JP2007516352A5 - - Google Patents
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- Publication number
- JP2007516352A5 JP2007516352A5 JP2006533580A JP2006533580A JP2007516352A5 JP 2007516352 A5 JP2007516352 A5 JP 2007516352A5 JP 2006533580 A JP2006533580 A JP 2006533580A JP 2006533580 A JP2006533580 A JP 2006533580A JP 2007516352 A5 JP2007516352 A5 JP 2007516352A5
- Authority
- JP
- Japan
- Prior art keywords
- dimension
- slab
- preform
- less
- particle size
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US47698403P | 2003-06-09 | 2003-06-09 | |
| PCT/US2004/017972 WO2004111295A1 (en) | 2003-06-09 | 2004-06-07 | Method of forming sputtering acticles by multidirectional deformation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007516352A JP2007516352A (ja) | 2007-06-21 |
| JP2007516352A5 true JP2007516352A5 (enExample) | 2007-08-02 |
Family
ID=33551657
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006533580A Pending JP2007516352A (ja) | 2003-06-09 | 2004-06-07 | 多方向変形によってスパッタリング物品を形成する方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7228722B2 (enExample) |
| EP (1) | EP1636398A1 (enExample) |
| JP (1) | JP2007516352A (enExample) |
| CN (1) | CN1833048A (enExample) |
| WO (1) | WO2004111295A1 (enExample) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7998287B2 (en) * | 2005-02-10 | 2011-08-16 | Cabot Corporation | Tantalum sputtering target and method of fabrication |
| DE112007000440B4 (de) * | 2006-03-07 | 2021-01-07 | Global Advanced Metals, Usa, Inc. | Verfahren zum Erzeugen von verformten Metallartikeln |
| US20070251819A1 (en) * | 2006-05-01 | 2007-11-01 | Kardokus Janine K | Hollow cathode magnetron sputtering targets and methods of forming hollow cathode magnetron sputtering targets |
| US7776166B2 (en) * | 2006-12-05 | 2010-08-17 | Praxair Technology, Inc. | Texture and grain size controlled hollow cathode magnetron targets and method of manufacture |
| KR100860645B1 (ko) * | 2007-05-04 | 2008-09-26 | 엘지전자 주식회사 | 냉장고 및 냉장고 도어용 강판 및 그 제조방법 |
| US8250895B2 (en) * | 2007-08-06 | 2012-08-28 | H.C. Starck Inc. | Methods and apparatus for controlling texture of plates and sheets by tilt rolling |
| KR101201577B1 (ko) | 2007-08-06 | 2012-11-14 | 에이치. 씨. 스타아크 아이앤씨 | 향상된 조직 균일성을 가진 내화 금속판 |
| US8702919B2 (en) * | 2007-08-13 | 2014-04-22 | Honeywell International Inc. | Target designs and related methods for coupled target assemblies, methods of production and uses thereof |
| KR101626286B1 (ko) * | 2008-11-03 | 2016-06-01 | 토소우 에스엠디, 인크 | 스퍼터 타겟 제조 방법 및 이에 의해 제조된 스퍼터 타겟 |
| US20100180427A1 (en) * | 2009-01-16 | 2010-07-22 | Ford Motor Company | Texturing of thin metal sheets/foils for enhanced formability and manufacturability |
| US20100330389A1 (en) * | 2009-06-25 | 2010-12-30 | Ford Motor Company | Skin pass for cladding thin metal sheets |
| KR101193868B1 (ko) | 2010-07-29 | 2012-10-26 | 현대제철 주식회사 | 테이퍼 슬라브의 조압연 방법 |
| KR20170134365A (ko) | 2015-04-10 | 2017-12-06 | 토소우 에스엠디, 인크 | 탄탈 스퍼터 타겟의 제조 방법 및 그에 의해 제조된 스퍼터 타겟 |
| CN108356193B (zh) * | 2018-05-22 | 2020-06-23 | 通裕重工股份有限公司 | 汽轮发电机转子自由锻成形方法 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4721537A (en) | 1985-10-15 | 1988-01-26 | Rockwell International Corporation | Method of producing a fine grain aluminum alloy using three axes deformation |
| DE3712281A1 (de) | 1987-04-10 | 1988-10-27 | Heraeus Gmbh W C | Verfahren zur herstellung von hochduktilem tantal-halbzeug |
| FR2729596A1 (fr) | 1992-05-07 | 1996-07-26 | Commissariat Energie Atomique | Procede de fabrication de pieces metalliques par forgeage libre et matricage sous presse |
| KR960013872B1 (ko) | 1992-11-10 | 1996-10-10 | 미쯔비시주우고오교오 가부시기가이샤 | 금속판표면의 광택부여방법 및 금속재의 냉간압연방법 |
| US5647923A (en) | 1995-07-13 | 1997-07-15 | Teledyne Industries, Inc. | Method for producing refractory metal foil |
| US5993513A (en) | 1996-04-05 | 1999-11-30 | Cabot Corporation | Method for controlling the oxygen content in valve metal materials |
| US6569270B2 (en) | 1997-07-11 | 2003-05-27 | Honeywell International Inc. | Process for producing a metal article |
| US6348139B1 (en) | 1998-06-17 | 2002-02-19 | Honeywell International Inc. | Tantalum-comprising articles |
| US6193821B1 (en) | 1998-08-19 | 2001-02-27 | Tosoh Smd, Inc. | Fine grain tantalum sputtering target and fabrication process |
| US6348113B1 (en) | 1998-11-25 | 2002-02-19 | Cabot Corporation | High purity tantalum, products containing the same, and methods of making the same |
| US6331233B1 (en) | 2000-02-02 | 2001-12-18 | Honeywell International Inc. | Tantalum sputtering target with fine grains and uniform texture and method of manufacture |
| AU2001296213A1 (en) * | 2000-05-22 | 2001-12-24 | Cabot Corporation | High purity niobium and products containing the same, and methods of making the same |
| US20020002695A1 (en) | 2000-06-02 | 2002-01-03 | Frank Kschischang | Method and system for decoding |
| US6946039B1 (en) | 2000-11-02 | 2005-09-20 | Honeywell International Inc. | Physical vapor deposition targets, and methods of fabricating metallic materials |
| US6887356B2 (en) | 2000-11-27 | 2005-05-03 | Cabot Corporation | Hollow cathode target and methods of making same |
| IL156802A0 (en) | 2001-01-11 | 2004-02-08 | Cabot Corp | Tantalum and niobium billets and methods of producing same |
| HUP0303269A3 (en) * | 2001-02-20 | 2004-05-28 | H C Starck Inc Newton | Refractory metal plates with uniform texture and methods of making the same |
| US6770154B2 (en) | 2001-09-18 | 2004-08-03 | Praxair S.T. Technology, Inc. | Textured-grain-powder metallurgy tantalum sputter target |
| US20040016635A1 (en) | 2002-07-19 | 2004-01-29 | Ford Robert B. | Monolithic sputtering target assembly |
-
2004
- 2004-06-02 US US10/859,456 patent/US7228722B2/en not_active Expired - Lifetime
- 2004-06-07 WO PCT/US2004/017972 patent/WO2004111295A1/en not_active Ceased
- 2004-06-07 EP EP04754543A patent/EP1636398A1/en not_active Withdrawn
- 2004-06-07 CN CNA2004800228031A patent/CN1833048A/zh active Pending
- 2004-06-07 JP JP2006533580A patent/JP2007516352A/ja active Pending
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