JP2004526863A5 - - Google Patents

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Publication number
JP2004526863A5
JP2004526863A5 JP2002570787A JP2002570787A JP2004526863A5 JP 2004526863 A5 JP2004526863 A5 JP 2004526863A5 JP 2002570787 A JP2002570787 A JP 2002570787A JP 2002570787 A JP2002570787 A JP 2002570787A JP 2004526863 A5 JP2004526863 A5 JP 2004526863A5
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JP
Japan
Prior art keywords
plate
refractory metal
thickness
workpiece
metal plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002570787A
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English (en)
Japanese (ja)
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JP4327460B2 (ja
JP2004526863A (ja
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Publication date
Application filed filed Critical
Priority claimed from PCT/US2002/005033 external-priority patent/WO2002070765A1/en
Publication of JP2004526863A publication Critical patent/JP2004526863A/ja
Publication of JP2004526863A5 publication Critical patent/JP2004526863A5/ja
Application granted granted Critical
Publication of JP4327460B2 publication Critical patent/JP4327460B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2002570787A 2001-02-20 2002-02-20 均一な集合組織を有する耐火金属板及び該板を製造する方法 Expired - Lifetime JP4327460B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US26998301P 2001-02-20 2001-02-20
PCT/US2002/005033 WO2002070765A1 (en) 2001-02-20 2002-02-20 Refractory metal plates with uniform texture and methods of making the same

Publications (3)

Publication Number Publication Date
JP2004526863A JP2004526863A (ja) 2004-09-02
JP2004526863A5 true JP2004526863A5 (enExample) 2008-07-17
JP4327460B2 JP4327460B2 (ja) 2009-09-09

Family

ID=23029400

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002570787A Expired - Lifetime JP4327460B2 (ja) 2001-02-20 2002-02-20 均一な集合組織を有する耐火金属板及び該板を製造する方法

Country Status (20)

Country Link
US (1) US20020112789A1 (enExample)
EP (1) EP1366203B1 (enExample)
JP (1) JP4327460B2 (enExample)
KR (1) KR100966682B1 (enExample)
CN (2) CN1789476A (enExample)
AT (1) ATE339532T1 (enExample)
AU (1) AU2002257005B2 (enExample)
BR (1) BR0207384A (enExample)
CA (1) CA2438819A1 (enExample)
CZ (1) CZ20032246A3 (enExample)
DE (1) DE60214683T2 (enExample)
ES (1) ES2272707T3 (enExample)
HU (1) HUP0303269A3 (enExample)
IL (1) IL157279A0 (enExample)
MX (1) MXPA03007490A (enExample)
NO (1) NO20033547L (enExample)
NZ (1) NZ527628A (enExample)
PT (1) PT1366203E (enExample)
WO (1) WO2002070765A1 (enExample)
ZA (1) ZA200306399B (enExample)

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WO2004114355A2 (en) * 2003-06-20 2004-12-29 Cabot Corporation Method and design for sputter target attachment to a backing plate
KR100760156B1 (ko) * 2003-11-06 2007-09-18 닛코킨조쿠 가부시키가이샤 탄탈륨 스퍼터링 타겟트
US20070144623A1 (en) * 2004-02-18 2007-06-28 Wickersham Charles E Jr Ultrasonic method for detecting banding in metals
WO2005098073A1 (en) * 2004-03-26 2005-10-20 H.C. Starck Inc. Refractory metal pots
US7666243B2 (en) 2004-10-27 2010-02-23 H.C. Starck Inc. Fine grain niobium sheet via ingot metallurgy
US7998287B2 (en) 2005-02-10 2011-08-16 Cabot Corporation Tantalum sputtering target and method of fabrication
EP1880035B1 (en) 2005-05-05 2021-01-20 Höganäs Germany GmbH Method for coating a substrate surface and coated product
WO2006117145A2 (en) * 2005-05-05 2006-11-09 H.C. Starck Gmbh Coating process for manufacture or reprocessing of sputter targets and x-ray anodes
US20070044873A1 (en) 2005-08-31 2007-03-01 H. C. Starck Inc. Fine grain niobium sheet via ingot metallurgy
DE112007000440B4 (de) * 2006-03-07 2021-01-07 Global Advanced Metals, Usa, Inc. Verfahren zum Erzeugen von verformten Metallartikeln
JP4974362B2 (ja) 2006-04-13 2012-07-11 株式会社アルバック Ｔａスパッタリングターゲットおよびその製造方法
US20080078268A1 (en) * 2006-10-03 2008-04-03 H.C. Starck Inc. Process for preparing metal powders having low oxygen content, powders so-produced and uses thereof
US7776166B2 (en) * 2006-12-05 2010-08-17 Praxair Technology, Inc. Texture and grain size controlled hollow cathode magnetron targets and method of manufacture
US20080145688A1 (en) 2006-12-13 2008-06-19 H.C. Starck Inc. Method of joining tantalum clade steel structures
US8197894B2 (en) 2007-05-04 2012-06-12 H.C. Starck Gmbh Methods of forming sputtering targets
US8250895B2 (en) * 2007-08-06 2012-08-28 H.C. Starck Inc. Methods and apparatus for controlling texture of plates and sheets by tilt rolling
KR101201577B1 (ko) 2007-08-06 2012-11-14 에이치. 씨. 스타아크 아이앤씨 향상된 조직 균일성을 가진 내화 금속판
US8246903B2 (en) 2008-09-09 2012-08-21 H.C. Starck Inc. Dynamic dehydriding of refractory metal powders
US8043655B2 (en) * 2008-10-06 2011-10-25 H.C. Starck, Inc. Low-energy method of manufacturing bulk metallic structures with submicron grain sizes
CN101920436B (zh) * 2010-08-20 2011-10-26 宁夏东方钽业股份有限公司 溅射钽环件用钽条的制备工艺
CN102021523A (zh) * 2010-09-29 2011-04-20 吴江南玻华东工程玻璃有限公司 一种解决镀膜玻璃边缘效应的方法
US9412568B2 (en) 2011-09-29 2016-08-09 H.C. Starck, Inc. Large-area sputtering targets
CN102658346A (zh) * 2012-04-06 2012-09-12 宁夏东方钽业股份有限公司 一种大规格钽靶材的锻造方法
CN102699247B (zh) * 2012-05-18 2014-06-18 宁夏东方钽业股份有限公司 一种超导钽棒的锻造方法
CN103861982B (zh) * 2012-12-18 2016-06-15 宁夏东方钽业股份有限公司 一种铌旋转靶材铸锭的锻造方法
CN104419901B (zh) * 2013-08-27 2017-06-30 宁波江丰电子材料股份有限公司 一种钽靶材的制造方法
WO2015146516A1 (ja) * 2014-03-27 2015-10-01 Jx日鉱日石金属株式会社 タンタルスパッタリングターゲット及びその製造方法
US10023953B2 (en) 2014-04-11 2018-07-17 H.C. Starck Inc. High purity refractory metal powders and their use in sputtering targets which may have random texture
US10961613B2 (en) * 2014-12-22 2021-03-30 Agency For Defense Development Method for controlling microstructure and texture of tantalum
EP3211118B1 (en) * 2015-05-22 2020-09-09 JX Nippon Mining & Metals Corporation Tantalum sputtering target, and production method therefor
JP6293928B2 (ja) 2015-05-22 2018-03-14 Ｊｘ金属株式会社 タンタルスパッタリングターゲット及びその製造方法
JP6553813B2 (ja) * 2017-03-30 2019-07-31 Ｊｘ金属株式会社 タンタルスパッタリングターゲット
US11062889B2 (en) 2017-06-26 2021-07-13 Tosoh Smd, Inc. Method of production of uniform metal plates and sputtering targets made thereby
US20190161850A1 (en) * 2017-11-30 2019-05-30 Tosoh Smd, Inc. Ultra-fine grain size tantalum sputtering targets with improved voltage performance and methods thereby
EP3951004A4 (en) * 2019-03-26 2022-12-14 JX Nippon Mining & Metals Corporation Niobium sputtering target
CN110983218B (zh) * 2019-12-25 2021-09-03 西部超导材料科技股份有限公司 一种组织均匀的小规格纯铌棒材的制备方法
CN112143990B (zh) * 2020-09-04 2022-01-07 中国航发北京航空材料研究院 一种钛合金β相大尺寸单晶的制备方法
CN116288091A (zh) * 2023-03-28 2023-06-23 南昌大学 一种低温制备超细晶粒钽片的退火工艺
TW202540463A (zh) * 2023-12-05 2025-10-16 美商塔沙Ｓｍｄ公司 具有改善的性能及可預測性之鉭濺射靶及其製造方法

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JP2796752B2 (ja) * 1990-04-27 1998-09-10 日本軽金属株式会社 耐食皮膜用Ａｌ―Ｎｉ―Ｓｉ合金製スパッタリングターゲット
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US5590389A (en) * 1994-12-23 1996-12-31 Johnson Matthey Electronics, Inc. Sputtering target with ultra-fine, oriented grains and method of making same
US5850755A (en) * 1995-02-08 1998-12-22 Segal; Vladimir M. Method and apparatus for intensive plastic deformation of flat billets
JPH10235670A (ja) * 1997-02-26 1998-09-08 Tosoh Corp ポリオレフィン樹脂連続気泡発泡体の製造方法
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US6348139B1 (en) * 1998-06-17 2002-02-19 Honeywell International Inc. Tantalum-comprising articles
US6348113B1 (en) * 1998-11-25 2002-02-19 Cabot Corporation High purity tantalum, products containing the same, and methods of making the same
US6464809B2 (en) * 1998-11-30 2002-10-15 Outokumpu Oyj Processes for producing articles with stress-free slit edges
JP3079378B1 (ja) * 1999-02-10 2000-08-21 東京タングステン株式会社 Ｍｏスパッターリングターゲット材及びその製造方法
JP2001020065A (ja) * 1999-07-07 2001-01-23 Hitachi Metals Ltd スパッタリング用ターゲット及びその製造方法ならびに高融点金属粉末材料
US6878250B1 (en) * 1999-12-16 2005-04-12 Honeywell International Inc. Sputtering targets formed from cast materials
US6331233B1 (en) * 2000-02-02 2001-12-18 Honeywell International Inc. Tantalum sputtering target with fine grains and uniform texture and method of manufacture
AU2001296213A1 (en) * 2000-05-22 2001-12-24 Cabot Corporation High purity niobium and products containing the same, and methods of making the same

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