JP2004507116A5 - - Google Patents

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Publication number
JP2004507116A5
JP2004507116A5 JP2002521566A JP2002521566A JP2004507116A5 JP 2004507116 A5 JP2004507116 A5 JP 2004507116A5 JP 2002521566 A JP2002521566 A JP 2002521566A JP 2002521566 A JP2002521566 A JP 2002521566A JP 2004507116 A5 JP2004507116 A5 JP 2004507116A5
Authority
JP
Japan
Prior art keywords
ghz
polyimide
equilibration
fluorenyl
humidity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002521566A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004507116A (ja
Filing date
Publication date
Priority claimed from US09/642,849 external-priority patent/US6392004B1/en
Application filed filed Critical
Publication of JP2004507116A publication Critical patent/JP2004507116A/ja
Publication of JP2004507116A5 publication Critical patent/JP2004507116A5/ja
Pending legal-status Critical Current

Links

JP2002521566A 2000-08-21 2000-12-21 高周波適用のためのポリイミド Pending JP2004507116A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/642,849 US6392004B1 (en) 2000-08-21 2000-08-21 Polyimides for high-frequency applications
PCT/US2000/035077 WO2002016473A1 (en) 2000-08-21 2000-12-21 Polyimides for high-frequency applications

Publications (2)

Publication Number Publication Date
JP2004507116A JP2004507116A (ja) 2004-03-04
JP2004507116A5 true JP2004507116A5 (enExample) 2008-02-28

Family

ID=24578295

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002521566A Pending JP2004507116A (ja) 2000-08-21 2000-12-21 高周波適用のためのポリイミド

Country Status (6)

Country Link
US (1) US6392004B1 (enExample)
EP (1) EP1311586A1 (enExample)
JP (1) JP2004507116A (enExample)
KR (1) KR20030029829A (enExample)
AU (1) AU2001227360A1 (enExample)
WO (1) WO2002016473A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7147906B2 (en) * 2003-06-24 2006-12-12 General Electric Company Data storage medium comprising polyimides
US7192999B2 (en) * 2003-09-19 2007-03-20 Brewer Science Inc. Polyimides for use as high refractive index, thin film materials
WO2006035918A1 (en) * 2004-09-27 2006-04-06 Fujifilm Corporation Film, method for producing film, and image display device
JP5985977B2 (ja) * 2012-12-18 2016-09-06 株式会社カネカ ポリイミド樹脂溶液
EP3018164B1 (en) * 2013-07-05 2019-03-06 Mitsubishi Gas Chemical Company, Inc. Polyimide resin
CN109796590A (zh) * 2017-11-16 2019-05-24 宁波长阳科技股份有限公司 一种聚酰亚胺树脂和透明聚酰亚胺薄膜
KR102063216B1 (ko) * 2018-07-19 2020-01-07 에스케이씨코오롱피아이 주식회사 실란계 화합물이 결합된 폴리아믹산, 이로부터 제조된 폴리이미드 필름 및 이의 제조 방법
CN121021834A (zh) * 2025-10-29 2025-11-28 中南大学 一种含卤代芴结构聚酰亚胺、电介质膜材料及其制备方法和应用

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2009739A1 (de) 1970-03-03 1971-09-30 Bayer Aromatische Polyimide mit erhöhter Löslichkeit
US4845185A (en) * 1986-04-22 1989-07-04 Nippon Steel Corporation Soluble copolyimide from 9,9-bis (4-amino phenyl) fluorene
US5145937A (en) 1989-11-09 1992-09-08 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Polyimides with carbonyl and ether connecting groups between the aromatic rings
US5145942A (en) 1990-09-28 1992-09-08 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Methyl substituted polyimides containing carbonyl and ether connecting groups
JPH0531341A (ja) * 1991-07-26 1993-02-09 Nippon Steel Corp ポリイミドガス分離膜
US5220070A (en) 1991-09-05 1993-06-15 The United States Of America As Represented By The Administrator National Aeronautics And Space Administration 1,3-diamino-5-pentafluorosulfanylbenzene
JPH05230211A (ja) * 1992-02-19 1993-09-07 Nippon Steel Corp ポリイミド樹脂
JPH06125208A (ja) 1992-10-09 1994-05-06 Mitsubishi Electric Corp マイクロ波集積回路およびその製造方法
US5386002A (en) 1993-12-03 1995-01-31 The Dow Chemical Company Fluorene based bisimides and thermoplastic polymers thereof
US5745984A (en) 1995-07-10 1998-05-05 Martin Marietta Corporation Method for making an electronic module
US5750641A (en) 1996-05-23 1998-05-12 Minnesota Mining And Manufacturing Company Polyimide angularity enhancement layer
JP4045621B2 (ja) * 1997-10-15 2008-02-13 Ｊｓｒ株式会社 フッ素含有ポリイミド樹脂を含む電気絶縁材料およびそれを用いた電子部品
JP3641901B2 (ja) * 1997-04-30 2005-04-27 Ｊｓｒ株式会社 ポリアミック酸およびポリイミド
DE69822918T2 (de) 1997-04-30 2005-03-31 Jsr Corp. Elektronisches Teil und Verfahren zu seiner Herstellung
JP4042201B2 (ja) * 1998-04-15 2008-02-06 Ｊｓｒ株式会社 電子部品およびその製造方法

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