JP2005205528A - 両頭平面研削装置 - Google Patents
両頭平面研削装置 Download PDFInfo
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- JP2005205528A JP2005205528A JP2004013908A JP2004013908A JP2005205528A JP 2005205528 A JP2005205528 A JP 2005205528A JP 2004013908 A JP2004013908 A JP 2004013908A JP 2004013908 A JP2004013908 A JP 2004013908A JP 2005205528 A JP2005205528 A JP 2005205528A
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- grinding
- workpiece
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- support
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- 230000002093 peripheral effect Effects 0.000 claims abstract description 72
- 239000012530 fluid Substances 0.000 claims abstract description 50
- 210000003462 vein Anatomy 0.000 claims description 11
- 238000001514 detection method Methods 0.000 description 12
- 238000005259 measurement Methods 0.000 description 9
- 230000007246 mechanism Effects 0.000 description 8
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 239000004575 stone Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/10—Single-purpose machines or devices
- B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
- B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
Abstract
【解決手段】 ワークを研削砥石よりも外側で挟み込んで流体の圧力により非接触支持する一対のサポートパッド43aに、その外縁側から中心に向かって研削砥石に対応する切り欠き部44が形成されると共に、その非接触支持面45には、流体供給孔62を備えた複数のポケット部51と、それらポケット部51の土手を形成するメッシュ部52とが設けられ、メッシュ部52は、非接触支持面45の外周に沿う周縁部53と、周縁部53の内側を分割すると共に内外接続部52aで周縁部53と接続される内脈部54とで構成され、周縁部53のうち、切り欠き部44に沿う部分には、少なくともワークWの中心位置A′の近傍を除く部分に内外接続部52aを設けないようにしたものである。
【選択図】 図8
Description
3 研削砥石
43a,43b サポートパッド(非接触支持手段)
44 砥石用切り欠き部(切り欠き部)
45 非接触支持面
51,51a〜51f ポケット部
52 メッシュ部
52a 内外接続部
53 周縁部
53a 内側周縁部
53b 外側周縁部
54 内脈部
62 流体供給部
74 ワーク保持キャリア(ワーク回転支持手段)
W ワーク
Claims (3)
- 研削面が互いに対向するように回転可能に支持される一対の研削砥石と、薄板状のワークを、その両面の被研削面の少なくとも一部が前記研削面間の研削位置に配置された状態で、前記研削砥石の回転軸に平行な回転軸廻りに回転可能に支持するワーク回転支持手段と、前記ワークの被研削面における前記研削位置よりも外側の領域の略全面を両側から挟み込むように配置され且つ流体の圧力により前記ワークを非接触支持する一対の非接触支持手段とを備え、前記非接触支持手段により前記ワークを支持した状態で前記ワークと前記研削砥石とを回転させることにより前記ワーク両面の被研削面を研削するように構成された両頭平面研削装置において、前記非接触支持手段には、その略円形の外縁側から少なくとも前記ワークの中心位置を超えて前記研削砥石に対応する略円弧状の切り欠き部が形成されると共に、前記ワークに対向する非接触支持面には、凹入状に形成され且つその内壁に前記流体を吐出する1又は複数の流体供給孔を備えた複数のポケット部と、それらポケット部の周囲の土手を形成する網目状のメッシュ部とが設けられ、前記メッシュ部は、前記非接触支持面の外周に沿って配置される周縁部と、その周縁部の内側の領域を複数に分割するように配置され且つ複数の内外接続部において前記周縁部と接続される内脈部とで構成され、前記周縁部のうち、前記切り欠き部に沿う部分には、少なくとも前記ワークの中心位置の近傍を除く部分に前記内外接続部が設けられていないことを特徴とする両頭平面研削装置。
- 前記周縁部は、前記切り欠き部に沿って設けられる内側周縁部と、それ以外の外側周縁部とが、前記切り欠き部の両端部において接続されており、前記切り欠き部に沿って設けられる前記ポケット部内の前記流体供給孔は、前記内外接続部の近傍及び前記内側周縁部と外側周縁部との接続部の近傍に配置されていることを特徴とする請求項1に記載の両頭平面研削装置。
- 前記切り欠き部に沿って設けられる前記ポケット部は、前記研削砥石の周方向に沿って半径方向略等幅に形成されていることを特徴とする請求項1又は2に記載の両頭平面研削装置。
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004013908A JP3993856B2 (ja) | 2004-01-22 | 2004-01-22 | 両頭平面研削装置 |
KR1020067003071A KR101117431B1 (ko) | 2004-01-22 | 2004-09-16 | 양두 평면 연삭 장치 |
PCT/JP2004/013526 WO2005070620A1 (ja) | 2004-01-22 | 2004-09-16 | 両頭平面研削装置 |
CNB2004800406946A CN100537136C (zh) | 2004-01-22 | 2004-09-16 | 双头平面磨削装置 |
DE602004020385T DE602004020385D1 (de) | 2004-01-22 | 2004-09-16 | Doppelenden-flächenschleifmaschine |
AT04773184T ATE427185T1 (de) | 2004-01-22 | 2004-09-16 | Doppelenden-flachenschleifmaschine |
US10/587,227 US7347770B2 (en) | 2004-01-22 | 2004-09-16 | Two-sided surface grinding apparatus |
EP04773184A EP1707313B1 (en) | 2004-01-22 | 2004-09-16 | Double-end surface grinding machine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004013908A JP3993856B2 (ja) | 2004-01-22 | 2004-01-22 | 両頭平面研削装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005205528A true JP2005205528A (ja) | 2005-08-04 |
JP3993856B2 JP3993856B2 (ja) | 2007-10-17 |
Family
ID=34805401
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004013908A Expired - Fee Related JP3993856B2 (ja) | 2004-01-22 | 2004-01-22 | 両頭平面研削装置 |
Country Status (8)
Country | Link |
---|---|
US (1) | US7347770B2 (ja) |
EP (1) | EP1707313B1 (ja) |
JP (1) | JP3993856B2 (ja) |
KR (1) | KR101117431B1 (ja) |
CN (1) | CN100537136C (ja) |
AT (1) | ATE427185T1 (ja) |
DE (1) | DE602004020385D1 (ja) |
WO (1) | WO2005070620A1 (ja) |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007158261A (ja) * | 2005-12-08 | 2007-06-21 | Shin Etsu Handotai Co Ltd | 半導体ウェーハの両頭研削装置、静圧パッドおよびこれを用いた両頭研削方法 |
JP2009525621A (ja) * | 2006-01-30 | 2009-07-09 | エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッド | 加工対象物のナノトポロジを評価するためのウェハ両面グラインダ及び方法 |
JP2009233846A (ja) * | 2008-03-26 | 2009-10-15 | Kobe Steel Ltd | 湿式研削装置およびそのための研削砥石セグメント |
JP2010064214A (ja) * | 2008-09-12 | 2010-03-25 | Koyo Mach Ind Co Ltd | 両頭平面研削盤及びワークの両面研削方法 |
JP2010131745A (ja) * | 2008-10-31 | 2010-06-17 | Sumco Techxiv株式会社 | ウェハ用両頭研削装置および両頭研削方法 |
CN102267075A (zh) * | 2011-08-26 | 2011-12-07 | 湖南宇环同心数控机床有限公司 | 一种高效率高精度双端面磨削加工方法 |
EP2543475A2 (en) | 2011-07-08 | 2013-01-09 | Koyo Machine Industries Co., Ltd. | Method for grinding thin sheet-like workpiece and double-end surface grinder |
JP2013524484A (ja) * | 2010-03-26 | 2013-06-17 | エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッド | 同時両面ウエハ研削盤における静水圧パッド圧力調節 |
JP2015058482A (ja) * | 2013-09-17 | 2015-03-30 | 光洋機械工業株式会社 | 両頭平面研削盤用の静圧パッド及びワークの両頭平面研削方法 |
JP2016132084A (ja) * | 2015-01-22 | 2016-07-25 | 光洋機械工業株式会社 | 両頭平面研削装置 |
CN106217177A (zh) * | 2016-08-25 | 2016-12-14 | 周玉梅 | 一种模具镶嵌块打磨装置 |
JP2018051644A (ja) * | 2016-09-27 | 2018-04-05 | 旭精機工業株式会社 | 研削装置 |
CN114454006A (zh) * | 2022-04-13 | 2022-05-10 | 山东信息职业技术学院 | 一种人工智能抛磨装置 |
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JP5099111B2 (ja) * | 2009-12-24 | 2012-12-12 | 信越半導体株式会社 | 両面研磨装置 |
JP5957277B2 (ja) * | 2012-04-28 | 2016-07-27 | 光洋機械工業株式会社 | 工作物の外周r面研削用治具および外周r面研削装置 |
JP6285375B2 (ja) * | 2015-02-17 | 2018-02-28 | 光洋機械工業株式会社 | 両頭平面研削装置 |
JP6383700B2 (ja) * | 2015-04-07 | 2018-08-29 | 光洋機械工業株式会社 | 薄板状ワークの製造方法及び両頭平面研削装置 |
CN112059854A (zh) * | 2020-09-11 | 2020-12-11 | 东台市强圣精密铸造有限公司 | 一种用于铸锻件加工检测的手持式折叠打磨机 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
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JP3138205B2 (ja) | 1996-03-27 | 2001-02-26 | 株式会社不二越 | 高脆性材の両面研削装置 |
MY121670A (en) * | 1996-09-09 | 2006-02-28 | Koyo Machine Ind Co Ltd | Double side grinding apparatus for flat disklike work |
JPH1177496A (ja) | 1997-09-03 | 1999-03-23 | Sumitomo Heavy Ind Ltd | 薄型ワーク駆動装置及び薄型ワークが適用された研削装置 |
JPH11114786A (ja) * | 1997-10-08 | 1999-04-27 | Sumitomo Heavy Ind Ltd | 両頭研削装置の薄型ワーク支持方法及び支持装置 |
JP3951496B2 (ja) | 1999-03-30 | 2007-08-01 | 光洋機械工業株式会社 | 薄板円板状ワークの両面研削装置 |
DE60036851T2 (de) * | 1999-05-07 | 2008-08-07 | Shin-Etsu Handotai Co., Ltd. | Entsprechende verfahren und vorrichtungen zum schleifen und läppen gleichzeitig von doppelseitigen oberflächen |
JP2001062718A (ja) * | 1999-08-20 | 2001-03-13 | Super Silicon Kenkyusho:Kk | 両頭研削装置及び砥石位置修正方法 |
WO2001021356A1 (fr) * | 1999-09-24 | 2001-03-29 | Shin-Etsu Handotai Co., Ltd. | Procede et dispositif de meulage des deux faces d'un disque fin |
JP2001170862A (ja) | 1999-12-17 | 2001-06-26 | Sumitomo Heavy Ind Ltd | ワーク保持装置 |
JP2003124167A (ja) | 2001-10-10 | 2003-04-25 | Sumitomo Heavy Ind Ltd | ウエハ支持部材及びこれを用いる両頭研削装置 |
US7150674B2 (en) * | 2002-10-09 | 2006-12-19 | Koyo Machine Industries Co., Ltd. | Both-side grinding method and both-side grinding machine for thin disc work |
-
2004
- 2004-01-22 JP JP2004013908A patent/JP3993856B2/ja not_active Expired - Fee Related
- 2004-09-16 EP EP04773184A patent/EP1707313B1/en active Active
- 2004-09-16 WO PCT/JP2004/013526 patent/WO2005070620A1/ja active Application Filing
- 2004-09-16 KR KR1020067003071A patent/KR101117431B1/ko active IP Right Grant
- 2004-09-16 AT AT04773184T patent/ATE427185T1/de not_active IP Right Cessation
- 2004-09-16 DE DE602004020385T patent/DE602004020385D1/de active Active
- 2004-09-16 CN CNB2004800406946A patent/CN100537136C/zh active Active
- 2004-09-16 US US10/587,227 patent/US7347770B2/en active Active
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EP1959483A1 (en) * | 2005-12-08 | 2008-08-20 | Shin-Etsu Handotai Co., Ltd. | Double side grinding machine for semiconductor wafer, static pressure pad, and double side grinding method using such static pressure pad |
JP2007158261A (ja) * | 2005-12-08 | 2007-06-21 | Shin Etsu Handotai Co Ltd | 半導体ウェーハの両頭研削装置、静圧パッドおよびこれを用いた両頭研削方法 |
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JP2009525621A (ja) * | 2006-01-30 | 2009-07-09 | エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッド | 加工対象物のナノトポロジを評価するためのウェハ両面グラインダ及び方法 |
JP2009233846A (ja) * | 2008-03-26 | 2009-10-15 | Kobe Steel Ltd | 湿式研削装置およびそのための研削砥石セグメント |
JP2010064214A (ja) * | 2008-09-12 | 2010-03-25 | Koyo Mach Ind Co Ltd | 両頭平面研削盤及びワークの両面研削方法 |
JP2010131745A (ja) * | 2008-10-31 | 2010-06-17 | Sumco Techxiv株式会社 | ウェハ用両頭研削装置および両頭研削方法 |
JP2013524484A (ja) * | 2010-03-26 | 2013-06-17 | エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッド | 同時両面ウエハ研削盤における静水圧パッド圧力調節 |
EP2543475A2 (en) | 2011-07-08 | 2013-01-09 | Koyo Machine Industries Co., Ltd. | Method for grinding thin sheet-like workpiece and double-end surface grinder |
KR20130006303A (ko) * | 2011-07-08 | 2013-01-16 | 고요 기카이 고교 가부시키가이샤 | 박판형 워크의 연삭 방법 및 양두 평면 연삭기 |
JP2013018065A (ja) * | 2011-07-08 | 2013-01-31 | Koyo Mach Ind Co Ltd | 薄板状ワークの研削方法及び両頭平面研削盤 |
CN102267075A (zh) * | 2011-08-26 | 2011-12-07 | 湖南宇环同心数控机床有限公司 | 一种高效率高精度双端面磨削加工方法 |
JP2015058482A (ja) * | 2013-09-17 | 2015-03-30 | 光洋機械工業株式会社 | 両頭平面研削盤用の静圧パッド及びワークの両頭平面研削方法 |
JP2016132084A (ja) * | 2015-01-22 | 2016-07-25 | 光洋機械工業株式会社 | 両頭平面研削装置 |
CN106217177A (zh) * | 2016-08-25 | 2016-12-14 | 周玉梅 | 一种模具镶嵌块打磨装置 |
JP2018051644A (ja) * | 2016-09-27 | 2018-04-05 | 旭精機工業株式会社 | 研削装置 |
CN114454006A (zh) * | 2022-04-13 | 2022-05-10 | 山东信息职业技术学院 | 一种人工智能抛磨装置 |
Also Published As
Publication number | Publication date |
---|---|
ATE427185T1 (de) | 2009-04-15 |
CN1905990A (zh) | 2007-01-31 |
CN100537136C (zh) | 2009-09-09 |
KR20060126897A (ko) | 2006-12-11 |
US20070161334A1 (en) | 2007-07-12 |
JP3993856B2 (ja) | 2007-10-17 |
KR101117431B1 (ko) | 2012-02-29 |
DE602004020385D1 (de) | 2009-05-14 |
US7347770B2 (en) | 2008-03-25 |
EP1707313A4 (en) | 2007-01-24 |
EP1707313A1 (en) | 2006-10-04 |
WO2005070620A1 (ja) | 2005-08-04 |
EP1707313B1 (en) | 2009-04-01 |
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