DE60118853D1 - Leitfähiges Bindemittel und Verpackungsstruktur daraus - Google Patents

Leitfähiges Bindemittel und Verpackungsstruktur daraus

Info

Publication number
DE60118853D1
DE60118853D1 DE60118853T DE60118853T DE60118853D1 DE 60118853 D1 DE60118853 D1 DE 60118853D1 DE 60118853 T DE60118853 T DE 60118853T DE 60118853 T DE60118853 T DE 60118853T DE 60118853 D1 DE60118853 D1 DE 60118853D1
Authority
DE
Germany
Prior art keywords
packaging structure
conductive binder
structure therefrom
therefrom
binder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60118853T
Other languages
English (en)
Other versions
DE60118853T2 (de
Inventor
Hiroaki Takezawa
Takashi Kitae
Yukihiro Ishimaru
Tsutomu Mitani
Tousaku Nishiyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE60118853D1 publication Critical patent/DE60118853D1/de
Publication of DE60118853T2 publication Critical patent/DE60118853T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0272—Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0753—Insulation
    • H05K2201/0769—Anti metal-migration, e.g. avoiding tin whisker growth
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12014—All metal or with adjacent metals having metal particles
    • Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
    • Y10T428/12063—Nonparticulate metal component
    • Y10T428/12069—Plural nonparticulate metal components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12014—All metal or with adjacent metals having metal particles
    • Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
    • Y10T428/12063—Nonparticulate metal component
    • Y10T428/1209—Plural particulate metal components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12014—All metal or with adjacent metals having metal particles
    • Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
    • Y10T428/12063—Nonparticulate metal component
    • Y10T428/12104—Particles discontinuous
    • Y10T428/12111—Separated by nonmetal matrix or binder [e.g., welding electrode, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12014—All metal or with adjacent metals having metal particles
    • Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
    • Y10T428/12063—Nonparticulate metal component
    • Y10T428/12139—Nonmetal particles in particulate component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12528—Semiconductor component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
DE60118853T 2000-08-31 2001-07-06 Leitfähiges Bindemittel und Verpackungsstruktur daraus Expired - Fee Related DE60118853T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000262244 2000-08-31
JP2000262244 2000-08-31

Publications (2)

Publication Number Publication Date
DE60118853D1 true DE60118853D1 (de) 2006-05-24
DE60118853T2 DE60118853T2 (de) 2006-09-21

Family

ID=18749959

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60118853T Expired - Fee Related DE60118853T2 (de) 2000-08-31 2001-07-06 Leitfähiges Bindemittel und Verpackungsstruktur daraus

Country Status (4)

Country Link
US (2) US6524721B2 (de)
EP (1) EP1184880B1 (de)
CN (1) CN1247723C (de)
DE (1) DE60118853T2 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6338809B1 (en) 1997-02-24 2002-01-15 Superior Micropowders Llc Aerosol method and apparatus, particulate products, and electronic devices made therefrom
US20030148024A1 (en) * 2001-10-05 2003-08-07 Kodas Toivo T. Low viscosity precursor compositons and methods for the depositon of conductive electronic features
US7129694B2 (en) 2002-05-23 2006-10-31 Applied Materials, Inc. Large substrate test system
US7136691B2 (en) * 2002-09-04 2006-11-14 3M Innovative Properties Company Biomedical electrodes
AU2003289277A1 (en) * 2002-12-09 2004-06-30 Matsushita Electric Industrial Co., Ltd. Electronic part with external electrode
US7083885B2 (en) * 2003-09-23 2006-08-01 Eastman Kodak Company Transparent invisible conductive grid
US7153620B2 (en) * 2003-09-23 2006-12-26 Eastman Kodak Company Transparent invisible conductive grid
US7255912B2 (en) * 2003-09-23 2007-08-14 Eastman Kodak Company Antistatic conductive grid pattern with integral logo
JP4378239B2 (ja) * 2004-07-29 2009-12-02 株式会社日立製作所 半導体装置及びそれを使用した電力変換装置並びにこの電力変換装置を用いたハイブリッド自動車。
CN100594089C (zh) * 2004-08-25 2010-03-17 松下电器产业株式会社 焊料组合物、利用焊接的连接方法和衬底的生产方法
US20060081819A1 (en) * 2004-10-14 2006-04-20 Yi Li Modified electrically conductive adhesives
US7527749B2 (en) * 2004-10-18 2009-05-05 Georgia Tech Research Corporation Electrically conductive adhesives and methods of making
CA2490676A1 (en) * 2004-12-16 2006-06-16 Ibm Canada Limited - Ibm Canada Limitee Releasably mountable electronics component
KR101289328B1 (ko) * 2006-08-04 2013-07-29 가부시키가이샤 아이.에스.티 도전성 페이스트 및 이것을 이용한 도전성 도막 및 도전성 필름
US7554793B2 (en) * 2006-11-16 2009-06-30 Kemet Electronics Corporation Low temperature curable conductive adhesive and capacitors formed thereby
DE102008034946B4 (de) * 2008-07-26 2016-05-19 Semikron Elektronik Gmbh & Co. Kg Herstellungsverfahren eines Edelmetallverbindungsmittels
DE102008034952B4 (de) * 2008-07-26 2016-05-19 Semikron Elektronik Gmbh & Co. Kg Edelmetallverbindungsmittel und Verwendungsverfahren hierzu
CN102634286B (zh) * 2012-05-17 2013-08-14 深圳市飞世尔实业有限公司 一种光热双重固化型异方性导电膜的制备方法
JP5880300B2 (ja) 2012-06-14 2016-03-08 日立化成株式会社 接着剤組成物及びそれを用いた半導体装置
JP2017031227A (ja) * 2013-12-13 2017-02-09 日立化成株式会社 接着剤組成物及びそれを用いた半導体装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3669611D1 (de) * 1985-11-04 1990-04-19 Gen Electric Verbesserung der leitfaehigkeit von metallische fuellstoffe enthaltenden kunststoffen.
US5005107A (en) * 1988-12-07 1991-04-02 Matsushita Electric Industrial Co., Ltd. Solid electrolytic capacitor
US5376403A (en) * 1990-02-09 1994-12-27 Capote; Miguel A. Electrically conductive compositions and methods for the preparation and use thereof
JPH0581923A (ja) 1991-01-31 1993-04-02 Fukuda Metal Foil & Powder Co Ltd 導電性接着剤
US5867074A (en) * 1994-03-02 1999-02-02 Seiko Epson Corporation Surface acoustic wave resonator, surface acoustic wave resonator unit, surface mounting type surface acoustic wave resonator unit
JP3602864B2 (ja) 1994-03-16 2004-12-15 アルプス電気株式会社 導電性ペースト
US6205657B1 (en) 1996-11-08 2001-03-27 Matsushita Electric Industrial Co., Ltd. Printed circuit board and method for producing the same
JP3155733B2 (ja) 1996-11-08 2001-04-16 松下電器産業株式会社 プリント配線基板とその製造方法
JPH1154880A (ja) 1997-08-05 1999-02-26 Fujitsu Ten Ltd 電子部品の構造及び電子部品の実装構造
JP2000022023A (ja) 1998-07-01 2000-01-21 Matsushita Electric Ind Co Ltd 接続構造体とその製造方法、及び実装構造体
JP3669180B2 (ja) 1998-10-22 2005-07-06 株式会社スリーボンド 接続抵抗値を改善する導電性組成物
US6344157B1 (en) * 1999-02-12 2002-02-05 National Starch And Chemical Investment Holding Corporation Conductive and resistive materials with electrical stability for use in electronics devices

Also Published As

Publication number Publication date
EP1184880B1 (de) 2006-04-19
EP1184880A3 (de) 2003-12-17
US6524721B2 (en) 2003-02-25
CN1340584A (zh) 2002-03-20
DE60118853T2 (de) 2006-09-21
US20020043652A1 (en) 2002-04-18
US20030116756A1 (en) 2003-06-26
EP1184880A2 (de) 2002-03-06
US6666994B2 (en) 2003-12-23
CN1247723C (zh) 2006-03-29

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP

8339 Ceased/non-payment of the annual fee