DE60137387D1 - Verbindungsstruktur - Google Patents

Verbindungsstruktur

Info

Publication number
DE60137387D1
DE60137387D1 DE60137387T DE60137387T DE60137387D1 DE 60137387 D1 DE60137387 D1 DE 60137387D1 DE 60137387 T DE60137387 T DE 60137387T DE 60137387 T DE60137387 T DE 60137387T DE 60137387 D1 DE60137387 D1 DE 60137387D1
Authority
DE
Germany
Prior art keywords
connecting structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60137387T
Other languages
English (en)
Inventor
Yoshinori Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissan Motor Co Ltd
Original Assignee
Nissan Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Motor Co Ltd filed Critical Nissan Motor Co Ltd
Application granted granted Critical
Publication of DE60137387D1 publication Critical patent/DE60137387D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0776—Resistance and impedance
    • H05K2201/0792—Means against parasitic impedance; Means against eddy currents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1028—Thin metal strips as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10818—Flat leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10893—Grouped leads, i.e. element comprising multiple leads distributed around but not through a common insulator
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
DE60137387T 2000-09-19 2001-09-17 Verbindungsstruktur Expired - Lifetime DE60137387D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000282945A JP3826696B2 (ja) 2000-09-19 2000-09-19 配線構造

Publications (1)

Publication Number Publication Date
DE60137387D1 true DE60137387D1 (de) 2009-03-05

Family

ID=18767370

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60137387T Expired - Lifetime DE60137387D1 (de) 2000-09-19 2001-09-17 Verbindungsstruktur

Country Status (4)

Country Link
US (1) US6641407B2 (de)
EP (2) EP1643596A2 (de)
JP (1) JP3826696B2 (de)
DE (1) DE60137387D1 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7631242B2 (en) 2001-06-22 2009-12-08 Broadcom Corporation System, method and computer program product for mitigating burst noise in a communications system
DE10336634B3 (de) * 2003-08-08 2005-02-03 Siemens Ag Elektronisches Gerät
WO2005119765A2 (en) * 2004-06-02 2005-12-15 Tessera, Inc. Assembly including vertical and horizontal joined circuit panels
US7658621B2 (en) * 2008-04-17 2010-02-09 Hon Hai Precision Ind. Co., Ltd. Connector assembly having connecting device
AT506929B1 (de) * 2008-04-29 2012-10-15 Siemens Ag Anordnung zweier schaltungsträger
US20100254109A1 (en) 2009-03-19 2010-10-07 Olympus Corporation Mount assembly and method for manufacturing mount assembly
DE102009017621B3 (de) * 2009-04-16 2010-08-19 Semikron Elektronik Gmbh & Co. Kg Vorrichtung zur Verringerung der Störabstrahlung in einem leistungselektronischen System
JP5097791B2 (ja) * 2010-04-05 2012-12-12 株式会社日立産機システム 電力変換装置
GB2484742B (en) * 2010-10-22 2013-06-12 Murata Power Solutions Milton Keynes Ltd Electronic component for surface mounting
US20140151860A1 (en) * 2012-02-15 2014-06-05 Panasonic Corporation Wireless module
JP5946339B2 (ja) * 2012-06-27 2016-07-06 双信電機株式会社 ノイズフィルタ
KR102034717B1 (ko) * 2013-02-07 2019-10-21 삼성전자주식회사 파워모듈용 기판, 파워모듈용 터미널 및 이들을 포함하는 파워모듈
US9837380B2 (en) 2014-01-28 2017-12-05 Infineon Technologies Austria Ag Semiconductor device having multiple contact clips
US9468103B2 (en) * 2014-10-08 2016-10-11 Raytheon Company Interconnect transition apparatus
JP2016092024A (ja) * 2014-10-29 2016-05-23 株式会社豊田自動織機 電子機器
US9660333B2 (en) 2014-12-22 2017-05-23 Raytheon Company Radiator, solderless interconnect thereof and grounding element thereof
US9780458B2 (en) 2015-10-13 2017-10-03 Raytheon Company Methods and apparatus for antenna having dual polarized radiating elements with enhanced heat dissipation
US10361485B2 (en) 2017-08-04 2019-07-23 Raytheon Company Tripole current loop radiating element with integrated circularly polarized feed
US10923830B2 (en) * 2019-01-18 2021-02-16 Pc-Tel, Inc. Quick solder chip connector for massive multiple-input multiple-output antenna systems
TW202142517A (zh) * 2020-05-12 2021-11-16 台灣愛司帝科技股份有限公司 基板拼接結構、基板拼接系統以及基板拼接方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4878862A (en) * 1988-12-05 1989-11-07 Amp Incorporated Connector for mating two bus bars
US5037311A (en) * 1989-05-05 1991-08-06 International Business Machines Corporation High density interconnect strip
FR2753310B1 (fr) * 1996-09-12 1998-12-31 Gandois Jean Marie Dispositif d'alimentation electrique par plinthe sans pose de cables
US5825633A (en) * 1996-11-05 1998-10-20 Motorola, Inc. Multi-board electronic assembly including spacer for multiple electrical interconnections
GB9713849D0 (en) * 1997-06-30 1997-09-03 Amp Italia Capacitance coupled cross-talk suppressing communication connector
DE29805943U1 (de) * 1998-03-26 1998-06-10 Abb Daimler Benz Transp Niederinduktive Verschienung zweier mehrlagiger Stromschienenanordnungen für Stromrichter
US6468090B2 (en) * 1999-09-15 2002-10-22 Fci Americas Technology, Inc. Low inductance power connector and method of reducing inductance in an electrical connector

Also Published As

Publication number Publication date
JP2002094209A (ja) 2002-03-29
JP3826696B2 (ja) 2006-09-27
EP1191635A2 (de) 2002-03-27
EP1191635B1 (de) 2009-01-14
US20020037656A1 (en) 2002-03-28
US6641407B2 (en) 2003-11-04
EP1191635A3 (de) 2003-10-15
EP1643596A2 (de) 2006-04-05

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Legal Events

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8364 No opposition during term of opposition