JP2004507116A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2004507116A5 JP2004507116A5 JP2002521566A JP2002521566A JP2004507116A5 JP 2004507116 A5 JP2004507116 A5 JP 2004507116A5 JP 2002521566 A JP2002521566 A JP 2002521566A JP 2002521566 A JP2002521566 A JP 2002521566A JP 2004507116 A5 JP2004507116 A5 JP 2004507116A5
- Authority
- JP
- Japan
- Prior art keywords
- ghz
- polyimide
- equilibration
- fluorenyl
- humidity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920001721 Polyimide Polymers 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 238000011067 equilibration Methods 0.000 description 1
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
Description
【特許請求の範囲】
【請求項1】 21℃の気温で50%の湿度の周囲条件に平衡後に測定したとき、12.8GHzでの誘電損失が0.009以下であるポリイミドを含み、そのポリイミドが375以上のイミド当量を有し、またフルオレニルペンダント基を含む、1〜100GHzの周波数範囲の放射線または電子信号に使用するために実装された電子デバイスの素子。
【請求項1】 21℃の気温で50%の湿度の周囲条件に平衡後に測定したとき、12.8GHzでの誘電損失が0.009以下であるポリイミドを含み、そのポリイミドが375以上のイミド当量を有し、またフルオレニルペンダント基を含む、1〜100GHzの周波数範囲の放射線または電子信号に使用するために実装された電子デバイスの素子。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/642,849 US6392004B1 (en) | 2000-08-21 | 2000-08-21 | Polyimides for high-frequency applications |
PCT/US2000/035077 WO2002016473A1 (en) | 2000-08-21 | 2000-12-21 | Polyimides for high-frequency applications |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2004507116A JP2004507116A (ja) | 2004-03-04 |
JP2004507116A5 true JP2004507116A5 (ja) | 2008-02-28 |
Family
ID=24578295
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002521566A Pending JP2004507116A (ja) | 2000-08-21 | 2000-12-21 | 高周波適用のためのポリイミド |
Country Status (6)
Country | Link |
---|---|
US (1) | US6392004B1 (ja) |
EP (1) | EP1311586A1 (ja) |
JP (1) | JP2004507116A (ja) |
KR (1) | KR20030029829A (ja) |
AU (1) | AU2001227360A1 (ja) |
WO (1) | WO2002016473A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7147906B2 (en) * | 2003-06-24 | 2006-12-12 | General Electric Company | Data storage medium comprising polyimides |
US7192999B2 (en) * | 2003-09-19 | 2007-03-20 | Brewer Science Inc. | Polyimides for use as high refractive index, thin film materials |
WO2006035918A1 (en) * | 2004-09-27 | 2006-04-06 | Fujifilm Corporation | Film, method for producing film, and image display device |
JP5985977B2 (ja) * | 2012-12-18 | 2016-09-06 | 株式会社カネカ | ポリイミド樹脂溶液 |
EP3018164B1 (en) * | 2013-07-05 | 2019-03-06 | Mitsubishi Gas Chemical Company, Inc. | Polyimide resin |
CN109796590A (zh) * | 2017-11-16 | 2019-05-24 | 宁波长阳科技股份有限公司 | 一种聚酰亚胺树脂和透明聚酰亚胺薄膜 |
KR102063216B1 (ko) * | 2018-07-19 | 2020-01-07 | 에스케이씨코오롱피아이 주식회사 | 실란계 화합물이 결합된 폴리아믹산, 이로부터 제조된 폴리이미드 필름 및 이의 제조 방법 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2009739A1 (de) | 1970-03-03 | 1971-09-30 | Bayer | Aromatische Polyimide mit erhöhter Löslichkeit |
US4845185A (en) * | 1986-04-22 | 1989-07-04 | Nippon Steel Corporation | Soluble copolyimide from 9,9-bis (4-amino phenyl) fluorene |
US5145937A (en) | 1989-11-09 | 1992-09-08 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Polyimides with carbonyl and ether connecting groups between the aromatic rings |
US5145942A (en) | 1990-09-28 | 1992-09-08 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Methyl substituted polyimides containing carbonyl and ether connecting groups |
JPH0531341A (ja) * | 1991-07-26 | 1993-02-09 | Nippon Steel Corp | ポリイミドガス分離膜 |
US5220070A (en) | 1991-09-05 | 1993-06-15 | The United States Of America As Represented By The Administrator National Aeronautics And Space Administration | 1,3-diamino-5-pentafluorosulfanylbenzene |
JPH05230211A (ja) * | 1992-02-19 | 1993-09-07 | Nippon Steel Corp | ポリイミド樹脂 |
JPH06125208A (ja) | 1992-10-09 | 1994-05-06 | Mitsubishi Electric Corp | マイクロ波集積回路およびその製造方法 |
US5386002A (en) | 1993-12-03 | 1995-01-31 | The Dow Chemical Company | Fluorene based bisimides and thermoplastic polymers thereof |
US5745984A (en) | 1995-07-10 | 1998-05-05 | Martin Marietta Corporation | Method for making an electronic module |
US5750641A (en) | 1996-05-23 | 1998-05-12 | Minnesota Mining And Manufacturing Company | Polyimide angularity enhancement layer |
JP3641901B2 (ja) * | 1997-04-30 | 2005-04-27 | Jsr株式会社 | ポリアミック酸およびポリイミド |
DE69822918T2 (de) | 1997-04-30 | 2005-03-31 | Jsr Corp. | Elektronisches Teil und Verfahren zu seiner Herstellung |
JP4045621B2 (ja) * | 1997-10-15 | 2008-02-13 | Jsr株式会社 | フッ素含有ポリイミド樹脂を含む電気絶縁材料およびそれを用いた電子部品 |
JP4042201B2 (ja) * | 1998-04-15 | 2008-02-06 | Jsr株式会社 | 電子部品およびその製造方法 |
-
2000
- 2000-08-21 US US09/642,849 patent/US6392004B1/en not_active Expired - Lifetime
- 2000-12-21 AU AU2001227360A patent/AU2001227360A1/en not_active Abandoned
- 2000-12-21 JP JP2002521566A patent/JP2004507116A/ja active Pending
- 2000-12-21 KR KR10-2003-7002460A patent/KR20030029829A/ko not_active Application Discontinuation
- 2000-12-21 EP EP00990316A patent/EP1311586A1/en not_active Withdrawn
- 2000-12-21 WO PCT/US2000/035077 patent/WO2002016473A1/en active Application Filing
Similar Documents
Publication | Publication Date | Title |
---|---|---|
FI20001562A0 (fi) | Antennipiirijärjestely ja testausmenetelmä | |
DE60141060D1 (de) | Siliconzusammensetzung und elektrisch leitfähiger vernetzter Silicongegenstand | |
DE60022458D1 (de) | Halbleitergehäuse, halbleitervorrichtung, elektronikelement und herstellung eines halbleitergehäuses | |
AU3381900A (en) | Parallel testing of integrated circuit devices using cross-dut and within-dut comparisons | |
ATE341107T1 (de) | Hocheffizienzer richtungskoppler | |
WO2001073868A3 (en) | Device enclosures and devices with integrated battery | |
WO2002039540A3 (en) | Multiband, single feed antenna | |
WO2002048701A8 (en) | Nanosensors | |
DE60026331T8 (de) | Leiterplatte, halbleiter und herstellung, test und gehäuse derselben und systemplatte und elektronikgerät | |
ATE526671T1 (de) | Supraleiterkabel | |
JP2004507116A5 (ja) | ||
AU2001251504A1 (en) | Use of aln as copper passivation layer and thermal conductor | |
EP1236756A4 (en) | NEW POLYIMIDE AND THIS CONTAINING CIRCUIT SUBSTRATE | |
GB2432262A (en) | Antenna device and mobile wireless apparatus using the same | |
NO20015606D0 (no) | Substituerte polysykliske aryl- og heteroarylpyridoner som kan anvendes til selektiv inhibering av koagulasjonskaskaden | |
DE59911551D1 (de) | Elektronische Frequenzmesseinrichtung und ihre Verwendung | |
DE60120066D1 (de) | Elektronisches Gerät mit dielektrischer Streifenleiterantenne | |
JP2002110865A5 (ja) | ||
DE60118853D1 (de) | Leitfähiges Bindemittel und Verpackungsstruktur daraus | |
WO2003049012A3 (en) | Packaging solution, particularly for fingerprint sensor | |
GB0202028D0 (en) | Microstrip line resonator element filter high-frequency circuit and electronic device using the same | |
DE60035553D1 (de) | Hochfrequenzschaltungsplatte und seine Verbindungsstruktur | |
TW200711096A (en) | Surge absorbing circuit | |
ATE255777T1 (de) | Isolierender verbinder | |
DE60118118D1 (de) | Elektronische Schaltung, geeignet für Verkleinerung und einfache Ausgangseinstellung |