 (en) * 2018-11-07 2020-05-14 Coventya, Inc. Satin copper bath and method of depositing a satin copper layer
JP7107190B2 (ja) * 2018-11-28 2022-07-27 住友金属鉱山株式会社 銅張積層板の製造方法
US10612149B1 (en) * 2019-09-05 2020-04-07 Chow Sang Sang Jewellery Company Limited Platinum electrodeposition bath and uses thereof
CN115058757B (zh) * 2022-07-04 2024-05-24 厦门海辰新材料科技有限公司 电镀设备及镀膜机
CN120993822A (zh) * 2025-10-24 2025-11-21 广东硕成科技股份有限公司 一种直流电镀铜的电流控制方法与应用

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JPS62127493A (ja) 1985-11-28 1987-06-09 Sumitomo Metal Mining Co Ltd 電気錫メツキ法
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Publication number Priority date Publication date Assignee Title
JPS602692A (ja) 1983-05-26 1985-01-08 Sumitomo Metal Mining Co Ltd 銀メツキ方法
JPS62127493A (ja) 1985-11-28 1987-06-09 Sumitomo Metal Mining Co Ltd 電気錫メツキ法
JP2000087292A (ja) * 1998-09-14 2000-03-28 Ibiden Co Ltd 電気めっき方法、電気めっきによる回路板及びプリント配線板の製造方法、並びに銅被膜からなる回路を有する回路板及び銅被膜からなる配線を有するプリント配線板

Also Published As

Publication number Publication date
CN1749442A (zh) 2006-03-22
TW200610454A (en) 2006-03-16
US8945362B2 (en) 2015-02-03
EP1598449A3 (en) 2007-01-31
US20060012044A1 (en) 2006-01-19
US20090188804A1 (en) 2009-07-30
EP1598449B1 (en) 2010-08-04
US7582199B2 (en) 2009-09-01
JP2005320631A (ja) 2005-11-17
JP4740632B2 (ja) 2011-08-03
EP1598449A2 (en) 2005-11-23
KR20060045837A (ko) 2006-05-17
DE602005022650D1 (de) 2010-09-16
TWI361639B (en) 2012-04-01
CN1749442B (zh) 2013-01-02

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