WO2003049012A3 - Packaging solution, particularly for fingerprint sensor - Google Patents

Packaging solution, particularly for fingerprint sensor Download PDF

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Publication number
WO2003049012A3
WO2003049012A3 PCT/NO2002/000467 NO0200467W WO03049012A3 WO 2003049012 A3 WO2003049012 A3 WO 2003049012A3 NO 0200467 W NO0200467 W NO 0200467W WO 03049012 A3 WO03049012 A3 WO 03049012A3
Authority
WO
WIPO (PCT)
Prior art keywords
electrodes
fingerprint sensor
conductive surface
packaging solution
conductors
Prior art date
Application number
PCT/NO2002/000467
Other languages
French (fr)
Other versions
WO2003049012A2 (en
Inventor
Jon Nysaether
Original Assignee
Idex Asa
Jon Nysaether
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Idex Asa, Jon Nysaether filed Critical Idex Asa
Priority to AU2002364494A priority Critical patent/AU2002364494A1/en
Publication of WO2003049012A2 publication Critical patent/WO2003049012A2/en
Publication of WO2003049012A3 publication Critical patent/WO2003049012A3/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Abstract

Sensor device for performing measurements on an at least partially conductive surface comprising electronic circuitry having a number of interogation electrodes for measuring impedance between the electrodes and a power supply, the device having an outer surface for contact with the at least partially conductive surface comprising a number of outer conductors stretching from the outer surface having an outer an an inner end, said outer ends being adapted to electrical coupling to the conductive surface and said inner ends of said outer conductors being coupled to the interrogation electrodes through a shunt impedance, said outer conductors being mutually separated by an insulating material.
PCT/NO2002/000467 2001-12-07 2002-12-06 Packaging solution, particularly for fingerprint sensor WO2003049012A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2002364494A AU2002364494A1 (en) 2001-12-07 2002-12-06 Packaging solution, particularly for fingerprint sensor

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NO20016008 2001-12-07
NO20016008A NO316776B1 (en) 2001-12-07 2001-12-07 Package solution for fingerprint sensor

Publications (2)

Publication Number Publication Date
WO2003049012A2 WO2003049012A2 (en) 2003-06-12
WO2003049012A3 true WO2003049012A3 (en) 2003-10-02

Family

ID=19913126

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/NO2002/000467 WO2003049012A2 (en) 2001-12-07 2002-12-06 Packaging solution, particularly for fingerprint sensor

Country Status (3)

Country Link
AU (1) AU2002364494A1 (en)
NO (1) NO316776B1 (en)
WO (1) WO2003049012A2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8866347B2 (en) 2010-01-15 2014-10-21 Idex Asa Biometric image sensing
US9600704B2 (en) 2010-01-15 2017-03-21 Idex Asa Electronic imager using an impedance sensor grid array and method of making

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7697729B2 (en) 2004-01-29 2010-04-13 Authentec, Inc. System for and method of finger initiated actions
US7831070B1 (en) 2005-02-18 2010-11-09 Authentec, Inc. Dynamic finger detection mechanism for a fingerprint sensor
US8231056B2 (en) 2005-04-08 2012-07-31 Authentec, Inc. System for and method of protecting an integrated circuit from over currents
NO20083766L (en) * 2008-09-01 2010-03-02 Idex Asa surface Sensor
NO20093601A1 (en) 2009-12-29 2011-06-30 Idex Asa surface Sensor
EP2958053A1 (en) 2012-04-10 2015-12-23 Idex Asa Biometric sensing
NO20131423A1 (en) 2013-02-22 2014-08-25 Idex Asa Integrated fingerprint sensor
NO336318B1 (en) 2013-07-12 2015-08-03 Idex Asa surface Sensor
CN106575351B (en) 2014-02-21 2019-12-13 傲迪司威生物识别公司 Sensor employing overlapping grid lines and conductive probes for extending a sensing surface from the grid lines
US9342727B2 (en) 2014-03-04 2016-05-17 Apple Inc. Field shaping channels in a substrate above a biometric sensing device
US9779280B2 (en) 2014-12-24 2017-10-03 Idex Asa Fingerprint sensor employing an integrated noise rejection structure
US11610429B2 (en) 2016-12-15 2023-03-21 Fingerprint Cards Anacatum Ip Ab Fingerprint sensing module and method for manufacturing the fingerprint sensing module
US11023702B2 (en) 2016-12-15 2021-06-01 Fingerprint Cards Ab Fingerprint sensing module and method for manufacturing the fingerprint sensing module
US10395164B2 (en) * 2016-12-15 2019-08-27 Fingerprint Cards Ab Fingerprint sensing module and method for manufacturing the fingerprint sensing module
WO2019058259A1 (en) 2017-09-19 2019-03-28 Idex Asa Double sided sensor module suitable for integration into electronic devices
EP3543897A1 (en) * 2018-03-19 2019-09-25 Nxp B.V. Fingerprint sensing device
WO2022047760A1 (en) * 2020-09-06 2022-03-10 深圳市汇顶科技股份有限公司 Capacitive fingerprint identification apparatus, preparation method, and electronic device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0789334A2 (en) * 1996-01-26 1997-08-13 Harris Corporation Integrated circuit device having an opening exposing the integrated circuit die and related methods
WO1998058342A1 (en) * 1997-06-16 1998-12-23 Sintef Method and apparatus for measuring structures in a fingerprint
US6069970A (en) * 1997-05-16 2000-05-30 Authentec, Inc. Fingerprint sensor and token reader and associated methods
US20010025532A1 (en) * 1999-12-30 2001-10-04 Alan Kramer Enhanced fingerprint detection

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0789334A2 (en) * 1996-01-26 1997-08-13 Harris Corporation Integrated circuit device having an opening exposing the integrated circuit die and related methods
US6069970A (en) * 1997-05-16 2000-05-30 Authentec, Inc. Fingerprint sensor and token reader and associated methods
WO1998058342A1 (en) * 1997-06-16 1998-12-23 Sintef Method and apparatus for measuring structures in a fingerprint
US20010025532A1 (en) * 1999-12-30 2001-10-04 Alan Kramer Enhanced fingerprint detection

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8866347B2 (en) 2010-01-15 2014-10-21 Idex Asa Biometric image sensing
US9268988B2 (en) 2010-01-15 2016-02-23 Idex Asa Biometric image sensing
US9600704B2 (en) 2010-01-15 2017-03-21 Idex Asa Electronic imager using an impedance sensor grid array and method of making

Also Published As

Publication number Publication date
NO20016008D0 (en) 2001-12-07
NO316776B1 (en) 2004-05-03
WO2003049012A2 (en) 2003-06-12
AU2002364494A8 (en) 2003-06-17
NO20016008L (en) 2003-06-10
AU2002364494A1 (en) 2003-06-17

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