KR20060044613A - 피검체의 검사장치 및 그 검사방법 - Google Patents

피검체의 검사장치 및 그 검사방법 Download PDF

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Publication number
KR20060044613A
KR20060044613A KR1020050023985A KR20050023985A KR20060044613A KR 20060044613 A KR20060044613 A KR 20060044613A KR 1020050023985 A KR1020050023985 A KR 1020050023985A KR 20050023985 A KR20050023985 A KR 20050023985A KR 20060044613 A KR20060044613 A KR 20060044613A
Authority
KR
South Korea
Prior art keywords
inspection
cassette
wafer
subject
stored
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020050023985A
Other languages
English (en)
Korean (ko)
Inventor
마사히코 야자와
Original Assignee
올림푸스 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 올림푸스 가부시키가이샤 filed Critical 올림푸스 가부시키가이샤
Publication of KR20060044613A publication Critical patent/KR20060044613A/ko
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices

Landscapes

  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
KR1020050023985A 2004-03-23 2005-03-23 피검체의 검사장치 및 그 검사방법 Withdrawn KR20060044613A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2004-00085650 2004-03-23
JP2004085650A JP2005274243A (ja) 2004-03-23 2004-03-23 被検体の検査装置及びその検査方法

Publications (1)

Publication Number Publication Date
KR20060044613A true KR20060044613A (ko) 2006-05-16

Family

ID=35046394

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050023985A Withdrawn KR20060044613A (ko) 2004-03-23 2005-03-23 피검체의 검사장치 및 그 검사방법

Country Status (5)

Country Link
US (1) US20050232735A1 (https=)
JP (1) JP2005274243A (https=)
KR (1) KR20060044613A (https=)
CN (1) CN1673719A (https=)
TW (1) TW200533907A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018128339A (ja) * 2017-02-08 2018-08-16 住友化学株式会社 半導体ウェハの表面検査装置及び半導体ウェハの表面検査方法

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4578383B2 (ja) * 2005-10-25 2010-11-10 株式会社堀場製作所 パネル部材検査装置及びそれに適用されるパネル部材検査用プログラム
JP2007256173A (ja) * 2006-03-24 2007-10-04 Olympus Corp 外観検査装置
KR100833716B1 (ko) 2007-03-30 2008-05-29 (주) 인텍플러스 반도체 소자 비전 검사 시스템
FR2931295B1 (fr) * 2008-05-13 2010-08-20 Altatech Semiconductor Dispositif et procede d'inspection de plaquettes semi-conductrices
KR101227812B1 (ko) * 2011-04-08 2013-02-07 세크론 주식회사 발광 소자 검사 방법
KR101287229B1 (ko) * 2011-11-04 2013-07-17 세메스 주식회사 발광 소자들의 검사 공정에서 웨이퍼를 이송하는 방법
JP6448456B2 (ja) * 2015-04-28 2019-01-09 株式会社ディスコ 加工装置
JP7274350B2 (ja) * 2019-05-28 2023-05-16 東京エレクトロン株式会社 搬送システム、検査システム及び検査方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3468056B2 (ja) * 1997-09-23 2003-11-17 東京エレクトロン株式会社 基板検出装置
JP3270828B2 (ja) * 1998-09-21 2002-04-02 理学電機工業株式会社 蛍光ｘ線分析装置
US6137303A (en) * 1998-12-14 2000-10-24 Sony Corporation Integrated testing method and apparatus for semiconductor test operations processing
JP2002076077A (ja) * 2000-08-31 2002-03-15 Nikon Corp 検査装置
DE10103253A1 (de) * 2001-01-25 2002-08-01 Leica Microsystems Verfahren und Anordnung zum Transportieren und Inspizieren von Halbleitersubstraten
JP2002280425A (ja) * 2001-03-16 2002-09-27 Hitachi Ltd 半導体集積回路装置の製造方法およびテスト方法
WO2003012837A1 (fr) * 2001-07-31 2003-02-13 Asahi Kasei Microsystems Co.,Ltd. Systeme de gestion de la fabrication de semi-conducteurs

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018128339A (ja) * 2017-02-08 2018-08-16 住友化学株式会社 半導体ウェハの表面検査装置及び半導体ウェハの表面検査方法

Also Published As

Publication number Publication date
JP2005274243A (ja) 2005-10-06
TW200533907A (en) 2005-10-16
US20050232735A1 (en) 2005-10-20
CN1673719A (zh) 2005-09-28

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PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000