JP2005142319A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法 Download PDF

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Publication number
JP2005142319A
JP2005142319A JP2003376639A JP2003376639A JP2005142319A JP 2005142319 A JP2005142319 A JP 2005142319A JP 2003376639 A JP2003376639 A JP 2003376639A JP 2003376639 A JP2003376639 A JP 2003376639A JP 2005142319 A JP2005142319 A JP 2005142319A
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JP
Japan
Prior art keywords
silicon
film
trench
silicon oxide
oxide film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2003376639A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005142319A5 (https=
Inventor
Mikio Tsujiuchi
幹夫 辻内
Toshiaki Iwamatsu
俊明 岩松
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Technology Corp
Original Assignee
Renesas Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Technology Corp filed Critical Renesas Technology Corp
Priority to JP2003376639A priority Critical patent/JP2005142319A/ja
Priority to KR1020040082084A priority patent/KR100654871B1/ko
Priority to TW093132342A priority patent/TWI250607B/zh
Priority to US10/978,796 priority patent/US20050101070A1/en
Priority to CNB2004100905397A priority patent/CN1311539C/zh
Publication of JP2005142319A publication Critical patent/JP2005142319A/ja
Publication of JP2005142319A5 publication Critical patent/JP2005142319A5/ja
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/01—Manufacture or treatment
    • H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
    • H10D30/0321—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] comprising silicon, e.g. amorphous silicon or polysilicon
    • H10D30/0323—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] comprising silicon, e.g. amorphous silicon or polysilicon comprising monocrystalline silicon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P36/00—Gettering within semiconductor bodies
    • H10P36/03—Gettering within semiconductor bodies within silicon bodies
    • H10P36/07—Gettering within semiconductor bodies within silicon bodies of silicon-on-insulator structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/19—Preparing inhomogeneous wafers
    • H10P90/1904—Preparing vertically inhomogeneous wafers
    • H10P90/1906—Preparing SOI wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/01—Manufacture or treatment
    • H10W10/011—Manufacture or treatment of isolation regions comprising dielectric materials
    • H10W10/014—Manufacture or treatment of isolation regions comprising dielectric materials using trench refilling with dielectric materials, e.g. shallow trench isolations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/01—Manufacture or treatment
    • H10W10/061—Manufacture or treatment using SOI processes together with lateral isolation, e.g. combinations of SOI and shallow trench isolations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/10—Isolation regions comprising dielectric materials
    • H10W10/17—Isolation regions comprising dielectric materials formed using trench refilling with dielectric materials, e.g. shallow trench isolations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/10—Isolation regions comprising dielectric materials
    • H10W10/181—Semiconductor-on-insulator [SOI] isolation regions, e.g. buried oxide regions of SOI wafers

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  • Element Separation (AREA)
  • Semiconductor Memories (AREA)
JP2003376639A 2003-11-06 2003-11-06 半導体装置の製造方法 Withdrawn JP2005142319A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2003376639A JP2005142319A (ja) 2003-11-06 2003-11-06 半導体装置の製造方法
KR1020040082084A KR100654871B1 (ko) 2003-11-06 2004-10-14 반도체 장치의 제조 방법
TW093132342A TWI250607B (en) 2003-11-06 2004-10-26 Manufacturing method of semiconductor device
US10/978,796 US20050101070A1 (en) 2003-11-06 2004-11-02 Method of manufacturing semiconductor device
CNB2004100905397A CN1311539C (zh) 2003-11-06 2004-11-05 半导体装置的制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003376639A JP2005142319A (ja) 2003-11-06 2003-11-06 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2005142319A true JP2005142319A (ja) 2005-06-02
JP2005142319A5 JP2005142319A5 (https=) 2006-12-14

Family

ID=34544369

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003376639A Withdrawn JP2005142319A (ja) 2003-11-06 2003-11-06 半導体装置の製造方法

Country Status (5)

Country Link
US (1) US20050101070A1 (https=)
JP (1) JP2005142319A (https=)
KR (1) KR100654871B1 (https=)
CN (1) CN1311539C (https=)
TW (1) TWI250607B (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150139787A (ko) 2014-06-04 2015-12-14 르네사스 일렉트로닉스 가부시키가이샤 반도체 장치의 제조 방법
JP2016134614A (ja) * 2015-01-22 2016-07-25 ルネサスエレクトロニクス株式会社 半導体装置の製造方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5455530B2 (ja) 2009-09-30 2014-03-26 株式会社トクヤマ ポリシリコン金属汚染防止方法
CN103887223A (zh) * 2014-03-12 2014-06-25 上海华力微电子有限公司 降低炉管工艺金属污染的方法
JP2021129042A (ja) * 2020-02-14 2021-09-02 キオクシア株式会社 半導体装置およびその製造方法
CN113257734B (zh) * 2021-04-30 2023-06-23 北海惠科半导体科技有限公司 半导体器件及其制作方法和芯片

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2955459B2 (ja) * 1993-12-20 1999-10-04 株式会社東芝 半導体装置の製造方法
JPH08340044A (ja) * 1995-06-09 1996-12-24 Rohm Co Ltd 半導体装置及びその製造方法
US5719085A (en) * 1995-09-29 1998-02-17 Intel Corporation Shallow trench isolation technique
JP3296229B2 (ja) * 1997-01-21 2002-06-24 株式会社デンソー 半導体装置の製造方法
US5817566A (en) * 1997-03-03 1998-10-06 Taiwan Semiconductor Manufacturing Company, Ltd. Trench filling method employing oxygen densified gap filling silicon oxide layer formed with low ozone concentration
JPH113936A (ja) * 1997-06-13 1999-01-06 Nec Corp 半導体装置の製造方法
US5783476A (en) * 1997-06-26 1998-07-21 Siemens Aktiengesellschaft Integrated circuit devices including shallow trench isolation
KR100268453B1 (ko) * 1998-03-30 2000-11-01 윤종용 반도체 장치 및 그것의 제조 방법
TW426874B (en) * 1998-10-14 2001-03-21 United Microelectronics Corp Method for cleaning a semiconductor wafer
JP2000164569A (ja) * 1998-11-25 2000-06-16 Nec Corp 半導体装置の製造方法
TW461025B (en) * 2000-06-09 2001-10-21 Nanya Technology Corp Method for rounding corner of shallow trench isolation
US6627484B1 (en) * 2000-11-13 2003-09-30 Advanced Micro Devices, Inc. Method of forming a buried interconnect on a semiconductor on insulator wafer and a device including a buried interconnect
US6879000B2 (en) * 2003-03-08 2005-04-12 Taiwan Semiconductor Manufacturing Co., Ltd. Isolation for SOI chip with multiple silicon film thicknesses
US6864152B1 (en) * 2003-05-20 2005-03-08 Lsi Logic Corporation Fabrication of trenches with multiple depths on the same substrate

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150139787A (ko) 2014-06-04 2015-12-14 르네사스 일렉트로닉스 가부시키가이샤 반도체 장치의 제조 방법
US9947715B2 (en) 2014-06-04 2018-04-17 Renesas Electronics Corporation Manufacturing method of semiconductor device
JP2016134614A (ja) * 2015-01-22 2016-07-25 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US9842871B2 (en) 2015-01-22 2017-12-12 Renesas Electronics Corporation Method of manufacturing semiconductor device

Also Published As

Publication number Publication date
TWI250607B (en) 2006-03-01
US20050101070A1 (en) 2005-05-12
CN1614762A (zh) 2005-05-11
KR100654871B1 (ko) 2006-12-11
KR20050043622A (ko) 2005-05-11
TW200527587A (en) 2005-08-16
CN1311539C (zh) 2007-04-18

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