JP2005223165A - 窒化物系発光素子 - Google Patents
窒化物系発光素子 Download PDFInfo
- Publication number
- JP2005223165A JP2005223165A JP2004030048A JP2004030048A JP2005223165A JP 2005223165 A JP2005223165 A JP 2005223165A JP 2004030048 A JP2004030048 A JP 2004030048A JP 2004030048 A JP2004030048 A JP 2004030048A JP 2005223165 A JP2005223165 A JP 2005223165A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- nitride
- conductive substrate
- semiconductor element
- side electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 150000004767 nitrides Chemical class 0.000 title claims abstract description 210
- 239000000758 substrate Substances 0.000 claims abstract description 198
- 239000004065 semiconductor Substances 0.000 claims abstract description 114
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 32
- 229910052802 copper Inorganic materials 0.000 claims abstract description 32
- 239000010949 copper Substances 0.000 claims abstract description 32
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims abstract description 31
- 239000005751 Copper oxide Substances 0.000 claims abstract description 31
- 229910000431 copper oxide Inorganic materials 0.000 claims abstract description 31
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 18
- 229910044991 metal oxide Inorganic materials 0.000 claims description 8
- 150000004706 metal oxides Chemical class 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 55
- 230000003287 optical effect Effects 0.000 abstract description 6
- 230000006866 deterioration Effects 0.000 abstract description 2
- 238000005253 cladding Methods 0.000 description 46
- 238000000034 method Methods 0.000 description 44
- 238000000926 separation method Methods 0.000 description 35
- 239000000203 mixture Substances 0.000 description 29
- 238000002955 isolation Methods 0.000 description 18
- 239000010931 gold Substances 0.000 description 15
- 229910052594 sapphire Inorganic materials 0.000 description 15
- 239000010980 sapphire Substances 0.000 description 15
- 229910002704 AlGaN Inorganic materials 0.000 description 13
- 238000001771 vacuum deposition Methods 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 238000005530 etching Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 230000001681 protective effect Effects 0.000 description 8
- 239000000463 material Substances 0.000 description 5
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 4
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 238000001312 dry etching Methods 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 229910052732 germanium Inorganic materials 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 238000001039 wet etching Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910015363 Au—Sn Inorganic materials 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- NWAIGJYBQQYSPW-UHFFFAOYSA-N azanylidyneindigane Chemical compound [In]#N NWAIGJYBQQYSPW-UHFFFAOYSA-N 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- FOXXZZGDIAQPQI-XKNYDFJKSA-N Asp-Pro-Ser-Ser Chemical compound OC(=O)C[C@H](N)C(=O)N1CCC[C@H]1C(=O)N[C@@H](CO)C(=O)N[C@@H](CO)C(O)=O FOXXZZGDIAQPQI-XKNYDFJKSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910002677 Pd–Sn Inorganic materials 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 229910004541 SiN Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GEIAQOFPUVMAGM-UHFFFAOYSA-N ZrO Inorganic materials [Zr]=O GEIAQOFPUVMAGM-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 238000005121 nitriding Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 229910052716 thallium Inorganic materials 0.000 description 1
- -1 thallium nitride Chemical class 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0093—Wafer bonding; Removal of the growth substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0016—Processes relating to electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
- H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
- Led Device Packages (AREA)
Abstract
【解決手段】この窒化物系発光素子は、銅と酸化銅とを含む導電性基板1と、導電性基板1に接合された窒化物系半導体素子層10とを備えている。
【選択図】図1
Description
図1は、本発明の第1実施形態による窒化物系発光ダイオード素子(窒化物系発光素子)の構造を示した断面図である。まず、図1を参照して、第1実施形態による窒化物系発光ダイオード素子の構造について説明する。
図8は、本発明の第2実施形態による窒化物系発光ダイオード素子の構造を示した断面図である。図8を参照して、この第2実施形態では、上記第1実施形態と異なり、導電性基板として、70対30の割合で混合された銅と酸化銅とを含む導電性基板21を用いる場合について説明する。
図13は、本発明の第3実施形態による窒化物系発光ダイオード素子の構造を示した断面図である。図13を参照して、この第3実施形態では、上記第1および第2実施形態と異なり、導電性基板として、約170W/m・Kの熱伝導率を有するとともに、60対40の割合で混合された銅と酸化銅とを含む導電性基板31を用いる場合について説明する。
図21は、本発明の第4実施形態による窒化物系発光ダイオード素子の構造を示した断面図である。図21を参照して、この第4実施形態では、約50GPaのヤング率を有するとともに、45対55の割合で混合された銅と酸化銅とを含む導電性基板51を用いる場合について説明する。
図28は、本発明の第5実施形態による窒化物系発光ダイオード素子の構造を示した断面図である。図28を参照して、この第5実施形態では、約9.5×10−6/Kの線膨張係数を有するとともに、50対50の割合で混合された銅と酸化銅とを含む導電性基板71を用いる場合について説明する。
2、32、52、72 p側電極(電極)
3、33、53、73 p型コンタクト層(窒化物系半導体素子層)
4、34、74 p型クラッド層(窒化物系半導体素子層)
5、35、54、75 キャップ層(窒化物系半導体素子層)
6、36、55、76 活性層(窒化物系半導体素子層)
7、37、56、77 n型クラッド層(窒化物系半導体素子層)
8、38、57 n型コンタクト層(窒化物系半導体素子層)
10、30、50、70 窒化物系半導体素子層
Claims (6)
- 少なくとも1種類の金属と1種類の金属酸化物とを含む導電性基板と、
前記導電性基板に接合された窒化物系半導体素子層とを備えた、窒化物系発光素子。 - 前記導電性基板と前記窒化物系半導体素子層とは、電極および導電性材料の少なくとも1つを介して接合されている、請求項1に記載の窒化物系発光素子。
- 前記金属は、銅を含み、
前記金属酸化物は、酸化銅を含む、請求項1または2に記載の窒化物系発光素子。 - 前記導電性基板は、100W/m・K以上の熱伝導率を有する、請求項1〜3のいずれか1項に記載の窒化物系発光素子。
- 前記導電性基板は、120GPa以下のヤング率を有する、請求項1〜4のいずれか1項に記載の窒化物系発光素子。
- 前記導電性基板は、18×10−6/K以下の線膨張係数を有する、請求項1〜5のいずれか1項に記載の窒化物系発光素子。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004030048A JP2005223165A (ja) | 2004-02-06 | 2004-02-06 | 窒化物系発光素子 |
EP05250451A EP1562237A3 (en) | 2004-02-06 | 2005-01-28 | Nitride-based semiconductor light emitting device and method of manufacturing the same |
US11/047,580 US7592630B2 (en) | 2004-02-06 | 2005-02-02 | Nitride-based light-emitting device and method of manufacturing the same |
CNB2005100073569A CN100524852C (zh) | 2004-02-06 | 2005-02-04 | 氮化物系发光元件及其制造方法 |
CNA2009101424804A CN101582481A (zh) | 2004-02-06 | 2005-02-04 | 氮化物系发光元件及其制造方法 |
US11/907,649 US7488613B2 (en) | 2004-02-06 | 2007-10-16 | Nitride-based light-emitting device and method of manufacturing the same |
US12/495,122 US7892874B2 (en) | 2004-02-06 | 2009-06-30 | Nitride-based light-emitting device and method of manufacturing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004030048A JP2005223165A (ja) | 2004-02-06 | 2004-02-06 | 窒化物系発光素子 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2005223165A true JP2005223165A (ja) | 2005-08-18 |
Family
ID=34675540
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004030048A Pending JP2005223165A (ja) | 2004-02-06 | 2004-02-06 | 窒化物系発光素子 |
Country Status (4)
Country | Link |
---|---|
US (3) | US7592630B2 (ja) |
EP (1) | EP1562237A3 (ja) |
JP (1) | JP2005223165A (ja) |
CN (2) | CN101582481A (ja) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007081332A (ja) * | 2005-09-16 | 2007-03-29 | Showa Denko Kk | 窒化物系半導体発光素子及びその製造方法 |
JP2007081313A (ja) * | 2005-09-16 | 2007-03-29 | Showa Denko Kk | 窒化物系半導体発光素子及びその製造方法 |
JP2007081400A (ja) * | 2005-09-09 | 2007-03-29 | Samsung Electro Mech Co Ltd | 窒化物系半導体発光素子 |
JP2007299935A (ja) * | 2006-04-28 | 2007-11-15 | Showa Denko Kk | 窒化物系半導体発光素子の製造方法、窒化物系半導体発光素子及びランプ |
WO2008018482A1 (fr) * | 2006-08-11 | 2008-02-14 | Sanyo Electric Co., Ltd. | Élément semi-conducteur et son procédé de fabrication |
WO2009004980A1 (ja) * | 2007-06-29 | 2009-01-08 | Showa Denko K.K. | 発光ダイオードの製造方法 |
JP2011233936A (ja) * | 2006-02-23 | 2011-11-17 | Azzurro Semiconductors Ag | ニトリド半導体素子ならびにその製法 |
US9343641B2 (en) | 2011-08-02 | 2016-05-17 | Manutius Ip, Inc. | Non-reactive barrier metal for eutectic bonding process |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100372137C (zh) * | 2005-05-27 | 2008-02-27 | 晶能光电(江西)有限公司 | 具有上下电极结构的铟镓铝氮发光器件及其制造方法 |
KR100649763B1 (ko) * | 2005-12-09 | 2006-11-27 | 삼성전기주식회사 | 수직구조 질화물 발광소자의 제조방법 |
KR100755658B1 (ko) * | 2006-03-09 | 2007-09-04 | 삼성전기주식회사 | 발광다이오드 패키지 |
GB2436398B (en) * | 2006-03-23 | 2011-08-24 | Univ Bath | Growth method using nanostructure compliant layers and HVPE for producing high quality compound semiconductor materials |
JP5126875B2 (ja) * | 2006-08-11 | 2013-01-23 | シャープ株式会社 | 窒化物半導体発光素子の製造方法 |
TWI318013B (en) | 2006-09-05 | 2009-12-01 | Epistar Corp | A light emitting device and the manufacture method thereof |
GB0701069D0 (en) * | 2007-01-19 | 2007-02-28 | Univ Bath | Nanostructure template and production of semiconductors using the template |
TW200840082A (en) * | 2007-03-22 | 2008-10-01 | Univ Nat Sun Yat Sen | LED structure made of ZnO |
TWI411124B (zh) * | 2007-07-10 | 2013-10-01 | Delta Electronics Inc | 發光二極體裝置及其製造方法 |
EP2017898A1 (en) * | 2007-07-17 | 2009-01-21 | Vishay Israel Ltd. | Semiconductor light-emitting device and method for the manufacture thereof |
US8652947B2 (en) * | 2007-09-26 | 2014-02-18 | Wang Nang Wang | Non-polar III-V nitride semiconductor and growth method |
US7928448B2 (en) | 2007-12-04 | 2011-04-19 | Philips Lumileds Lighting Company, Llc | III-nitride light emitting device including porous semiconductor layer |
US7791101B2 (en) * | 2008-03-28 | 2010-09-07 | Cree, Inc. | Indium gallium nitride-based ohmic contact layers for gallium nitride-based devices |
WO2009129353A1 (en) * | 2008-04-15 | 2009-10-22 | Purdue Research Foundation | Metallized silicon substrate for indium gallium nitride light-emitting diode |
JP2010258296A (ja) * | 2009-04-27 | 2010-11-11 | Renesas Electronics Corp | 窒化物系半導体光素子およびその製造方法 |
TW201112440A (en) * | 2009-09-29 | 2011-04-01 | Ubilux Optoelectronics Corp | Manufacturing method of vertical light emitting diode |
US8471282B2 (en) | 2010-06-07 | 2013-06-25 | Koninklijke Philips Electronics N.V. | Passivation for a semiconductor light emitting device |
KR101735670B1 (ko) * | 2010-07-13 | 2017-05-15 | 엘지이노텍 주식회사 | 발광 소자 |
KR20120045879A (ko) * | 2010-11-01 | 2012-05-09 | 삼성엘이디 주식회사 | 반도체 발광소자 제조방법 |
TWI429110B (zh) * | 2011-01-07 | 2014-03-01 | Nat Univ Tsing Hua | 具有自我複製式光子晶體之發光元件與其製造方法 |
KR101781436B1 (ko) * | 2011-07-22 | 2017-09-25 | 삼성전자주식회사 | 질화물계 반도체 발광소자 |
JP6066253B2 (ja) * | 2011-09-26 | 2017-01-25 | 東芝ライテック株式会社 | 発光装置の製造方法 |
US9574135B2 (en) * | 2013-08-22 | 2017-02-21 | Nanoco Technologies Ltd. | Gas phase enhancement of emission color quality in solid state LEDs |
EP3103143B1 (en) * | 2014-02-06 | 2023-09-06 | Lumileds LLC | Light emitting diode with structured substrate |
CN104600162B (zh) * | 2014-03-24 | 2016-01-27 | 上海卓霖半导体科技有限公司 | 基于lao衬底的非极性蓝光led外延片的制备方法 |
JP6210152B2 (ja) * | 2014-04-10 | 2017-10-11 | 富士電機株式会社 | 半導体基板の処理方法及び該処理方法を用いる半導体装置の製造方法 |
KR20170008417A (ko) * | 2015-07-14 | 2017-01-24 | 에스프린팅솔루션 주식회사 | 자동장착장치 및 이를 포함하는 화상형성장치 |
JP7041338B2 (ja) * | 2017-09-01 | 2022-03-24 | 日亜化学工業株式会社 | 発光装置の製造方法 |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US14630A (en) * | 1856-04-08 | Improvement in machines for sowing seed broadcast | ||
JP3259811B2 (ja) * | 1995-06-15 | 2002-02-25 | 日亜化学工業株式会社 | 窒化物半導体素子の製造方法及び窒化物半導体素子 |
JPH10154780A (ja) * | 1996-09-26 | 1998-06-09 | Toshiba Corp | 放熱部品とその製造方法、およびそれを用いた半導体装置 |
JP3914615B2 (ja) | 1997-08-19 | 2007-05-16 | 住友電気工業株式会社 | 半導体発光素子及びその製造方法 |
TW413956B (en) * | 1998-07-28 | 2000-12-01 | Sumitomo Electric Industries | Fluorescent substrate LED |
US6319742B1 (en) | 1998-07-29 | 2001-11-20 | Sanyo Electric Co., Ltd. | Method of forming nitride based semiconductor layer |
JP3525061B2 (ja) | 1998-09-25 | 2004-05-10 | 株式会社東芝 | 半導体発光素子の製造方法 |
RU2216602C2 (ru) * | 1998-12-07 | 2003-11-20 | Хитачи, Лтд. | Композиционный материал |
US6331450B1 (en) * | 1998-12-22 | 2001-12-18 | Toyoda Gosei Co., Ltd. | Method of manufacturing semiconductor device using group III nitride compound |
JP3469484B2 (ja) * | 1998-12-24 | 2003-11-25 | 株式会社東芝 | 半導体発光素子およびその製造方法 |
JP3451979B2 (ja) | 1999-04-28 | 2003-09-29 | 株式会社日立製作所 | 半導体装置 |
US6492661B1 (en) * | 1999-11-04 | 2002-12-10 | Fen-Ren Chien | Light emitting semiconductor device having reflection layer structure |
JP3893874B2 (ja) | 1999-12-21 | 2007-03-14 | 日亜化学工業株式会社 | 窒化物半導体発光素子の製造方法 |
JP2003532298A (ja) | 2000-04-26 | 2003-10-28 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | 発光半導体素子 |
US6841808B2 (en) * | 2000-06-23 | 2005-01-11 | Toyoda Gosei Co., Ltd. | Group III nitride compound semiconductor device and method for producing the same |
JP4024994B2 (ja) | 2000-06-30 | 2007-12-19 | 株式会社東芝 | 半導体発光素子 |
US6562648B1 (en) * | 2000-08-23 | 2003-05-13 | Xerox Corporation | Structure and method for separation and transfer of semiconductor thin films onto dissimilar substrate materials |
US20020188542A1 (en) | 2001-04-13 | 2002-12-12 | Yong Zhang | Compensation-data processing |
CN1323441C (zh) * | 2001-10-12 | 2007-06-27 | 日亚化学工业株式会社 | 发光装置及其制造方法 |
JP3856750B2 (ja) * | 2001-11-13 | 2006-12-13 | 松下電器産業株式会社 | 半導体装置及びその製造方法 |
CN1202578C (zh) | 2001-12-07 | 2005-05-18 | 洲磊科技股份有限公司 | 形成具有金属基板的半导体元件 |
KR20030067964A (ko) | 2002-02-09 | 2003-08-19 | 엘지전자 주식회사 | 질화갈륨 기판 제조 방법 |
US20030189215A1 (en) | 2002-04-09 | 2003-10-09 | Jong-Lam Lee | Method of fabricating vertical structure leds |
JP4107868B2 (ja) | 2002-04-16 | 2008-06-25 | シャープ株式会社 | 窒化物系半導体発光素子の製造方法 |
CN1241253C (zh) | 2002-06-24 | 2006-02-08 | 丰田合成株式会社 | 半导体元件的制造方法 |
KR101030068B1 (ko) * | 2002-07-08 | 2011-04-19 | 니치아 카가쿠 고교 가부시키가이샤 | 질화물 반도체 소자의 제조방법 및 질화물 반도체 소자 |
-
2004
- 2004-02-06 JP JP2004030048A patent/JP2005223165A/ja active Pending
-
2005
- 2005-01-28 EP EP05250451A patent/EP1562237A3/en not_active Withdrawn
- 2005-02-02 US US11/047,580 patent/US7592630B2/en not_active Expired - Fee Related
- 2005-02-04 CN CNA2009101424804A patent/CN101582481A/zh active Pending
- 2005-02-04 CN CNB2005100073569A patent/CN100524852C/zh not_active Expired - Fee Related
-
2007
- 2007-10-16 US US11/907,649 patent/US7488613B2/en not_active Expired - Fee Related
-
2009
- 2009-06-30 US US12/495,122 patent/US7892874B2/en not_active Expired - Fee Related
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7868344B2 (en) | 2005-09-09 | 2011-01-11 | Samsung Led Co., Ltd. | Nitride semiconductor light emitting device including electrodes of a multilayer structure |
JP2007081400A (ja) * | 2005-09-09 | 2007-03-29 | Samsung Electro Mech Co Ltd | 窒化物系半導体発光素子 |
JP2007081313A (ja) * | 2005-09-16 | 2007-03-29 | Showa Denko Kk | 窒化物系半導体発光素子及びその製造方法 |
JP2007081332A (ja) * | 2005-09-16 | 2007-03-29 | Showa Denko Kk | 窒化物系半導体発光素子及びその製造方法 |
JP2015216378A (ja) * | 2006-02-23 | 2015-12-03 | アズッロ セミコンダクターズ アクチエンゲゼルシャフトAzzurro Semiconductors Ag | 窒化物半導体素子ならびにその製法 |
JP2013219391A (ja) * | 2006-02-23 | 2013-10-24 | Azzurro Semiconductors Ag | 窒化物半導体素子ならびにその製法 |
JP2011233936A (ja) * | 2006-02-23 | 2011-11-17 | Azzurro Semiconductors Ag | ニトリド半導体素子ならびにその製法 |
JP2007299935A (ja) * | 2006-04-28 | 2007-11-15 | Showa Denko Kk | 窒化物系半導体発光素子の製造方法、窒化物系半導体発光素子及びランプ |
CN101501947B (zh) * | 2006-08-11 | 2011-04-20 | 三洋电机株式会社 | 半导体元件和其制造方法 |
JP2008066717A (ja) * | 2006-08-11 | 2008-03-21 | Sanyo Electric Co Ltd | 半導体素子およびその製造方法 |
WO2008018482A1 (fr) * | 2006-08-11 | 2008-02-14 | Sanyo Electric Co., Ltd. | Élément semi-conducteur et son procédé de fabrication |
WO2009004980A1 (ja) * | 2007-06-29 | 2009-01-08 | Showa Denko K.K. | 発光ダイオードの製造方法 |
US8097478B2 (en) | 2007-06-29 | 2012-01-17 | Showa Denko K.K. | Method for producing light-emitting diode |
JP5278317B2 (ja) * | 2007-06-29 | 2013-09-04 | 豊田合成株式会社 | 発光ダイオードの製造方法 |
US9343641B2 (en) | 2011-08-02 | 2016-05-17 | Manutius Ip, Inc. | Non-reactive barrier metal for eutectic bonding process |
Also Published As
Publication number | Publication date |
---|---|
US20090263925A1 (en) | 2009-10-22 |
CN100524852C (zh) | 2009-08-05 |
US7892874B2 (en) | 2011-02-22 |
CN101582481A (zh) | 2009-11-18 |
EP1562237A3 (en) | 2008-01-16 |
CN1652364A (zh) | 2005-08-10 |
US20080064130A1 (en) | 2008-03-13 |
EP1562237A2 (en) | 2005-08-10 |
US7488613B2 (en) | 2009-02-10 |
US7592630B2 (en) | 2009-09-22 |
US20050173725A1 (en) | 2005-08-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2005223165A (ja) | 窒化物系発光素子 | |
JP4368225B2 (ja) | 窒化物系半導体発光素子の製造方法 | |
JP4868709B2 (ja) | 発光素子 | |
TWI426674B (zh) | 光電組件及光電組件之製造方法 | |
JP4592388B2 (ja) | Iii−v族化合物半導体発光素子およびその製造方法 | |
JP4624131B2 (ja) | 窒化物系半導体素子の製造方法 | |
JP2007067418A (ja) | 二重ヘテロ構造の発光領域を有するiii族窒化物発光デバイス | |
JP2006237339A (ja) | 窒化物系半導体素子の作製方法 | |
US9006013B2 (en) | Method for manufacturing semiconductor light emitting device and semiconductor light emitting device wafer | |
JP2013239471A (ja) | 発光ダイオード素子の製造方法 | |
JP4731180B2 (ja) | 窒化物系半導体素子の製造方法 | |
JP2007221051A (ja) | 窒化物系半導体素子の製造方法 | |
JP2010263251A5 (ja) | ||
JP2010263251A (ja) | 発光素子およびその製造方法 | |
JP4279631B2 (ja) | 窒化物系半導体素子の製造方法 | |
JP2007173369A (ja) | 半導体発光素子及び半導体発光素子の製造方法 | |
JP5646545B2 (ja) | 半導体発光素子及びその製造方法 | |
JP5350070B2 (ja) | 発光素子 | |
JP2009060142A (ja) | 窒化物系半導体発光素子 | |
JP4960777B2 (ja) | 端面発光型半導体レーザチップ | |
KR20090115902A (ko) | 수직구조 그룹 3족 질화물계 반도체 발광다이오드 소자 및제조방법 | |
JP2008294421A (ja) | 半導体レーザ素子およびその製造方法 | |
WO2016002800A1 (ja) | 発光素子 | |
JP6010169B2 (ja) | 半導体発光素子 | |
JP5951732B2 (ja) | 半導体発光素子 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20051208 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20080930 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20080930 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20081128 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090303 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090428 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20090728 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20091028 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20091104 |
|
A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20100122 |
|
RD12 | Notification of acceptance of power of sub attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7432 Effective date: 20100806 |