TW387579U - Heat dissipation apparatus of chipsets - Google Patents

Heat dissipation apparatus of chipsets

Info

Publication number
TW387579U
TW387579U TW87215957U TW87215957U TW387579U TW 387579 U TW387579 U TW 387579U TW 87215957 U TW87215957 U TW 87215957U TW 87215957 U TW87215957 U TW 87215957U TW 387579 U TW387579 U TW 387579U
Authority
TW
Taiwan
Prior art keywords
chipsets
heat dissipation
dissipation apparatus
heat
dissipation
Prior art date
Application number
TW87215957U
Other languages
Chinese (zh)
Inventor
Mau-Chin Chen
Original Assignee
Aavid Taiwan Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aavid Taiwan Inc filed Critical Aavid Taiwan Inc
Priority to TW87215957U priority Critical patent/TW387579U/en
Priority to JP1998009427U priority patent/JP3060218U/en
Publication of TW387579U publication Critical patent/TW387579U/en

Links

TW87215957U 1998-09-25 1998-09-25 Heat dissipation apparatus of chipsets TW387579U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW87215957U TW387579U (en) 1998-09-25 1998-09-25 Heat dissipation apparatus of chipsets
JP1998009427U JP3060218U (en) 1998-09-25 1998-11-30 Heat dissipation device for chip module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW87215957U TW387579U (en) 1998-09-25 1998-09-25 Heat dissipation apparatus of chipsets

Publications (1)

Publication Number Publication Date
TW387579U true TW387579U (en) 2000-04-11

Family

ID=21636417

Family Applications (1)

Application Number Title Priority Date Filing Date
TW87215957U TW387579U (en) 1998-09-25 1998-09-25 Heat dissipation apparatus of chipsets

Country Status (2)

Country Link
JP (1) JP3060218U (en)
TW (1) TW387579U (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4680816B2 (en) * 2006-03-31 2011-05-11 三菱電機株式会社 Semiconductor device
JP5719566B2 (en) * 2010-11-04 2015-05-20 新光電気工業株式会社 IC package heat sink and IC package connection device having heat sink
KR101421919B1 (en) * 2014-04-01 2014-08-06 (주)코리아반도체조명 LED lighting fixture circuit board a fixture
JP5915721B1 (en) * 2014-11-25 2016-05-11 日本電気株式会社 Cooling system
JP6811551B2 (en) * 2016-05-27 2021-01-13 日産自動車株式会社 Manufacturing method and cooling structure of power converter

Also Published As

Publication number Publication date
JP3060218U (en) 1999-08-17

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees