TW200533907A - Apparatus and method for inspecting an inspection object - Google Patents

Apparatus and method for inspecting an inspection object Download PDF

Info

Publication number
TW200533907A
TW200533907A TW094108407A TW94108407A TW200533907A TW 200533907 A TW200533907 A TW 200533907A TW 094108407 A TW094108407 A TW 094108407A TW 94108407 A TW94108407 A TW 94108407A TW 200533907 A TW200533907 A TW 200533907A
Authority
TW
Taiwan
Prior art keywords
inspection
wafer
box
inspected
item
Prior art date
Application number
TW094108407A
Other languages
English (en)
Chinese (zh)
Inventor
Masahiko Yazawa
Original Assignee
Olympus Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Corp filed Critical Olympus Corp
Publication of TW200533907A publication Critical patent/TW200533907A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices

Landscapes

  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
TW094108407A 2004-03-23 2005-03-18 Apparatus and method for inspecting an inspection object TW200533907A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004085650A JP2005274243A (ja) 2004-03-23 2004-03-23 被検体の検査装置及びその検査方法

Publications (1)

Publication Number Publication Date
TW200533907A true TW200533907A (en) 2005-10-16

Family

ID=35046394

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094108407A TW200533907A (en) 2004-03-23 2005-03-18 Apparatus and method for inspecting an inspection object

Country Status (5)

Country Link
US (1) US20050232735A1 (https=)
JP (1) JP2005274243A (https=)
KR (1) KR20060044613A (https=)
CN (1) CN1673719A (https=)
TW (1) TW200533907A (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4578383B2 (ja) * 2005-10-25 2010-11-10 株式会社堀場製作所 パネル部材検査装置及びそれに適用されるパネル部材検査用プログラム
JP2007256173A (ja) * 2006-03-24 2007-10-04 Olympus Corp 外観検査装置
KR100833716B1 (ko) 2007-03-30 2008-05-29 (주) 인텍플러스 반도체 소자 비전 검사 시스템
FR2931295B1 (fr) * 2008-05-13 2010-08-20 Altatech Semiconductor Dispositif et procede d'inspection de plaquettes semi-conductrices
KR101227812B1 (ko) * 2011-04-08 2013-02-07 세크론 주식회사 발광 소자 검사 방법
KR101287229B1 (ko) * 2011-11-04 2013-07-17 세메스 주식회사 발광 소자들의 검사 공정에서 웨이퍼를 이송하는 방법
JP6448456B2 (ja) * 2015-04-28 2019-01-09 株式会社ディスコ 加工装置
JP2018128339A (ja) * 2017-02-08 2018-08-16 住友化学株式会社 半導体ウェハの表面検査装置及び半導体ウェハの表面検査方法
JP7274350B2 (ja) * 2019-05-28 2023-05-16 東京エレクトロン株式会社 搬送システム、検査システム及び検査方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3468056B2 (ja) * 1997-09-23 2003-11-17 東京エレクトロン株式会社 基板検出装置
JP3270828B2 (ja) * 1998-09-21 2002-04-02 理学電機工業株式会社 蛍光ｘ線分析装置
US6137303A (en) * 1998-12-14 2000-10-24 Sony Corporation Integrated testing method and apparatus for semiconductor test operations processing
JP2002076077A (ja) * 2000-08-31 2002-03-15 Nikon Corp 検査装置
DE10103253A1 (de) * 2001-01-25 2002-08-01 Leica Microsystems Verfahren und Anordnung zum Transportieren und Inspizieren von Halbleitersubstraten
JP2002280425A (ja) * 2001-03-16 2002-09-27 Hitachi Ltd 半導体集積回路装置の製造方法およびテスト方法
WO2003012837A1 (fr) * 2001-07-31 2003-02-13 Asahi Kasei Microsystems Co.,Ltd. Systeme de gestion de la fabrication de semi-conducteurs

Also Published As

Publication number Publication date
KR20060044613A (ko) 2006-05-16
JP2005274243A (ja) 2005-10-06
US20050232735A1 (en) 2005-10-20
CN1673719A (zh) 2005-09-28

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