JP2004507116A - 高周波適用のためのポリイミド - Google Patents

高周波適用のためのポリイミド Download PDF

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Publication number
JP2004507116A
JP2004507116A JP2002521566A JP2002521566A JP2004507116A JP 2004507116 A JP2004507116 A JP 2004507116A JP 2002521566 A JP2002521566 A JP 2002521566A JP 2002521566 A JP2002521566 A JP 2002521566A JP 2004507116 A JP2004507116 A JP 2004507116A
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JP
Japan
Prior art keywords
polyimide
film
ghz
humidity
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002521566A
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English (en)
Japanese (ja)
Other versions
JP2004507116A5 (enExample
Inventor
チェン，バート　ティー．
エゼル，スティーブン　エー．
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2004507116A publication Critical patent/JP2004507116A/ja
Publication of JP2004507116A5 publication Critical patent/JP2004507116A5/ja
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C08G73/1053—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the tetracarboxylic moiety
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
    • H01B3/306—Polyimides or polyesterimides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
    • C09K2323/02—Alignment layer characterised by chemical composition
    • C09K2323/027—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP2002521566A 2000-08-21 2000-12-21 高周波適用のためのポリイミド Pending JP2004507116A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/642,849 US6392004B1 (en) 2000-08-21 2000-08-21 Polyimides for high-frequency applications
PCT/US2000/035077 WO2002016473A1 (en) 2000-08-21 2000-12-21 Polyimides for high-frequency applications

Publications (2)

Publication Number Publication Date
JP2004507116A true JP2004507116A (ja) 2004-03-04
JP2004507116A5 JP2004507116A5 (enExample) 2008-02-28

Family

ID=24578295

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002521566A Pending JP2004507116A (ja) 2000-08-21 2000-12-21 高周波適用のためのポリイミド

Country Status (6)

Country Link
US (1) US6392004B1 (enExample)
EP (1) EP1311586A1 (enExample)
JP (1) JP2004507116A (enExample)
KR (1) KR20030029829A (enExample)
AU (1) AU2001227360A1 (enExample)
WO (1) WO2002016473A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014118519A (ja) * 2012-12-18 2014-06-30 Kaneka Corp ポリイミド樹脂溶液

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7147906B2 (en) * 2003-06-24 2006-12-12 General Electric Company Data storage medium comprising polyimides
US7192999B2 (en) * 2003-09-19 2007-03-20 Brewer Science Inc. Polyimides for use as high refractive index, thin film materials
WO2006035918A1 (en) * 2004-09-27 2006-04-06 Fujifilm Corporation Film, method for producing film, and image display device
EP3018164B1 (en) * 2013-07-05 2019-03-06 Mitsubishi Gas Chemical Company, Inc. Polyimide resin
CN109796590A (zh) * 2017-11-16 2019-05-24 宁波长阳科技股份有限公司 一种聚酰亚胺树脂和透明聚酰亚胺薄膜
KR102063216B1 (ko) * 2018-07-19 2020-01-07 에스케이씨코오롱피아이 주식회사 실란계 화합물이 결합된 폴리아믹산, 이로부터 제조된 폴리이미드 필름 및 이의 제조 방법
CN121021834A (zh) * 2025-10-29 2025-11-28 中南大学 一种含卤代芴结构聚酰亚胺、电介质膜材料及其制备方法和应用

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05230211A (ja) * 1992-02-19 1993-09-07 Nippon Steel Corp ポリイミド樹脂
WO1997044704A1 (en) * 1996-05-23 1997-11-27 Minnesota Mining And Manufacturing Company Polyimide angularity enhancement layer
JPH10298285A (ja) * 1997-04-30 1998-11-10 Jsr Corp ポリアミック酸およびポリイミド
JPH11116672A (ja) * 1997-10-15 1999-04-27 Jsr Corp フッ素含有ポリイミド樹脂を含む電気絶縁材料およびそれを用いた電子部品
JPH11292968A (ja) * 1998-04-15 1999-10-26 Jsr Corp 電子部品およびその製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2009739A1 (de) 1970-03-03 1971-09-30 Bayer Aromatische Polyimide mit erhöhter Löslichkeit
US4845185A (en) * 1986-04-22 1989-07-04 Nippon Steel Corporation Soluble copolyimide from 9,9-bis (4-amino phenyl) fluorene
US5145937A (en) 1989-11-09 1992-09-08 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Polyimides with carbonyl and ether connecting groups between the aromatic rings
US5145942A (en) 1990-09-28 1992-09-08 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Methyl substituted polyimides containing carbonyl and ether connecting groups
JPH0531341A (ja) * 1991-07-26 1993-02-09 Nippon Steel Corp ポリイミドガス分離膜
US5220070A (en) 1991-09-05 1993-06-15 The United States Of America As Represented By The Administrator National Aeronautics And Space Administration 1,3-diamino-5-pentafluorosulfanylbenzene
JPH06125208A (ja) 1992-10-09 1994-05-06 Mitsubishi Electric Corp マイクロ波集積回路およびその製造方法
US5386002A (en) 1993-12-03 1995-01-31 The Dow Chemical Company Fluorene based bisimides and thermoplastic polymers thereof
US5745984A (en) 1995-07-10 1998-05-05 Martin Marietta Corporation Method for making an electronic module
DE69822918T2 (de) 1997-04-30 2005-03-31 Jsr Corp. Elektronisches Teil und Verfahren zu seiner Herstellung

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05230211A (ja) * 1992-02-19 1993-09-07 Nippon Steel Corp ポリイミド樹脂
WO1997044704A1 (en) * 1996-05-23 1997-11-27 Minnesota Mining And Manufacturing Company Polyimide angularity enhancement layer
JPH10298285A (ja) * 1997-04-30 1998-11-10 Jsr Corp ポリアミック酸およびポリイミド
JPH11116672A (ja) * 1997-10-15 1999-04-27 Jsr Corp フッ素含有ポリイミド樹脂を含む電気絶縁材料およびそれを用いた電子部品
JPH11292968A (ja) * 1998-04-15 1999-10-26 Jsr Corp 電子部品およびその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014118519A (ja) * 2012-12-18 2014-06-30 Kaneka Corp ポリイミド樹脂溶液

Also Published As

Publication number Publication date
AU2001227360A1 (en) 2002-03-04
WO2002016473A1 (en) 2002-02-28
US6392004B1 (en) 2002-05-21
KR20030029829A (ko) 2003-04-16
EP1311586A1 (en) 2003-05-21

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