JP2007521140A5 - - Google Patents

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Publication number
JP2007521140A5
JP2007521140A5 JP2006547211A JP2006547211A JP2007521140A5 JP 2007521140 A5 JP2007521140 A5 JP 2007521140A5 JP 2006547211 A JP2006547211 A JP 2006547211A JP 2006547211 A JP2006547211 A JP 2006547211A JP 2007521140 A5 JP2007521140 A5 JP 2007521140A5
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JP
Japan
Prior art keywords
rolling
metal plate
microns
less
grains
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006547211A
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English (en)
Japanese (ja)
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JP2007521140A (ja
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Publication date
Application filed filed Critical
Priority claimed from PCT/US2004/042734 external-priority patent/WO2005064037A2/en
Publication of JP2007521140A publication Critical patent/JP2007521140A/ja
Publication of JP2007521140A5 publication Critical patent/JP2007521140A5/ja
Pending legal-status Critical Current

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JP2006547211A 2003-12-22 2004-12-20 高い完全度のスパッタリングターゲット材料及びそれを大量に製造する方法 Pending JP2007521140A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US53181303P 2003-12-22 2003-12-22
PCT/US2004/042734 WO2005064037A2 (en) 2003-12-22 2004-12-20 High integrity sputtering target material and method for producing bulk quantities of same

Publications (2)

Publication Number Publication Date
JP2007521140A JP2007521140A (ja) 2007-08-02
JP2007521140A5 true JP2007521140A5 (enExample) 2008-02-14

Family

ID=34738707

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006547211A Pending JP2007521140A (ja) 2003-12-22 2004-12-20 高い完全度のスパッタリングターゲット材料及びそれを大量に製造する方法

Country Status (6)

Country Link
US (1) US20050236076A1 (enExample)
EP (1) EP1704266A2 (enExample)
JP (1) JP2007521140A (enExample)
CN (1) CN1985021A (enExample)
TW (1) TW200523375A (enExample)
WO (1) WO2005064037A2 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050252268A1 (en) * 2003-12-22 2005-11-17 Michaluk Christopher A High integrity sputtering target material and method for producing bulk quantities of same
DE112007000440B4 (de) * 2006-03-07 2021-01-07 Global Advanced Metals, Usa, Inc. Verfahren zum Erzeugen von verformten Metallartikeln
CN102091733B (zh) * 2009-12-09 2013-02-13 宁波江丰电子材料有限公司 高纯度铜靶材的制作方法
CN102489951B (zh) * 2011-12-03 2013-11-27 西北有色金属研究院 一种溅射用铌管状靶材的制备方法
CN102873093B (zh) * 2012-10-31 2014-12-03 西安诺博尔稀贵金属材料有限公司 一种大尺寸钽板材的制备方法
CN104419901B (zh) * 2013-08-27 2017-06-30 宁波江丰电子材料股份有限公司 一种钽靶材的制造方法
JP6553813B2 (ja) * 2017-03-30 2019-07-31 Ｊｘ金属株式会社 タンタルスパッタリングターゲット
US11062889B2 (en) 2017-06-26 2021-07-13 Tosoh Smd, Inc. Method of production of uniform metal plates and sputtering targets made thereby
CN107584251B (zh) * 2017-09-08 2019-04-16 西北有色金属研究院 一种钽合金异形件的成形方法
CN110394603B (zh) * 2019-07-29 2023-05-09 福建阿石创新材料股份有限公司 一种金属旋转靶材及其制备方法和应用
CN111440938B (zh) * 2020-04-21 2022-01-28 合肥工业大学 一种轧制纯钽箔的退火强化工艺方法
CN115518981A (zh) * 2022-10-11 2022-12-27 西南铝业（集团）有限责任公司 一种2xxx系铝锂合金薄宽板的轧制工艺

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