TW383908U - Structure used for increasing heat-dissipation of micro-electronic apparatus - Google Patents

Structure used for increasing heat-dissipation of micro-electronic apparatus

Info

Publication number
TW383908U
TW383908U TW87215690U TW87215690U TW383908U TW 383908 U TW383908 U TW 383908U TW 87215690 U TW87215690 U TW 87215690U TW 87215690 U TW87215690 U TW 87215690U TW 383908 U TW383908 U TW 383908U
Authority
TW
Taiwan
Prior art keywords
dissipation
micro
electronic apparatus
structure used
increasing heat
Prior art date
Application number
TW87215690U
Other languages
Chinese (zh)
Inventor
Ji-Ming Li
Guo-Ming Chen
Original Assignee
Caesar Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Caesar Technology Inc filed Critical Caesar Technology Inc
Priority to TW87215690U priority Critical patent/TW383908U/en
Publication of TW383908U publication Critical patent/TW383908U/en

Links

TW87215690U 1998-09-22 1998-09-22 Structure used for increasing heat-dissipation of micro-electronic apparatus TW383908U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW87215690U TW383908U (en) 1998-09-22 1998-09-22 Structure used for increasing heat-dissipation of micro-electronic apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW87215690U TW383908U (en) 1998-09-22 1998-09-22 Structure used for increasing heat-dissipation of micro-electronic apparatus

Publications (1)

Publication Number Publication Date
TW383908U true TW383908U (en) 2000-03-01

Family

ID=21636322

Family Applications (1)

Application Number Title Priority Date Filing Date
TW87215690U TW383908U (en) 1998-09-22 1998-09-22 Structure used for increasing heat-dissipation of micro-electronic apparatus

Country Status (1)

Country Link
TW (1) TW383908U (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6825108B2 (en) 2002-02-01 2004-11-30 Broadcom Corporation Ball grid array package fabrication with IC die support structures
US7786591B2 (en) 2004-09-29 2010-08-31 Broadcom Corporation Die down ball grid array package
US7791189B2 (en) 2004-06-21 2010-09-07 Broadcom Corporation Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same
US7859101B2 (en) 2000-12-22 2010-12-28 Broadcom Corporation Die-up ball grid array package with die-attached heat spreader
US7893546B2 (en) 2000-12-22 2011-02-22 Broadcom Corporation Ball grid array package enhanced with a thermal and electrical connector
US8039949B2 (en) 2000-12-01 2011-10-18 Broadcom Corporation Ball grid array package having one or more stiffeners
US8183680B2 (en) 2006-05-16 2012-05-22 Broadcom Corporation No-lead IC packages having integrated heat spreader for electromagnetic interference (EMI) shielding and thermal enhancement

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8039949B2 (en) 2000-12-01 2011-10-18 Broadcom Corporation Ball grid array package having one or more stiffeners
US8686558B2 (en) 2000-12-01 2014-04-01 Broadcom Corporation Thermally and electrically enhanced ball grid array package
US7859101B2 (en) 2000-12-22 2010-12-28 Broadcom Corporation Die-up ball grid array package with die-attached heat spreader
US7893546B2 (en) 2000-12-22 2011-02-22 Broadcom Corporation Ball grid array package enhanced with a thermal and electrical connector
US8310067B2 (en) 2000-12-22 2012-11-13 Broadcom Corporation Ball grid array package enhanced with a thermal and electrical connector
US6825108B2 (en) 2002-02-01 2004-11-30 Broadcom Corporation Ball grid array package fabrication with IC die support structures
US7791189B2 (en) 2004-06-21 2010-09-07 Broadcom Corporation Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same
US7786591B2 (en) 2004-09-29 2010-08-31 Broadcom Corporation Die down ball grid array package
US8021927B2 (en) 2004-09-29 2011-09-20 Broadcom Corporation Die down ball grid array packages and method for making same
US8183680B2 (en) 2006-05-16 2012-05-22 Broadcom Corporation No-lead IC packages having integrated heat spreader for electromagnetic interference (EMI) shielding and thermal enhancement

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees