JP2004507077A5 - - Google Patents

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Publication number
JP2004507077A5
JP2004507077A5 JP2001587969A JP2001587969A JP2004507077A5 JP 2004507077 A5 JP2004507077 A5 JP 2004507077A5 JP 2001587969 A JP2001587969 A JP 2001587969A JP 2001587969 A JP2001587969 A JP 2001587969A JP 2004507077 A5 JP2004507077 A5 JP 2004507077A5
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JP
Japan
Prior art keywords
groove
polishing
wafer
groove pattern
polishing pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001587969A
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English (en)
Japanese (ja)
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JP4959901B2 (ja
JP2004507077A (ja
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Publication date
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Priority claimed from PCT/US2001/016870 external-priority patent/WO2001091972A1/en
Publication of JP2004507077A publication Critical patent/JP2004507077A/ja
Publication of JP2004507077A5 publication Critical patent/JP2004507077A5/ja
Application granted granted Critical
Publication of JP4959901B2 publication Critical patent/JP4959901B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2001587969A 2000-05-27 2001-05-24 化学機械平坦化用溝付き研磨パッド Expired - Lifetime JP4959901B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US20793800P 2000-05-27 2000-05-27
US60/207,938 2000-05-27
US22209900P 2000-07-28 2000-07-28
US60/222,099 2000-07-28
PCT/US2001/016870 WO2001091972A1 (en) 2000-05-27 2001-05-24 Grooved polishing pads for chemical mechanical planarization

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011199659A Division JP5584666B2 (ja) 2000-05-27 2011-09-13 化学機械平坦化用溝付き研磨パッド

Publications (3)

Publication Number Publication Date
JP2004507077A JP2004507077A (ja) 2004-03-04
JP2004507077A5 true JP2004507077A5 (enExample) 2008-07-10
JP4959901B2 JP4959901B2 (ja) 2012-06-27

Family

ID=26902748

Family Applications (12)

Application Number Title Priority Date Filing Date
JP2001587968A Expired - Lifetime JP4615813B2 (ja) 2000-05-27 2001-05-24 化学機械平坦化用の研磨パッド
JP2001587969A Expired - Lifetime JP4959901B2 (ja) 2000-05-27 2001-05-24 化学機械平坦化用溝付き研磨パッド
JP2008245811A Expired - Lifetime JP5016576B2 (ja) 2000-05-27 2008-09-25 化学機械平坦化用の研磨パッド
JP2011199659A Expired - Lifetime JP5584666B2 (ja) 2000-05-27 2011-09-13 化学機械平坦化用溝付き研磨パッド
JP2012020977A Expired - Lifetime JP5544381B2 (ja) 2000-05-27 2012-02-02 化学機械平坦化用の研磨パッド
JP2013156497A Expired - Lifetime JP5767280B2 (ja) 2000-05-27 2013-07-29 化学機械平坦化用溝付き研磨パッド
JP2013235414A Expired - Lifetime JP5993360B2 (ja) 2000-05-27 2013-11-13 化学機械平坦化用の研磨パッド
JP2014264802A Pending JP2015092610A (ja) 2000-05-27 2014-12-26 化学機械平坦化用溝付き研磨パッド
JP2015121009A Expired - Lifetime JP6141359B2 (ja) 2000-05-27 2015-06-16 化学機械平坦化用の研磨パッド
JP2016217133A Expired - Lifetime JP6375352B2 (ja) 2000-05-27 2016-11-07 化学機械平坦化用の研磨パッド
JP2018058015A Pending JP2018117150A (ja) 2000-05-27 2018-03-26 化学機械平坦化用の研磨パッド
JP2018104803A Expired - Lifetime JP6655848B2 (ja) 2000-05-27 2018-05-31 化学機械平坦化用の研磨パッド

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2001587968A Expired - Lifetime JP4615813B2 (ja) 2000-05-27 2001-05-24 化学機械平坦化用の研磨パッド

Family Applications After (10)

Application Number Title Priority Date Filing Date
JP2008245811A Expired - Lifetime JP5016576B2 (ja) 2000-05-27 2008-09-25 化学機械平坦化用の研磨パッド
JP2011199659A Expired - Lifetime JP5584666B2 (ja) 2000-05-27 2011-09-13 化学機械平坦化用溝付き研磨パッド
JP2012020977A Expired - Lifetime JP5544381B2 (ja) 2000-05-27 2012-02-02 化学機械平坦化用の研磨パッド
JP2013156497A Expired - Lifetime JP5767280B2 (ja) 2000-05-27 2013-07-29 化学機械平坦化用溝付き研磨パッド
JP2013235414A Expired - Lifetime JP5993360B2 (ja) 2000-05-27 2013-11-13 化学機械平坦化用の研磨パッド
JP2014264802A Pending JP2015092610A (ja) 2000-05-27 2014-12-26 化学機械平坦化用溝付き研磨パッド
JP2015121009A Expired - Lifetime JP6141359B2 (ja) 2000-05-27 2015-06-16 化学機械平坦化用の研磨パッド
JP2016217133A Expired - Lifetime JP6375352B2 (ja) 2000-05-27 2016-11-07 化学機械平坦化用の研磨パッド
JP2018058015A Pending JP2018117150A (ja) 2000-05-27 2018-03-26 化学機械平坦化用の研磨パッド
JP2018104803A Expired - Lifetime JP6655848B2 (ja) 2000-05-27 2018-05-31 化学機械平坦化用の研磨パッド

Country Status (6)

Country Link
EP (2) EP1284842B1 (enExample)
JP (12) JP4615813B2 (enExample)
KR (2) KR100770852B1 (enExample)
DE (2) DE60114183T2 (enExample)
TW (2) TW528646B (enExample)
WO (2) WO2001091972A1 (enExample)

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JPWO2013153880A1 (ja) * 2012-04-10 2015-12-17 旭硝子株式会社 ガラス基板の研磨方法
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JP6513455B2 (ja) * 2015-04-03 2019-05-15 富士紡ホールディングス株式会社 研磨パッド
JP2016196067A (ja) * 2015-04-03 2016-11-24 富士紡ホールディングス株式会社 研磨パッド
JP6600149B2 (ja) * 2015-04-03 2019-10-30 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
US10086494B2 (en) * 2016-09-13 2018-10-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High planarization efficiency chemical mechanical polishing pads and methods of making
US10786885B2 (en) * 2017-01-20 2020-09-29 Applied Materials, Inc. Thin plastic polishing article for CMP applications
JP6981467B2 (ja) 2017-03-28 2021-12-15 Ａｇｃ株式会社 積層体、印刷物およびその製造方法
JP6968651B2 (ja) 2017-10-12 2021-11-17 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
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JP7141230B2 (ja) * 2018-03-30 2022-09-22 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
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JP7759179B2 (ja) 2020-09-30 2025-10-23 富士紡ホールディングス株式会社 研磨パッド
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