JP2005274243A - 被検体の検査装置及びその検査方法 - Google Patents

被検体の検査装置及びその検査方法 Download PDF

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Publication number
JP2005274243A
JP2005274243A JP2004085650A JP2004085650A JP2005274243A JP 2005274243 A JP2005274243 A JP 2005274243A JP 2004085650 A JP2004085650 A JP 2004085650A JP 2004085650 A JP2004085650 A JP 2004085650A JP 2005274243 A JP2005274243 A JP 2005274243A
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JP
Japan
Prior art keywords
inspection
wafer
cassette
subject
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004085650A
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English (en)
Japanese (ja)
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JP2005274243A5 (https=
Inventor
Masahiko Yazawa
雅彦 矢沢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olympus Corp
Original Assignee
Olympus Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Corp filed Critical Olympus Corp
Priority to JP2004085650A priority Critical patent/JP2005274243A/ja
Priority to TW094108407A priority patent/TW200533907A/zh
Priority to US11/086,900 priority patent/US20050232735A1/en
Priority to KR1020050023985A priority patent/KR20060044613A/ko
Priority to CNA2005100594091A priority patent/CN1673719A/zh
Publication of JP2005274243A publication Critical patent/JP2005274243A/ja
Publication of JP2005274243A5 publication Critical patent/JP2005274243A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices

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  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
JP2004085650A 2004-03-23 2004-03-23 被検体の検査装置及びその検査方法 Pending JP2005274243A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2004085650A JP2005274243A (ja) 2004-03-23 2004-03-23 被検体の検査装置及びその検査方法
TW094108407A TW200533907A (en) 2004-03-23 2005-03-18 Apparatus and method for inspecting an inspection object
US11/086,900 US20050232735A1 (en) 2004-03-23 2005-03-21 Apparatus and method for inspecting an inspection object
KR1020050023985A KR20060044613A (ko) 2004-03-23 2005-03-23 피검체의 검사장치 및 그 검사방법
CNA2005100594091A CN1673719A (zh) 2004-03-23 2005-03-23 用于检查检查物体的装置和方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004085650A JP2005274243A (ja) 2004-03-23 2004-03-23 被検体の検査装置及びその検査方法

Publications (2)

Publication Number Publication Date
JP2005274243A true JP2005274243A (ja) 2005-10-06
JP2005274243A5 JP2005274243A5 (https=) 2007-05-17

Family

ID=35046394

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004085650A Pending JP2005274243A (ja) 2004-03-23 2004-03-23 被検体の検査装置及びその検査方法

Country Status (5)

Country Link
US (1) US20050232735A1 (https=)
JP (1) JP2005274243A (https=)
KR (1) KR20060044613A (https=)
CN (1) CN1673719A (https=)
TW (1) TW200533907A (https=)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007120994A (ja) * 2005-10-25 2007-05-17 Horiba Ltd パネル部材検査装置及びそれに適用されるパネル部材検査用プログラム
KR100833716B1 (ko) 2007-03-30 2008-05-29 (주) 인텍플러스 반도체 소자 비전 검사 시스템
CN102736008A (zh) * 2011-04-08 2012-10-17 赛科隆股份有限公司 检查发光装置的方法
KR101287229B1 (ko) * 2011-11-04 2013-07-17 세메스 주식회사 발광 소자들의 검사 공정에서 웨이퍼를 이송하는 방법
JP2016203362A (ja) * 2015-04-28 2016-12-08 株式会社ディスコ 加工装置
JP2018128339A (ja) * 2017-02-08 2018-08-16 住友化学株式会社 半導体ウェハの表面検査装置及び半導体ウェハの表面検査方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007256173A (ja) * 2006-03-24 2007-10-04 Olympus Corp 外観検査装置
FR2931295B1 (fr) * 2008-05-13 2010-08-20 Altatech Semiconductor Dispositif et procede d'inspection de plaquettes semi-conductrices
JP7274350B2 (ja) * 2019-05-28 2023-05-16 東京エレクトロン株式会社 搬送システム、検査システム及び検査方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000097886A (ja) * 1998-09-21 2000-04-07 Rigaku Industrial Co 蛍光ｘ線分析装置
JP2002076077A (ja) * 2000-08-31 2002-03-15 Nikon Corp 検査装置
JP2002280425A (ja) * 2001-03-16 2002-09-27 Hitachi Ltd 半導体集積回路装置の製造方法およびテスト方法
WO2003012837A1 (fr) * 2001-07-31 2003-02-13 Asahi Kasei Microsystems Co.,Ltd. Systeme de gestion de la fabrication de semi-conducteurs

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3468056B2 (ja) * 1997-09-23 2003-11-17 東京エレクトロン株式会社 基板検出装置
US6137303A (en) * 1998-12-14 2000-10-24 Sony Corporation Integrated testing method and apparatus for semiconductor test operations processing
DE10103253A1 (de) * 2001-01-25 2002-08-01 Leica Microsystems Verfahren und Anordnung zum Transportieren und Inspizieren von Halbleitersubstraten

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000097886A (ja) * 1998-09-21 2000-04-07 Rigaku Industrial Co 蛍光ｘ線分析装置
JP2002076077A (ja) * 2000-08-31 2002-03-15 Nikon Corp 検査装置
JP2002280425A (ja) * 2001-03-16 2002-09-27 Hitachi Ltd 半導体集積回路装置の製造方法およびテスト方法
WO2003012837A1 (fr) * 2001-07-31 2003-02-13 Asahi Kasei Microsystems Co.,Ltd. Systeme de gestion de la fabrication de semi-conducteurs

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007120994A (ja) * 2005-10-25 2007-05-17 Horiba Ltd パネル部材検査装置及びそれに適用されるパネル部材検査用プログラム
KR100833716B1 (ko) 2007-03-30 2008-05-29 (주) 인텍플러스 반도체 소자 비전 검사 시스템
WO2008120881A1 (en) * 2007-03-30 2008-10-09 Intekplus Co., Ltd System for vision inspection of semiconductor device
CN102736008A (zh) * 2011-04-08 2012-10-17 赛科隆股份有限公司 检查发光装置的方法
KR101227812B1 (ko) * 2011-04-08 2013-02-07 세크론 주식회사 발광 소자 검사 방법
TWI507695B (zh) * 2011-04-08 2015-11-11 細美事有限公司 檢測發光元件的方法
CN102736008B (zh) * 2011-04-08 2015-11-25 细美事有限公司 检查发光装置的方法
KR101287229B1 (ko) * 2011-11-04 2013-07-17 세메스 주식회사 발광 소자들의 검사 공정에서 웨이퍼를 이송하는 방법
JP2016203362A (ja) * 2015-04-28 2016-12-08 株式会社ディスコ 加工装置
JP2018128339A (ja) * 2017-02-08 2018-08-16 住友化学株式会社 半導体ウェハの表面検査装置及び半導体ウェハの表面検査方法

Also Published As

Publication number Publication date
KR20060044613A (ko) 2006-05-16
TW200533907A (en) 2005-10-16
US20050232735A1 (en) 2005-10-20
CN1673719A (zh) 2005-09-28

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