JP2004523128A - 最小限の熱の不整合で熱除去を実現する高性能フリップチップパッケージ - Google Patents

最小限の熱の不整合で熱除去を実現する高性能フリップチップパッケージ Download PDF

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JP2004523128A
JP2004523128A JP2003504467A JP2003504467A JP2004523128A JP 2004523128 A JP2004523128 A JP 2004523128A JP 2003504467 A JP2003504467 A JP 2003504467A JP 2003504467 A JP2003504467 A JP 2003504467A JP 2004523128 A JP2004523128 A JP 2004523128A
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integrated circuit
circuit device
substrate
contacts
central region
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Japanese (ja)
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JP2004523128A5 (enExample
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エガン，アブ・ケィ
ファン，ラン・エイチ
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Xilinx Inc
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Xilinx Inc
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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2003504467A 2001-06-11 2002-05-30 最小限の熱の不整合で熱除去を実現する高性能フリップチップパッケージ Pending JP2004523128A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/879,875 US7061102B2 (en) 2001-06-11 2001-06-11 High performance flipchip package that incorporates heat removal with minimal thermal mismatch
PCT/US2002/017531 WO2002101827A2 (en) 2001-06-11 2002-05-30 High performance flipchip package that incorporates heat removal with minimal thermal mismatch

Publications (2)

Publication Number Publication Date
JP2004523128A true JP2004523128A (ja) 2004-07-29
JP2004523128A5 JP2004523128A5 (enExample) 2005-08-04

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JP2003504467A Pending JP2004523128A (ja) 2001-06-11 2002-05-30 最小限の熱の不整合で熱除去を実現する高性能フリップチップパッケージ

Country Status (5)

Country Link
US (1) US7061102B2 (enExample)
EP (1) EP1396020A2 (enExample)
JP (1) JP2004523128A (enExample)
CA (1) CA2448338A1 (enExample)
WO (1) WO2002101827A2 (enExample)

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