JP2004507077A5 - - Google Patents

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Publication number
JP2004507077A5
JP2004507077A5 JP2001587969A JP2001587969A JP2004507077A5 JP 2004507077 A5 JP2004507077 A5 JP 2004507077A5 JP 2001587969 A JP2001587969 A JP 2001587969A JP 2001587969 A JP2001587969 A JP 2001587969A JP 2004507077 A5 JP2004507077 A5 JP 2004507077A5
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JP
Japan
Prior art keywords
groove
polishing
wafer
groove pattern
polishing pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001587969A
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English (en)
Japanese (ja)
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JP2004507077A (ja
JP4959901B2 (ja
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Publication date
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Priority claimed from PCT/US2001/016870 external-priority patent/WO2001091972A1/en
Publication of JP2004507077A publication Critical patent/JP2004507077A/ja
Publication of JP2004507077A5 publication Critical patent/JP2004507077A5/ja
Application granted granted Critical
Publication of JP4959901B2 publication Critical patent/JP4959901B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2001587969A 2000-05-27 2001-05-24 化学機械平坦化用溝付き研磨パッド Expired - Lifetime JP4959901B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US20793800P 2000-05-27 2000-05-27
US60/207,938 2000-05-27
US22209900P 2000-07-28 2000-07-28
US60/222,099 2000-07-28
PCT/US2001/016870 WO2001091972A1 (en) 2000-05-27 2001-05-24 Grooved polishing pads for chemical mechanical planarization

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011199659A Division JP5584666B2 (ja) 2000-05-27 2011-09-13 化学機械平坦化用溝付き研磨パッド

Publications (3)

Publication Number Publication Date
JP2004507077A JP2004507077A (ja) 2004-03-04
JP2004507077A5 true JP2004507077A5 (enExample) 2008-07-10
JP4959901B2 JP4959901B2 (ja) 2012-06-27

Family

ID=26902748

Family Applications (12)

Application Number Title Priority Date Filing Date
JP2001587969A Expired - Lifetime JP4959901B2 (ja) 2000-05-27 2001-05-24 化学機械平坦化用溝付き研磨パッド
JP2001587968A Expired - Lifetime JP4615813B2 (ja) 2000-05-27 2001-05-24 化学機械平坦化用の研磨パッド
JP2008245811A Expired - Lifetime JP5016576B2 (ja) 2000-05-27 2008-09-25 化学機械平坦化用の研磨パッド
JP2011199659A Expired - Lifetime JP5584666B2 (ja) 2000-05-27 2011-09-13 化学機械平坦化用溝付き研磨パッド
JP2012020977A Expired - Lifetime JP5544381B2 (ja) 2000-05-27 2012-02-02 化学機械平坦化用の研磨パッド
JP2013156497A Expired - Lifetime JP5767280B2 (ja) 2000-05-27 2013-07-29 化学機械平坦化用溝付き研磨パッド
JP2013235414A Expired - Lifetime JP5993360B2 (ja) 2000-05-27 2013-11-13 化学機械平坦化用の研磨パッド
JP2014264802A Pending JP2015092610A (ja) 2000-05-27 2014-12-26 化学機械平坦化用溝付き研磨パッド
JP2015121009A Expired - Lifetime JP6141359B2 (ja) 2000-05-27 2015-06-16 化学機械平坦化用の研磨パッド
JP2016217133A Expired - Lifetime JP6375352B2 (ja) 2000-05-27 2016-11-07 化学機械平坦化用の研磨パッド
JP2018058015A Pending JP2018117150A (ja) 2000-05-27 2018-03-26 化学機械平坦化用の研磨パッド
JP2018104803A Expired - Lifetime JP6655848B2 (ja) 2000-05-27 2018-05-31 化学機械平坦化用の研磨パッド

Family Applications After (11)

Application Number Title Priority Date Filing Date
JP2001587968A Expired - Lifetime JP4615813B2 (ja) 2000-05-27 2001-05-24 化学機械平坦化用の研磨パッド
JP2008245811A Expired - Lifetime JP5016576B2 (ja) 2000-05-27 2008-09-25 化学機械平坦化用の研磨パッド
JP2011199659A Expired - Lifetime JP5584666B2 (ja) 2000-05-27 2011-09-13 化学機械平坦化用溝付き研磨パッド
JP2012020977A Expired - Lifetime JP5544381B2 (ja) 2000-05-27 2012-02-02 化学機械平坦化用の研磨パッド
JP2013156497A Expired - Lifetime JP5767280B2 (ja) 2000-05-27 2013-07-29 化学機械平坦化用溝付き研磨パッド
JP2013235414A Expired - Lifetime JP5993360B2 (ja) 2000-05-27 2013-11-13 化学機械平坦化用の研磨パッド
JP2014264802A Pending JP2015092610A (ja) 2000-05-27 2014-12-26 化学機械平坦化用溝付き研磨パッド
JP2015121009A Expired - Lifetime JP6141359B2 (ja) 2000-05-27 2015-06-16 化学機械平坦化用の研磨パッド
JP2016217133A Expired - Lifetime JP6375352B2 (ja) 2000-05-27 2016-11-07 化学機械平坦化用の研磨パッド
JP2018058015A Pending JP2018117150A (ja) 2000-05-27 2018-03-26 化学機械平坦化用の研磨パッド
JP2018104803A Expired - Lifetime JP6655848B2 (ja) 2000-05-27 2018-05-31 化学機械平坦化用の研磨パッド

Country Status (6)

Country Link
EP (2) EP1284841B1 (enExample)
JP (12) JP4959901B2 (enExample)
KR (2) KR100770852B1 (enExample)
DE (2) DE60114183T2 (enExample)
TW (2) TW528646B (enExample)
WO (2) WO2001091971A1 (enExample)

Families Citing this family (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3097658B2 (ja) 1998-05-21 2000-10-10 松下電器産業株式会社 洗濯機
JP4959901B2 (ja) * 2000-05-27 2012-06-27 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド 化学機械平坦化用溝付き研磨パッド
US6838149B2 (en) * 2001-12-13 2005-01-04 3M Innovative Properties Company Abrasive article for the deposition and polishing of a conductive material
US20050276967A1 (en) * 2002-05-23 2005-12-15 Cabot Microelectronics Corporation Surface textured microporous polishing pads
US20040014413A1 (en) * 2002-06-03 2004-01-22 Jsr Corporation Polishing pad and multi-layer polishing pad
KR100666726B1 (ko) * 2002-12-28 2007-01-09 에스케이씨 주식회사 Cmp 공정용 컨디셔너 및 이들을 이용한 연마 방법
JP3910921B2 (ja) * 2003-02-06 2007-04-25 株式会社東芝 研磨布および半導体装置の製造方法
US7238097B2 (en) 2003-04-11 2007-07-03 Nihon Microcoating Co., Ltd. Polishing pad and method of producing same
SG111222A1 (en) * 2003-10-09 2005-05-30 Rohm & Haas Elect Mat Polishing pad
US7074115B2 (en) 2003-10-09 2006-07-11 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad
JP4606730B2 (ja) * 2003-12-11 2011-01-05 東洋ゴム工業株式会社 研磨パッドおよびその製造方法
US20050171224A1 (en) * 2004-02-03 2005-08-04 Kulp Mary J. Polyurethane polishing pad
JP2006114885A (ja) * 2004-09-17 2006-04-27 Jsr Corp 化学機械研磨パッド及び化学機械研磨方法
TWI385050B (zh) * 2005-02-18 2013-02-11 Nexplanar Corp 用於ｃｍｐ之特製拋光墊及其製造方法及其用途
JP2006231429A (ja) * 2005-02-22 2006-09-07 Inoac Corp 研磨パッドおよびその製造方法
KR20070070094A (ko) 2005-12-28 2007-07-03 제이에스알 가부시끼가이샤 화학 기계 연마 패드 및 화학 기계 연마 방법
US7789738B2 (en) 2006-07-03 2010-09-07 San Fang Chemical Industry Co., Ltd. Sheet for mounting polishing workpiece and method for making the same
US7316605B1 (en) 2006-07-03 2008-01-08 San Fang Chemical Industry Co., Ltd. Sheet for mounting polishing workpiece and method for making the same
KR101146966B1 (ko) 2007-02-01 2012-05-23 가부시키가이샤 구라레 연마 패드 및 연마 패드의 제조 방법
JP5415700B2 (ja) * 2007-02-01 2014-02-12 株式会社クラレ 研磨パッド及び研磨パッドの製造方法
JP2008258574A (ja) * 2007-03-14 2008-10-23 Jsr Corp 化学機械研磨パッドおよび化学機械研磨方法
US8491360B2 (en) * 2007-10-26 2013-07-23 Innopad, Inc. Three-dimensional network in CMP pad
JP5393434B2 (ja) 2008-12-26 2014-01-22 東洋ゴム工業株式会社 研磨パッド及びその製造方法
JP2009148891A (ja) * 2009-04-02 2009-07-09 Nitta Haas Inc 研磨パッド
CN102498549A (zh) * 2009-07-16 2012-06-13 嘉柏微电子材料股份公司 沟槽式化学机械抛光抛光垫
US8222145B2 (en) * 2009-09-24 2012-07-17 Dupont Air Products Nanomaterials, Llc Method and composition for chemical mechanical planarization of a metal-containing substrate
JP5426469B2 (ja) 2010-05-10 2014-02-26 東洋ゴム工業株式会社 研磨パッドおよびガラス基板の製造方法
CN104093525A (zh) * 2012-04-10 2014-10-08 旭硝子株式会社 玻璃基板的研磨方法
US9067299B2 (en) 2012-04-25 2015-06-30 Applied Materials, Inc. Printed chemical mechanical polishing pad
US9597769B2 (en) * 2012-06-04 2017-03-21 Nexplanar Corporation Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer
JP6196858B2 (ja) * 2012-09-24 2017-09-13 株式会社荏原製作所 研磨方法および研磨装置
JP5836992B2 (ja) 2013-03-19 2015-12-24 株式会社東芝 半導体装置の製造方法
US20140370788A1 (en) * 2013-06-13 2014-12-18 Cabot Microelectronics Corporation Low surface roughness polishing pad
TWI599447B (zh) 2013-10-18 2017-09-21 卡博特微電子公司 具有偏移同心溝槽圖樣之邊緣排除區的ｃｍｐ拋光墊
SG11201608219WA (en) * 2014-04-03 2016-10-28 3M Innovative Properties Co Polishing pads and systems and methods of making and using the same
US9731398B2 (en) 2014-08-22 2017-08-15 Rohm And Haas Electronic Materials Cmp Holding, Inc. Polyurethane polishing pad
JP6600149B2 (ja) * 2015-04-03 2019-10-30 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
JP2016196067A (ja) * 2015-04-03 2016-11-24 富士紡ホールディングス株式会社 研磨パッド
JP6513455B2 (ja) * 2015-04-03 2019-05-15 富士紡ホールディングス株式会社 研磨パッド
TWI669360B (zh) * 2015-04-03 2019-08-21 日商富士紡控股股份有限公司 Abrasive pad
US10086494B2 (en) * 2016-09-13 2018-10-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High planarization efficiency chemical mechanical polishing pads and methods of making
TWI757410B (zh) * 2017-01-20 2022-03-11 美商應用材料股份有限公司 用於cmp應用的薄的塑膠拋光用具
EP3603968B1 (en) 2017-03-28 2023-09-13 AGC Inc. Use of a laminate in inkjet printing, printed matter and method for manufacturing same
JP6968651B2 (ja) * 2017-10-12 2021-11-17 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
JP7349774B2 (ja) * 2018-03-09 2023-09-25 富士紡ホールディングス株式会社 研磨パッド、研磨パッドの製造方法、被研磨物の表面を研磨する方法、被研磨物の表面を研磨する際のスクラッチを低減する方法
JP7141230B2 (ja) 2018-03-30 2022-09-22 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
JP7141283B2 (ja) * 2018-09-06 2022-09-22 富士紡ホールディングス株式会社 研磨パッド、研磨パッドの製造方法、及び被研磨物の表面を研磨する方法
US20210347006A1 (en) 2018-09-28 2021-11-11 Fujibo Holdings, Inc. Polishing pad and method for producing polished product
JP7384608B2 (ja) * 2018-09-28 2023-11-21 富士紡ホールディングス株式会社 研磨パッド及び研磨加工物の製造方法
KR102674027B1 (ko) * 2019-01-29 2024-06-12 삼성전자주식회사 재생 연마패드
KR102345784B1 (ko) * 2019-07-10 2022-01-03 에프엔에스테크 주식회사 웨이퍼 후면 연마용 고경도 연마패드
EP3996870A4 (en) * 2019-07-12 2023-08-02 CMC Materials, Inc. POLISHING PAD WITH POLYAMINE AND CYCLOHEXANDIMETHANOL CURING AGENTS
WO2022071205A1 (ja) 2020-09-30 2022-04-07 富士紡ホールディングス株式会社 研磨パッド、及び研磨加工物の製造方法
JP7759179B2 (ja) * 2020-09-30 2025-10-23 富士紡ホールディングス株式会社 研磨パッド
KR102488115B1 (ko) * 2020-11-06 2023-01-12 에스케이엔펄스 주식회사 연마 패드, 연마 패드의 제조 방법 및 이를 이용한 반도체 소자의 제조 방법
CN112480639B (zh) * 2020-12-09 2023-03-24 金旸（厦门）新材料科技有限公司 一种高效超韧导电pc材料及其制备方法
KR102561824B1 (ko) * 2021-06-02 2023-07-31 에스케이엔펄스 주식회사 연마패드 및 이를 이용한 반도체 소자의 제조방법

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3403498A1 (de) * 1984-02-02 1985-08-08 Bayer Ag, 5090 Leverkusen Verfahren zur herstellung von polyharnstoff-elastomeren und entsprechende elastomere idealisierten segmentaufbaus
JPS6128573A (ja) * 1984-07-18 1986-02-08 Mitsubishi Mining & Cement Co Ltd 研磨パツド及びその製造方法
US4568611A (en) * 1985-04-03 1986-02-04 Morton Thiokol, Inc. Polyester-polyurethane composition and use thereof
US5271964A (en) * 1991-06-26 1993-12-21 Minnesota Mining And Manufacturing Company Process for manufacturing abrasive tape
US5216843A (en) * 1992-09-24 1993-06-08 Intel Corporation Polishing pad conditioning apparatus for wafer planarization process
US5446085A (en) * 1993-06-15 1995-08-29 International Business Machines Corporation Polymeric compositions containing inorganic fillers and use thereof
JPH07138340A (ja) * 1993-11-15 1995-05-30 Epozoole:Kk 耐熱性の熱可塑性ポリウレタンエラストマー及びその製造法
US5580647A (en) * 1993-12-20 1996-12-03 Minnesota Mining And Manufacturing Company Abrasive articles incorporating addition polymerizable resins and reactive diluents
US5489233A (en) * 1994-04-08 1996-02-06 Rodel, Inc. Polishing pads and methods for their use
US6017265A (en) * 1995-06-07 2000-01-25 Rodel, Inc. Methods for using polishing pads
JP3100905B2 (ja) * 1995-08-24 2000-10-23 松下電器産業株式会社 半導体基板の研磨方法及びその装置
JP3552845B2 (ja) * 1996-04-25 2004-08-11 株式会社ルネサステクノロジ 半導体装置の製造方法
US5692950A (en) * 1996-08-08 1997-12-02 Minnesota Mining And Manufacturing Company Abrasive construction for semiconductor wafer modification
EP0984846B1 (en) * 1997-01-13 2004-11-24 Rodel, Inc. Method of manufacturing a polymeric polishing pad having photolithographically induced surface pattern
JPH10217112A (ja) * 1997-02-06 1998-08-18 Speedfam Co Ltd Ｃｍｐ装置
WO1998045087A1 (en) * 1997-04-04 1998-10-15 Rodel Holdings, Inc. Improved polishing pads and methods relating thereto
WO1998045090A1 (en) * 1997-04-04 1998-10-15 Obsidian, Inc. Polishing media magazine for improved polishing
US6022268A (en) * 1998-04-03 2000-02-08 Rodel Holdings Inc. Polishing pads and methods relating thereto
US5921855A (en) * 1997-05-15 1999-07-13 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing system
US6165239A (en) * 1997-07-28 2000-12-26 3M Innovative Properties Company Aqueous sulfopolyurea colloidal dispersions, films and abrasive articles
WO1999007515A1 (en) * 1997-08-06 1999-02-18 Rodel Holdings, Inc. Improved polishing pads and methods relating thereto
JP2000061818A (ja) * 1998-08-26 2000-02-29 Nikon Corp 研磨パッド
EP1161322A4 (en) * 1999-01-21 2003-09-24 Rodel Inc IMPROVED POLISHING CUSHIONS AND RELATED METHODS
JP2000263423A (ja) * 1999-03-16 2000-09-26 Toray Ind Inc 研磨パッドおよび研磨装置
JP4959901B2 (ja) * 2000-05-27 2012-06-27 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド 化学機械平坦化用溝付き研磨パッド

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