AU2002217987A1 - Thermally and electrically enhanced ball grid array packaging - Google Patents
Thermally and electrically enhanced ball grid array packagingInfo
- Publication number
- AU2002217987A1 AU2002217987A1 AU2002217987A AU1798702A AU2002217987A1 AU 2002217987 A1 AU2002217987 A1 AU 2002217987A1 AU 2002217987 A AU2002217987 A AU 2002217987A AU 1798702 A AU1798702 A AU 1798702A AU 2002217987 A1 AU2002217987 A1 AU 2002217987A1
- Authority
- AU
- Australia
- Prior art keywords
- thermally
- grid array
- ball grid
- array packaging
- electrically enhanced
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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US25095000P | 2000-12-01 | 2000-12-01 | |
US60/250,950 | 2000-12-01 | ||
PCT/US2001/044955 WO2002045164A2 (en) | 2000-12-01 | 2001-11-30 | Thermally and electrically enhanced ball grid array packaging |
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AU2002217987A1 true AU2002217987A1 (en) | 2002-06-11 |
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AU2002217987A Abandoned AU2002217987A1 (en) | 2000-12-01 | 2001-11-30 | Thermally and electrically enhanced ball grid array packaging |
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US (5) | US6882042B2 (en) |
EP (1) | EP1346411A2 (en) |
AU (1) | AU2002217987A1 (en) |
TW (1) | TWI247398B (en) |
WO (1) | WO2002045164A2 (en) |
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-
2001
- 2001-11-30 AU AU2002217987A patent/AU2002217987A1/en not_active Abandoned
- 2001-11-30 EP EP01999002A patent/EP1346411A2/en not_active Withdrawn
- 2001-11-30 US US09/997,272 patent/US6882042B2/en not_active Expired - Fee Related
- 2001-11-30 WO PCT/US2001/044955 patent/WO2002045164A2/en not_active Application Discontinuation
- 2001-12-03 TW TW090129878A patent/TWI247398B/en not_active IP Right Cessation
-
2004
- 2004-10-14 US US10/963,620 patent/US7629681B2/en not_active Expired - Fee Related
-
2009
- 2009-11-16 US US12/619,385 patent/US8039949B2/en not_active Expired - Fee Related
-
2011
- 2011-09-02 US US13/224,933 patent/US8686558B2/en not_active Expired - Lifetime
-
2014
- 2014-03-28 US US14/229,215 patent/US20140210083A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
TWI247398B (en) | 2006-01-11 |
US20110318885A1 (en) | 2011-12-29 |
US7629681B2 (en) | 2009-12-08 |
US8686558B2 (en) | 2014-04-01 |
WO2002045164A2 (en) | 2002-06-06 |
US20020135065A1 (en) | 2002-09-26 |
US20050077545A1 (en) | 2005-04-14 |
US6882042B2 (en) | 2005-04-19 |
US20140210083A1 (en) | 2014-07-31 |
US8039949B2 (en) | 2011-10-18 |
EP1346411A2 (en) | 2003-09-24 |
US20100052151A1 (en) | 2010-03-04 |
WO2002045164A3 (en) | 2003-03-27 |
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