JP4880620B2 - スパッタリングターゲットおよびその製造方法 - Google Patents
スパッタリングターゲットおよびその製造方法 Download PDFInfo
- Publication number
- JP4880620B2 JP4880620B2 JP2007555157A JP2007555157A JP4880620B2 JP 4880620 B2 JP4880620 B2 JP 4880620B2 JP 2007555157 A JP2007555157 A JP 2007555157A JP 2007555157 A JP2007555157 A JP 2007555157A JP 4880620 B2 JP4880620 B2 JP 4880620B2
- Authority
- JP
- Japan
- Prior art keywords
- texture
- rolling
- metal plate
- tantalum
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C27/00—Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00
- C22C27/02—Alloys based on vanadium, niobium, or tantalum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B1/00—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations
- B21B1/02—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling heavy work, e.g. ingots, slabs, blooms, or billets, in which the cross-sectional form is unimportant ; Rolling combined with forging or pressing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B1/00—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations
- B21B1/38—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling sheets of limited length, e.g. folded sheets, superimposed sheets, pack rolling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21H—MAKING PARTICULAR METAL OBJECTS BY ROLLING, e.g. SCREWS, WHEELS, RINGS, BARRELS, BALLS
- B21H1/00—Making articles shaped as bodies of revolution
- B21H1/02—Making articles shaped as bodies of revolution discs; disc wheels
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/16—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of other metals or alloys based thereon
- C22F1/18—High-melting or refractory metals or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12229—Intermediate article [e.g., blank, etc.]
- Y10T428/12236—Panel having nonrectangular perimeter
- Y10T428/12243—Disk
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Metal Rolling (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/055,535 US7998287B2 (en) | 2005-02-10 | 2005-02-10 | Tantalum sputtering target and method of fabrication |
| US11/055,535 | 2005-02-10 | ||
| PCT/US2006/004143 WO2006086319A2 (en) | 2005-02-10 | 2006-02-07 | Sputtering target and method of fabrication |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008532765A JP2008532765A (ja) | 2008-08-21 |
| JP2008532765A5 JP2008532765A5 (enExample) | 2009-02-12 |
| JP4880620B2 true JP4880620B2 (ja) | 2012-02-22 |
Family
ID=36572042
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007555157A Expired - Lifetime JP4880620B2 (ja) | 2005-02-10 | 2006-02-07 | スパッタリングターゲットおよびその製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US7998287B2 (enExample) |
| EP (1) | EP1848552B1 (enExample) |
| JP (1) | JP4880620B2 (enExample) |
| KR (1) | KR101253377B1 (enExample) |
| CN (2) | CN101155650B (enExample) |
| WO (1) | WO2006086319A2 (enExample) |
Families Citing this family (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4970034B2 (ja) * | 2003-08-11 | 2012-07-04 | ハネウェル・インターナショナル・インコーポレーテッド | ターゲット/バッキングプレート構造物、及びターゲット/バッキングプレート構造物の形成法 |
| WO2005098073A1 (en) * | 2004-03-26 | 2005-10-20 | H.C. Starck Inc. | Refractory metal pots |
| US7998287B2 (en) | 2005-02-10 | 2011-08-16 | Cabot Corporation | Tantalum sputtering target and method of fabrication |
| DE112007000440B4 (de) | 2006-03-07 | 2021-01-07 | Global Advanced Metals, Usa, Inc. | Verfahren zum Erzeugen von verformten Metallartikeln |
| US7776166B2 (en) * | 2006-12-05 | 2010-08-17 | Praxair Technology, Inc. | Texture and grain size controlled hollow cathode magnetron targets and method of manufacture |
| CN102367567B (zh) | 2007-02-09 | 2015-04-01 | Jx日矿日石金属株式会社 | 由难烧结物质构成的靶及其制造方法以及靶-背衬板组件及其制造方法 |
| JP5586221B2 (ja) * | 2007-02-27 | 2014-09-10 | 日本碍子株式会社 | 金属板材の圧延方法 |
| US8250895B2 (en) * | 2007-08-06 | 2012-08-28 | H.C. Starck Inc. | Methods and apparatus for controlling texture of plates and sheets by tilt rolling |
| KR101201577B1 (ko) | 2007-08-06 | 2012-11-14 | 에이치. 씨. 스타아크 아이앤씨 | 향상된 조직 균일성을 가진 내화 금속판 |
| KR100869268B1 (ko) * | 2008-04-25 | 2008-11-18 | 주식회사 에스앤에스텍 | 하프톤형 위상반전 블랭크 마스크, 하프톤형 위상반전포토마스크 및 그의 제조 방법 |
| KR101626286B1 (ko) * | 2008-11-03 | 2016-06-01 | 토소우 에스엠디, 인크 | 스퍼터 타겟 제조 방법 및 이에 의해 제조된 스퍼터 타겟 |
| CN101649439B (zh) * | 2009-05-08 | 2012-07-25 | 宁波江丰电子材料有限公司 | 靶材塑性变形方法 |
| KR101288651B1 (ko) * | 2009-05-22 | 2013-07-22 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | 탄탈륨 스퍼터링 타겟 |
| CN103069044B (zh) * | 2010-08-09 | 2015-02-18 | 吉坤日矿日石金属株式会社 | 钽溅射靶 |
| CN101956159A (zh) * | 2010-09-30 | 2011-01-26 | 金堆城钼业股份有限公司 | 一种高纯钼溅射靶材的制备方法 |
| CN102350439B (zh) * | 2011-09-23 | 2014-04-23 | 宁波江丰电子材料有限公司 | 半导体用镍靶坯热轧方法 |
| CN103827348B (zh) * | 2011-11-30 | 2015-11-25 | 吉坤日矿日石金属株式会社 | 钽溅射靶及其制造方法 |
| CN102513789B (zh) * | 2011-12-21 | 2014-04-09 | 宁波江丰电子材料有限公司 | 钨靶材的制作方法 |
| US9890452B2 (en) | 2012-03-21 | 2018-02-13 | Jx Nippon Mining & Metals Corporation | Tantalum sputtering target, method for manufacturing same, and barrier film for semiconductor wiring formed by using target |
| CN102699247B (zh) * | 2012-05-18 | 2014-06-18 | 宁夏东方钽业股份有限公司 | 一种超导钽棒的锻造方法 |
| EP2878699B1 (en) | 2012-12-19 | 2020-07-15 | JX Nippon Mining & Metals Corp. | Tantalum sputtering target and method for producing same |
| WO2014097900A1 (ja) | 2012-12-19 | 2014-06-26 | Jx日鉱日石金属株式会社 | タンタルスパッタリングターゲット及びその製造方法 |
| KR20150095885A (ko) | 2013-03-04 | 2015-08-21 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | 탄탈 스퍼터링 타깃 및 그 제조 방법 |
| MX2015017559A (es) * | 2013-07-10 | 2016-05-09 | Alcoa Inc | Metodos para generar productos forjados y otros productos trabajados. |
| WO2015050041A1 (ja) | 2013-10-01 | 2015-04-09 | Jx日鉱日石金属株式会社 | タンタルスパッタリングターゲット |
| WO2015146516A1 (ja) | 2014-03-27 | 2015-10-01 | Jx日鉱日石金属株式会社 | タンタルスパッタリングターゲット及びその製造方法 |
| KR20170134365A (ko) | 2015-04-10 | 2017-12-06 | 토소우 에스엠디, 인크 | 탄탈 스퍼터 타겟의 제조 방법 및 그에 의해 제조된 스퍼터 타겟 |
| JP6293928B2 (ja) * | 2015-05-22 | 2018-03-14 | Jx金属株式会社 | タンタルスパッタリングターゲット及びその製造方法 |
| EP3211118B1 (en) | 2015-05-22 | 2020-09-09 | JX Nippon Mining & Metals Corporation | Tantalum sputtering target, and production method therefor |
| US11359273B2 (en) | 2015-08-03 | 2022-06-14 | Honeywell International Inc. | Frictionless forged aluminum alloy sputtering target with improved properties |
| TW201738395A (zh) * | 2015-11-06 | 2017-11-01 | 塔沙Smd公司 | 具有提高的沉積速率的製備鉭濺鍍靶材的方法 |
| CA3011463C (en) * | 2016-01-14 | 2020-07-07 | Arconic Inc. | Methods for producing forged products and other worked products |
| US10900102B2 (en) | 2016-09-30 | 2021-01-26 | Honeywell International Inc. | High strength aluminum alloy backing plate and methods of making |
| JP6553813B2 (ja) | 2017-03-30 | 2019-07-31 | Jx金属株式会社 | タンタルスパッタリングターゲット |
| US11062889B2 (en) | 2017-06-26 | 2021-07-13 | Tosoh Smd, Inc. | Method of production of uniform metal plates and sputtering targets made thereby |
| JP2019173048A (ja) * | 2018-03-26 | 2019-10-10 | Jx金属株式会社 | スパッタリングターゲット部材及びその製造方法 |
| US11450516B2 (en) * | 2019-08-14 | 2022-09-20 | Honeywell International Inc. | Large-grain tin sputtering target |
| TW202540463A (zh) * | 2023-12-05 | 2025-10-16 | 美商塔沙Smd公司 | 具有改善的性能及可預測性之鉭濺射靶及其製造方法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001509548A (ja) * | 1997-07-11 | 2001-07-24 | ジョンソン マッティー エレクトロニクス インコーポレイテッド | チタンスパッタターゲット及びその製造方法 |
| JP2002530534A (ja) * | 1998-11-25 | 2002-09-17 | キャボット コーポレイション | 高純度タンタルおよびそれを含む、スパッタターゲットのような製品 |
| JP2004513228A (ja) * | 2000-11-02 | 2004-04-30 | ハネウェル・インターナショナル・インコーポレーテッド | 物理蒸着ターゲット及び金属材料の製造方法 |
| JP2004526863A (ja) * | 2001-02-20 | 2004-09-02 | ハー ツェー シュタルク インコーポレイテッド | 均一な集合組織を有する耐火金属板及び該板を製造する方法 |
| JP2007516352A (ja) * | 2003-06-09 | 2007-06-21 | キャボット コーポレイション | 多方向変形によってスパッタリング物品を形成する方法 |
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-
2005
- 2005-02-10 US US11/055,535 patent/US7998287B2/en active Active
-
2006
- 2006-02-07 EP EP06734440A patent/EP1848552B1/en not_active Expired - Lifetime
- 2006-02-07 WO PCT/US2006/004143 patent/WO2006086319A2/en not_active Ceased
- 2006-02-07 CN CN2006800115901A patent/CN101155650B/zh not_active Expired - Lifetime
- 2006-02-07 CN CN201110393399.0A patent/CN102513353B/zh not_active Expired - Lifetime
- 2006-02-07 JP JP2007555157A patent/JP4880620B2/ja not_active Expired - Lifetime
- 2006-02-07 KR KR1020077020482A patent/KR101253377B1/ko not_active Expired - Lifetime
-
2011
- 2011-06-27 US US13/169,284 patent/US8231745B2/en not_active Expired - Lifetime
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001509548A (ja) * | 1997-07-11 | 2001-07-24 | ジョンソン マッティー エレクトロニクス インコーポレイテッド | チタンスパッタターゲット及びその製造方法 |
| JP2002530534A (ja) * | 1998-11-25 | 2002-09-17 | キャボット コーポレイション | 高純度タンタルおよびそれを含む、スパッタターゲットのような製品 |
| JP2007084931A (ja) * | 1998-11-25 | 2007-04-05 | Cabot Corp | 高純度タンタルおよびそれを含む、スパッタターゲットのような製品 |
| JP2004513228A (ja) * | 2000-11-02 | 2004-04-30 | ハネウェル・インターナショナル・インコーポレーテッド | 物理蒸着ターゲット及び金属材料の製造方法 |
| JP2004526863A (ja) * | 2001-02-20 | 2004-09-02 | ハー ツェー シュタルク インコーポレイテッド | 均一な集合組織を有する耐火金属板及び該板を製造する方法 |
| JP2007516352A (ja) * | 2003-06-09 | 2007-06-21 | キャボット コーポレイション | 多方向変形によってスパッタリング物品を形成する方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101155650A (zh) | 2008-04-02 |
| KR20070107114A (ko) | 2007-11-06 |
| US20110297536A1 (en) | 2011-12-08 |
| CN102513353A (zh) | 2012-06-27 |
| CN102513353B (zh) | 2016-02-17 |
| US7998287B2 (en) | 2011-08-16 |
| US8231745B2 (en) | 2012-07-31 |
| JP2008532765A (ja) | 2008-08-21 |
| CN101155650B (zh) | 2012-02-01 |
| EP1848552B1 (en) | 2012-10-10 |
| EP1848552A2 (en) | 2007-10-31 |
| WO2006086319A3 (en) | 2006-12-28 |
| WO2006086319A2 (en) | 2006-08-17 |
| US20070089815A1 (en) | 2007-04-26 |
| KR101253377B1 (ko) | 2013-04-11 |
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