DE60114183T2 - Polierkissen zum chemisch-mechanischen planarisieren - Google Patents

Polierkissen zum chemisch-mechanischen planarisieren Download PDF

Info

Publication number
DE60114183T2
DE60114183T2 DE60114183T DE60114183T DE60114183T2 DE 60114183 T2 DE60114183 T2 DE 60114183T2 DE 60114183 T DE60114183 T DE 60114183T DE 60114183 T DE60114183 T DE 60114183T DE 60114183 T2 DE60114183 T2 DE 60114183T2
Authority
DE
Germany
Prior art keywords
polishing
pad
kel
wafer
pillow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60114183T
Other languages
German (de)
English (en)
Other versions
DE60114183D1 (de
Inventor
Arun Vishwanathan
B. David JAMES
Melbourne Lee COOK
A. Peter BURKE
David Shidner
K. Joseph SO
V. John ROBERTS
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials Holding Inc
DuPont Electronic Materials International LLC
Original Assignee
Rohm and Haas Electronic Materials CMP Holdings Inc
Rohm and Haas Electronic Materials LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26902748&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE60114183(T2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Rohm and Haas Electronic Materials CMP Holdings Inc, Rohm and Haas Electronic Materials LLC filed Critical Rohm and Haas Electronic Materials CMP Holdings Inc
Publication of DE60114183D1 publication Critical patent/DE60114183D1/de
Application granted granted Critical
Publication of DE60114183T2 publication Critical patent/DE60114183T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
DE60114183T 2000-05-27 2001-05-24 Polierkissen zum chemisch-mechanischen planarisieren Expired - Lifetime DE60114183T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US20793800P 2000-05-27 2000-05-27
US207938P 2000-05-27
US22209900P 2000-07-28 2000-07-28
US222099P 2000-07-28
PCT/US2001/016869 WO2001091971A1 (en) 2000-05-27 2001-05-24 Polishing pads for chemical mechanical planarization

Publications (2)

Publication Number Publication Date
DE60114183D1 DE60114183D1 (de) 2006-03-02
DE60114183T2 true DE60114183T2 (de) 2006-07-13

Family

ID=26902748

Family Applications (2)

Application Number Title Priority Date Filing Date
DE60114183T Expired - Lifetime DE60114183T2 (de) 2000-05-27 2001-05-24 Polierkissen zum chemisch-mechanischen planarisieren
DE60109601T Expired - Lifetime DE60109601T2 (de) 2000-05-27 2001-05-24 Rillen-polierkissen zum chemisch-mechanischen planarisieren

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE60109601T Expired - Lifetime DE60109601T2 (de) 2000-05-27 2001-05-24 Rillen-polierkissen zum chemisch-mechanischen planarisieren

Country Status (6)

Country Link
EP (2) EP1284842B1 (enExample)
JP (12) JP4959901B2 (enExample)
KR (2) KR100571449B1 (enExample)
DE (2) DE60114183T2 (enExample)
TW (2) TW508284B (enExample)
WO (2) WO2001091972A1 (enExample)

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JP3910921B2 (ja) * 2003-02-06 2007-04-25 株式会社東芝 研磨布および半導体装置の製造方法
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JP6513455B2 (ja) * 2015-04-03 2019-05-15 富士紡ホールディングス株式会社 研磨パッド
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JP6600149B2 (ja) * 2015-04-03 2019-10-30 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
US10086494B2 (en) * 2016-09-13 2018-10-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High planarization efficiency chemical mechanical polishing pads and methods of making
KR102329099B1 (ko) * 2017-01-20 2021-11-19 어플라이드 머티어리얼스, 인코포레이티드 Cmp 응용들을 위한 얇은 플라스틱 연마 물품
JP6981467B2 (ja) 2017-03-28 2021-12-15 Ａｇｃ株式会社 積層体、印刷物およびその製造方法
JP6968651B2 (ja) * 2017-10-12 2021-11-17 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
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JP7141283B2 (ja) * 2018-09-06 2022-09-22 富士紡ホールディングス株式会社 研磨パッド、研磨パッドの製造方法、及び被研磨物の表面を研磨する方法
CN112512747B (zh) 2018-09-28 2024-04-05 富士纺控股株式会社 研磨垫及研磨加工物的制造方法
JP7384608B2 (ja) * 2018-09-28 2023-11-21 富士紡ホールディングス株式会社 研磨パッド及び研磨加工物の製造方法
KR102674027B1 (ko) * 2019-01-29 2024-06-12 삼성전자주식회사 재생 연마패드
KR102345784B1 (ko) * 2019-07-10 2022-01-03 에프엔에스테크 주식회사 웨이퍼 후면 연마용 고경도 연마패드
WO2021011260A1 (en) * 2019-07-12 2021-01-21 Cabot Microelectronics Corporation Polishing pad employing polyamine and cyclohexanedimethanol curatives
KR102811921B1 (ko) 2020-09-30 2025-05-22 후지보 홀딩스 가부시키가이샤 연마 패드 및 연마 가공물의 제조 방법
JP7759179B2 (ja) * 2020-09-30 2025-10-23 富士紡ホールディングス株式会社 研磨パッド
KR102488115B1 (ko) * 2020-11-06 2023-01-12 에스케이엔펄스 주식회사 연마 패드, 연마 패드의 제조 방법 및 이를 이용한 반도체 소자의 제조 방법
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Also Published As

Publication number Publication date
JP6655848B2 (ja) 2020-02-26
JP5767280B2 (ja) 2015-08-19
DE60109601D1 (de) 2005-04-28
JP2018157220A (ja) 2018-10-04
JP6141359B2 (ja) 2017-06-07
JP6375352B2 (ja) 2018-08-15
DE60114183D1 (de) 2006-03-02
JP4615813B2 (ja) 2011-01-19
JP2012023387A (ja) 2012-02-02
WO2001091971A1 (en) 2001-12-06
JP5993360B2 (ja) 2016-09-14
KR20030005405A (ko) 2003-01-17
TW528646B (en) 2003-04-21
KR20030004421A (ko) 2003-01-14
EP1284841B1 (en) 2005-03-23
EP1284842A1 (en) 2003-02-26
JP4959901B2 (ja) 2012-06-27
JP2009033193A (ja) 2009-02-12
JP2015092610A (ja) 2015-05-14
JP2014078723A (ja) 2014-05-01
JP2012114454A (ja) 2012-06-14
JP2015188108A (ja) 2015-10-29
TW508284B (en) 2002-11-01
JP5584666B2 (ja) 2014-09-03
JP2017063211A (ja) 2017-03-30
WO2001091972A1 (en) 2001-12-06
JP2004507076A (ja) 2004-03-04
JP2013239737A (ja) 2013-11-28
DE60109601T2 (de) 2006-02-09
JP2004507077A (ja) 2004-03-04
EP1284842B1 (en) 2005-10-19
KR100770852B1 (ko) 2007-10-26
JP5016576B2 (ja) 2012-09-05
JP5544381B2 (ja) 2014-07-09
EP1284841A1 (en) 2003-02-26
KR100571449B1 (ko) 2006-04-17
JP2018117150A (ja) 2018-07-26

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