JP2008532765A5 - - Google Patents

Download PDF

Info

Publication number
JP2008532765A5
JP2008532765A5 JP2007555157A JP2007555157A JP2008532765A5 JP 2008532765 A5 JP2008532765 A5 JP 2008532765A5 JP 2007555157 A JP2007555157 A JP 2007555157A JP 2007555157 A JP2007555157 A JP 2007555157A JP 2008532765 A5 JP2008532765 A5 JP 2008532765A5
Authority
JP
Japan
Prior art keywords
metal plate
axis
texture
pole
rolling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007555157A
Other languages
English (en)
Japanese (ja)
Other versions
JP4880620B2 (ja
JP2008532765A (ja
Filing date
Publication date
Priority claimed from US11/055,535 external-priority patent/US7998287B2/en
Application filed filed Critical
Publication of JP2008532765A publication Critical patent/JP2008532765A/ja
Publication of JP2008532765A5 publication Critical patent/JP2008532765A5/ja
Application granted granted Critical
Publication of JP4880620B2 publication Critical patent/JP4880620B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP2007555157A 2005-02-10 2006-02-07 スパッタリングターゲットおよびその製造方法 Expired - Lifetime JP4880620B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/055,535 US7998287B2 (en) 2005-02-10 2005-02-10 Tantalum sputtering target and method of fabrication
US11/055,535 2005-02-10
PCT/US2006/004143 WO2006086319A2 (en) 2005-02-10 2006-02-07 Sputtering target and method of fabrication

Publications (3)

Publication Number Publication Date
JP2008532765A JP2008532765A (ja) 2008-08-21
JP2008532765A5 true JP2008532765A5 (enExample) 2009-02-12
JP4880620B2 JP4880620B2 (ja) 2012-02-22

Family

ID=36572042

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007555157A Expired - Lifetime JP4880620B2 (ja) 2005-02-10 2006-02-07 スパッタリングターゲットおよびその製造方法

Country Status (6)

Country Link
US (2) US7998287B2 (enExample)
EP (1) EP1848552B1 (enExample)
JP (1) JP4880620B2 (enExample)
KR (1) KR101253377B1 (enExample)
CN (2) CN101155650B (enExample)
WO (1) WO2006086319A2 (enExample)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4970034B2 (ja) * 2003-08-11 2012-07-04 ハネウェル・インターナショナル・インコーポレーテッド ターゲット／バッキングプレート構造物、及びターゲット／バッキングプレート構造物の形成法
WO2005098073A1 (en) * 2004-03-26 2005-10-20 H.C. Starck Inc. Refractory metal pots
US7998287B2 (en) 2005-02-10 2011-08-16 Cabot Corporation Tantalum sputtering target and method of fabrication
DE112007000440B4 (de) 2006-03-07 2021-01-07 Global Advanced Metals, Usa, Inc. Verfahren zum Erzeugen von verformten Metallartikeln
US7776166B2 (en) * 2006-12-05 2010-08-17 Praxair Technology, Inc. Texture and grain size controlled hollow cathode magnetron targets and method of manufacture
CN102367567B (zh) 2007-02-09 2015-04-01 Jx日矿日石金属株式会社 由难烧结物质构成的靶及其制造方法以及靶-背衬板组件及其制造方法
JP5586221B2 (ja) * 2007-02-27 2014-09-10 日本碍子株式会社 金属板材の圧延方法
US8250895B2 (en) * 2007-08-06 2012-08-28 H.C. Starck Inc. Methods and apparatus for controlling texture of plates and sheets by tilt rolling
KR101201577B1 (ko) 2007-08-06 2012-11-14 에이치. 씨. 스타아크 아이앤씨 향상된 조직 균일성을 가진 내화 금속판
KR100869268B1 (ko) * 2008-04-25 2008-11-18 주식회사 에스앤에스텍 하프톤형 위상반전 블랭크 마스크, 하프톤형 위상반전포토마스크 및 그의 제조 방법
KR101626286B1 (ko) * 2008-11-03 2016-06-01 토소우 에스엠디, 인크 스퍼터 타겟 제조 방법 및 이에 의해 제조된 스퍼터 타겟
CN101649439B (zh) * 2009-05-08 2012-07-25 宁波江丰电子材料有限公司 靶材塑性变形方法
KR101288651B1 (ko) * 2009-05-22 2013-07-22 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 탄탈륨 스퍼터링 타겟
CN103069044B (zh) * 2010-08-09 2015-02-18 吉坤日矿日石金属株式会社 钽溅射靶
CN101956159A (zh) * 2010-09-30 2011-01-26 金堆城钼业股份有限公司 一种高纯钼溅射靶材的制备方法
CN102350439B (zh) * 2011-09-23 2014-04-23 宁波江丰电子材料有限公司 半导体用镍靶坯热轧方法
CN103827348B (zh) * 2011-11-30 2015-11-25 吉坤日矿日石金属株式会社 钽溅射靶及其制造方法
CN102513789B (zh) * 2011-12-21 2014-04-09 宁波江丰电子材料有限公司 钨靶材的制作方法
US9890452B2 (en) 2012-03-21 2018-02-13 Jx Nippon Mining & Metals Corporation Tantalum sputtering target, method for manufacturing same, and barrier film for semiconductor wiring formed by using target
CN102699247B (zh) * 2012-05-18 2014-06-18 宁夏东方钽业股份有限公司 一种超导钽棒的锻造方法
EP2878699B1 (en) 2012-12-19 2020-07-15 JX Nippon Mining & Metals Corp. Tantalum sputtering target and method for producing same
WO2014097900A1 (ja) 2012-12-19 2014-06-26 Jx日鉱日石金属株式会社 タンタルスパッタリングターゲット及びその製造方法
KR20150095885A (ko) 2013-03-04 2015-08-21 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 탄탈 스퍼터링 타깃 및 그 제조 방법
MX2015017559A (es) * 2013-07-10 2016-05-09 Alcoa Inc Metodos para generar productos forjados y otros productos trabajados.
WO2015050041A1 (ja) 2013-10-01 2015-04-09 Jx日鉱日石金属株式会社 タンタルスパッタリングターゲット
WO2015146516A1 (ja) 2014-03-27 2015-10-01 Jx日鉱日石金属株式会社 タンタルスパッタリングターゲット及びその製造方法
KR20170134365A (ko) 2015-04-10 2017-12-06 토소우 에스엠디, 인크 탄탈 스퍼터 타겟의 제조 방법 및 그에 의해 제조된 스퍼터 타겟
JP6293928B2 (ja) * 2015-05-22 2018-03-14 Ｊｘ金属株式会社 タンタルスパッタリングターゲット及びその製造方法
EP3211118B1 (en) 2015-05-22 2020-09-09 JX Nippon Mining & Metals Corporation Tantalum sputtering target, and production method therefor
US11359273B2 (en) 2015-08-03 2022-06-14 Honeywell International Inc. Frictionless forged aluminum alloy sputtering target with improved properties
TW201738395A (zh) * 2015-11-06 2017-11-01 塔沙Ｓｍｄ公司 具有提高的沉積速率的製備鉭濺鍍靶材的方法
CA3011463C (en) * 2016-01-14 2020-07-07 Arconic Inc. Methods for producing forged products and other worked products
US10900102B2 (en) 2016-09-30 2021-01-26 Honeywell International Inc. High strength aluminum alloy backing plate and methods of making
JP6553813B2 (ja) 2017-03-30 2019-07-31 Ｊｘ金属株式会社 タンタルスパッタリングターゲット
US11062889B2 (en) 2017-06-26 2021-07-13 Tosoh Smd, Inc. Method of production of uniform metal plates and sputtering targets made thereby
JP2019173048A (ja) * 2018-03-26 2019-10-10 Ｊｘ金属株式会社 スパッタリングターゲット部材及びその製造方法
US11450516B2 (en) * 2019-08-14 2022-09-20 Honeywell International Inc. Large-grain tin sputtering target
TW202540463A (zh) * 2023-12-05 2025-10-16 美商塔沙Ｓｍｄ公司 具有改善的性能及可預測性之鉭濺射靶及其製造方法

Family Cites Families (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE645631C (de) 1934-08-29 1937-06-01 Kronprinz A G Fuer Metallindus Verfahren zur moeglichst abfallosen Herstellung von Blechscheiben
US4209375A (en) * 1979-08-02 1980-06-24 The United States Of America As Represented By The United States Department Of Energy Sputter target
US4884746A (en) 1987-02-05 1989-12-05 Radial Turbine International A/S Fuel nozzle and improved system and method for injecting fuel into a gas turbine engine
DE3712281A1 (de) 1987-04-10 1988-10-27 Heraeus Gmbh W C Verfahren zur herstellung von hochduktilem tantal-halbzeug
SU1454527A1 (ru) * 1987-04-29 1989-01-30 Московский институт стали и сплавов Валковый узел прокатного стана дл электропластической деформации тонких лент
JPH05255752A (ja) 1992-01-24 1993-10-05 Nippon Steel Corp セミプロセス無方向性電磁鋼板の製造方法
FR2729596A1 (fr) 1992-05-07 1996-07-26 Commissariat Energie Atomique Procede de fabrication de pieces metalliques par forgeage libre et matricage sous presse
JPH08263438A (ja) * 1994-11-23 1996-10-11 Xerox Corp ディジタルワークの配給及び使用制御システム並びにディジタルワークへのアクセス制御方法
US5681405A (en) * 1995-03-09 1997-10-28 Golden Aluminum Company Method for making an improved aluminum alloy sheet product
US5836506A (en) * 1995-04-21 1998-11-17 Sony Corporation Sputter target/backing plate assembly and method of making same
WO1997025798A1 (en) * 1996-01-11 1997-07-17 Mrj, Inc. System for controlling access and distribution of digital property
JPH1112726A (ja) 1997-06-20 1999-01-19 Sony Corp スパッタリングターゲット及びその製造方法
US5993621A (en) 1997-07-11 1999-11-30 Johnson Matthey Electronics, Inc. Titanium sputtering target
US6569270B2 (en) 1997-07-11 2003-05-27 Honeywell International Inc. Process for producing a metal article
US6385596B1 (en) * 1998-02-06 2002-05-07 Liquid Audio, Inc. Secure online music distribution system
US6348139B1 (en) 1998-06-17 2002-02-19 Honeywell International Inc. Tantalum-comprising articles
US6193821B1 (en) 1998-08-19 2001-02-27 Tosoh Smd, Inc. Fine grain tantalum sputtering target and fabrication process
US6348113B1 (en) * 1998-11-25 2002-02-19 Cabot Corporation High purity tantalum, products containing the same, and methods of making the same
AU5784800A (en) * 1999-06-30 2001-01-31 Accenture Llp A system, method and article of manufacture for an internet based distribution architecture
US6283357B1 (en) * 1999-08-03 2001-09-04 Praxair S.T. Technology, Inc. Fabrication of clad hollow cathode magnetron sputter targets
US7424543B2 (en) * 1999-09-08 2008-09-09 Rice Iii James L System and method of permissive data flow and application transfer
US6878250B1 (en) * 1999-12-16 2005-04-12 Honeywell International Inc. Sputtering targets formed from cast materials
AU2000269232A1 (en) * 2000-01-14 2001-07-24 Microsoft Corporation Specifying security for an element by assigning a scaled value representative ofthe relative security thereof
US20020052933A1 (en) * 2000-01-14 2002-05-02 Gerd Leonhard Method and apparatus for licensing media over a network
US6331233B1 (en) 2000-02-02 2001-12-18 Honeywell International Inc. Tantalum sputtering target with fine grains and uniform texture and method of manufacture
AU2001296213A1 (en) * 2000-05-22 2001-12-24 Cabot Corporation High purity niobium and products containing the same, and methods of making the same
US6462339B1 (en) 2000-09-20 2002-10-08 Cabot Corporation Method for quantifying the texture homogeneity of a polycrystalline material
US6946039B1 (en) * 2000-11-02 2005-09-20 Honeywell International Inc. Physical vapor deposition targets, and methods of fabricating metallic materials
US6887356B2 (en) 2000-11-27 2005-05-03 Cabot Corporation Hollow cathode target and methods of making same
HUP0303269A3 (en) * 2001-02-20 2004-05-28 H C Starck Inc Newton Refractory metal plates with uniform texture and methods of making the same
EP1243998B1 (en) * 2001-03-21 2017-04-19 Excalibur IP, LLC A technique for license management and online software license enforcement
US7856414B2 (en) * 2001-03-29 2010-12-21 Christopher Zee Assured archival and retrieval system for digital intellectual property
US7216368B2 (en) * 2001-03-29 2007-05-08 Sony Corporation Information processing apparatus for watermarking digital content
GB2376540B (en) * 2001-06-12 2005-05-04 Hewlett Packard Co Upgrade of licensed capacity on computer entity
US6770154B2 (en) 2001-09-18 2004-08-03 Praxair S.T. Technology, Inc. Textured-grain-powder metallurgy tantalum sputter target
US6976380B1 (en) * 2002-01-24 2005-12-20 The Texas A&M University System Developing the texture of a material
US7330954B2 (en) * 2002-04-18 2008-02-12 Intel Corporation Storing information in one of at least two storage devices based on a storage parameter and an attribute of the storage devices
US10986403B2 (en) * 2002-06-27 2021-04-20 Piranha Media Distribution, Inc. Interactive digital media and advertising presentation platform
US20040044697A1 (en) * 2002-08-28 2004-03-04 Nixon Michael L. Systems and methods for distributing, obtaining and using digital media files
JP4883546B2 (ja) * 2002-09-20 2012-02-22 Ｊｘ日鉱日石金属株式会社 タンタルスパッタリングターゲットの製造方法
US7228722B2 (en) 2003-06-09 2007-06-12 Cabot Corporation Method of forming sputtering articles by multidirectional deformation
US7870385B2 (en) * 2004-02-03 2011-01-11 Music Public Broadcasting, Inc. Method and system for controlling presentation of computer readable media on a media storage device
US7998287B2 (en) 2005-02-10 2011-08-16 Cabot Corporation Tantalum sputtering target and method of fabrication
WO2011029859A1 (de) 2009-09-09 2011-03-17 Knorr-Bremse Systeme für Schienenfahrzeuge GmbH Verfahren und vorrichtung zum abschätzen der temperatur eines radsatzlagers eines radsatzes eines schienenfahrzeugs

Similar Documents

Publication Publication Date Title
JP2008532765A5 (enExample)
JP2016148110A5 (enExample)
CN102513353B (zh) 溅射靶及制造方法
JP5557121B2 (ja) マグネシウム合金
JP2002518593A5 (enExample)
CN103898424A (zh) 一种镁合金晶粒细化方法
CN105080966B (zh) 一种纳米晶金属极薄带的制备方法
CN102189143A (zh) 基于等径角挤压的超细晶镍钛形状记忆合金管制备方法
JP2005500165A5 (enExample)
CN104313523A (zh) 高性能镁合金板材制备方法
KR20200043515A (ko) 배킹 플레이트 일체형의 금속제 스퍼터링 타깃 및 그 제조 방법
KR20120031008A (ko) 마그네슘 합금판
JP2013221201A5 (enExample)
Lee et al. High strain-rate superplasticity of AZ91 alloy achieved by rapidly solidified flaky powder metallurgy
EP3690070A1 (en) Magnesium or magnesium alloy having high formability at room temperature and manufacturing method thereof
CN104726829A (zh) 一种高纯NiPt合金靶材及其制备方法
JP4990531B2 (ja) スパッタリング用チタン材の製造方法。
Lu et al. Effect of annealing on microstructure evolution and mechanical property of cold forged magnesium pipes
US20190055629A1 (en) Method of making a tantalum sputtering target with increased deposition rate
JP2007521140A5 (enExample)
KR20140118486A (ko) 대칭 및 비대칭 압연을 이용한 마그네슘 합금시트의 제조방법 및 이를 이용하여 제조된 마그네슘 합금시트
JPWO2012077758A1 (ja) マグネシウム合金圧延材の製造方法及びマグネシウム合金圧延材並びにプレス成形体
US20100180656A1 (en) Reverse temperature field rolling method for mg alloy sheet
CN110802125B (zh) 一种镁合金棒材的制备方法
CN1332058C (zh) 棒状超细晶材料的制备方法