TW508284B - Grooved polishing pads for chemical mechanical planarization - Google Patents

Grooved polishing pads for chemical mechanical planarization Download PDF

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Publication number
TW508284B
TW508284B TW090112648A TW90112648A TW508284B TW 508284 B TW508284 B TW 508284B TW 090112648 A TW090112648 A TW 090112648A TW 90112648 A TW90112648 A TW 90112648A TW 508284 B TW508284 B TW 508284B
Authority
TW
Taiwan
Prior art keywords
groove
micrometers
chemical mechanical
pad
mechanical planarization
Prior art date
Application number
TW090112648A
Other languages
English (en)
Chinese (zh)
Inventor
Arun Vishwanathan
Peter A Burke
David B James
David Shidner
Lee Melbourne Cook
Original Assignee
Rodel Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26902748&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW508284(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Rodel Inc filed Critical Rodel Inc
Application granted granted Critical
Publication of TW508284B publication Critical patent/TW508284B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW090112648A 2000-05-27 2001-05-25 Grooved polishing pads for chemical mechanical planarization TW508284B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US20793800P 2000-05-27 2000-05-27
US22209900P 2000-07-28 2000-07-28

Publications (1)

Publication Number Publication Date
TW508284B true TW508284B (en) 2002-11-01

Family

ID=26902748

Family Applications (2)

Application Number Title Priority Date Filing Date
TW090112648A TW508284B (en) 2000-05-27 2001-05-25 Grooved polishing pads for chemical mechanical planarization
TW090112660A TW528646B (en) 2000-05-27 2001-05-25 Polishing pads for chemical mechanical planarization

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW090112660A TW528646B (en) 2000-05-27 2001-05-25 Polishing pads for chemical mechanical planarization

Country Status (6)

Country Link
EP (2) EP1284841B1 (enExample)
JP (12) JP4959901B2 (enExample)
KR (2) KR100770852B1 (enExample)
DE (2) DE60109601T2 (enExample)
TW (2) TW508284B (enExample)
WO (2) WO2001091972A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7629554B2 (en) 2006-07-03 2009-12-08 San Fang Chemical Industry Co., Ltd. Sheet for mounting polishing workpiece and method for making the same
US7789738B2 (en) 2006-07-03 2010-09-07 San Fang Chemical Industry Co., Ltd. Sheet for mounting polishing workpiece and method for making the same
TWI669360B (zh) * 2015-04-03 2019-08-21 日商富士紡控股股份有限公司 Abrasive pad

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* Cited by examiner, † Cited by third party
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JP3097658B2 (ja) 1998-05-21 2000-10-10 松下電器産業株式会社 洗濯機
DE60109601T2 (de) * 2000-05-27 2006-02-09 Rohm and Haas Electronic Materials CMP Holdings, Inc., Wilmington Rillen-polierkissen zum chemisch-mechanischen planarisieren
US6838149B2 (en) * 2001-12-13 2005-01-04 3M Innovative Properties Company Abrasive article for the deposition and polishing of a conductive material
US20050276967A1 (en) * 2002-05-23 2005-12-15 Cabot Microelectronics Corporation Surface textured microporous polishing pads
DE60308946T2 (de) * 2002-06-03 2007-05-10 Jsr Corp. Polierkissen und Verfahren zur Herstellung eines Polierkissens
WO2004059715A1 (en) * 2002-12-28 2004-07-15 Skc Co., Ltd. Polishing pads, conditioner and methods for polishing using the same
JP3910921B2 (ja) * 2003-02-06 2007-04-25 株式会社東芝 研磨布および半導体装置の製造方法
US7238097B2 (en) 2003-04-11 2007-07-03 Nihon Microcoating Co., Ltd. Polishing pad and method of producing same
US7074115B2 (en) 2003-10-09 2006-07-11 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad
SG111222A1 (en) * 2003-10-09 2005-05-30 Rohm & Haas Elect Mat Polishing pad
JP4606730B2 (ja) * 2003-12-11 2011-01-05 東洋ゴム工業株式会社 研磨パッドおよびその製造方法
US20050171224A1 (en) * 2004-02-03 2005-08-04 Kulp Mary J. Polyurethane polishing pad
JP2006114885A (ja) * 2004-09-17 2006-04-27 Jsr Corp 化学機械研磨パッド及び化学機械研磨方法
TWI385050B (zh) * 2005-02-18 2013-02-11 奈平科技股份有限公司 用於ｃｍｐ之特製拋光墊及其製造方法及其用途
JP2006231429A (ja) * 2005-02-22 2006-09-07 Inoac Corp 研磨パッドおよびその製造方法
US7357703B2 (en) 2005-12-28 2008-04-15 Jsr Corporation Chemical mechanical polishing pad and chemical mechanical polishing method
JP5415700B2 (ja) * 2007-02-01 2014-02-12 株式会社クラレ 研磨パッド及び研磨パッドの製造方法
TWI432285B (zh) 2007-02-01 2014-04-01 可樂麗股份有限公司 研磨墊及研磨墊之製法
JP2008258574A (ja) * 2007-03-14 2008-10-23 Jsr Corp 化学機械研磨パッドおよび化学機械研磨方法
US8491360B2 (en) * 2007-10-26 2013-07-23 Innopad, Inc. Three-dimensional network in CMP pad
JP5393434B2 (ja) 2008-12-26 2014-01-22 東洋ゴム工業株式会社 研磨パッド及びその製造方法
JP2009148891A (ja) * 2009-04-02 2009-07-09 Nitta Haas Inc 研磨パッド
KR101478414B1 (ko) * 2009-07-16 2014-12-31 캐보트 마이크로일렉트로닉스 코포레이션 홈이 있는 ｃｍｐ 연마 패드
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US9067299B2 (en) * 2012-04-25 2015-06-30 Applied Materials, Inc. Printed chemical mechanical polishing pad
US9597769B2 (en) * 2012-06-04 2017-03-21 Nexplanar Corporation Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer
JP6196858B2 (ja) * 2012-09-24 2017-09-13 株式会社荏原製作所 研磨方法および研磨装置
JP5836992B2 (ja) 2013-03-19 2015-12-24 株式会社東芝 半導体装置の製造方法
US20140370788A1 (en) * 2013-06-13 2014-12-18 Cabot Microelectronics Corporation Low surface roughness polishing pad
TWI599447B (zh) 2013-10-18 2017-09-21 卡博特微電子公司 具有偏移同心溝槽圖樣之邊緣排除區的ｃｍｐ拋光墊
WO2015153597A1 (en) * 2014-04-03 2015-10-08 3M Innovative Properties Company Polishing pads and systems and methods of making and using the same
US9731398B2 (en) 2014-08-22 2017-08-15 Rohm And Haas Electronic Materials Cmp Holding, Inc. Polyurethane polishing pad
JP6513455B2 (ja) * 2015-04-03 2019-05-15 富士紡ホールディングス株式会社 研磨パッド
JP6600149B2 (ja) * 2015-04-03 2019-10-30 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
JP2016196067A (ja) * 2015-04-03 2016-11-24 富士紡ホールディングス株式会社 研磨パッド
US10086494B2 (en) * 2016-09-13 2018-10-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High planarization efficiency chemical mechanical polishing pads and methods of making
TWM573509U (zh) * 2017-01-20 2019-01-21 美商應用材料股份有限公司 用於cmp 應用的薄的塑膠拋光用具及支撐元件
JP6981467B2 (ja) 2017-03-28 2021-12-15 Ａｇｃ株式会社 積層体、印刷物およびその製造方法
JP6968651B2 (ja) 2017-10-12 2021-11-17 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
JP7349774B2 (ja) * 2018-03-09 2023-09-25 富士紡ホールディングス株式会社 研磨パッド、研磨パッドの製造方法、被研磨物の表面を研磨する方法、被研磨物の表面を研磨する際のスクラッチを低減する方法
JP7141230B2 (ja) 2018-03-30 2022-09-22 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
JP7141283B2 (ja) * 2018-09-06 2022-09-22 富士紡ホールディングス株式会社 研磨パッド、研磨パッドの製造方法、及び被研磨物の表面を研磨する方法
US20210347006A1 (en) 2018-09-28 2021-11-11 Fujibo Holdings, Inc. Polishing pad and method for producing polished product
JP7384608B2 (ja) * 2018-09-28 2023-11-21 富士紡ホールディングス株式会社 研磨パッド及び研磨加工物の製造方法
KR102674027B1 (ko) * 2019-01-29 2024-06-12 삼성전자주식회사 재생 연마패드
KR102345784B1 (ko) * 2019-07-10 2022-01-03 에프엔에스테크 주식회사 웨이퍼 후면 연마용 고경도 연마패드
EP3996870A4 (en) * 2019-07-12 2023-08-02 CMC Materials, Inc. POLISHING PAD USING POLYAMINE AND CYCLOHEXANEDIMETHANOL HARDENING AGENTS
CN116348245B (zh) 2020-09-30 2026-07-14 富士纺控股株式会社 研磨垫、及研磨加工物的制造方法
JP7759179B2 (ja) 2020-09-30 2025-10-23 富士紡ホールディングス株式会社 研磨パッド
KR102488115B1 (ko) * 2020-11-06 2023-01-12 에스케이엔펄스 주식회사 연마 패드, 연마 패드의 제조 방법 및 이를 이용한 반도체 소자의 제조 방법
CN112480639B (zh) * 2020-12-09 2023-03-24 金旸（厦门）新材料科技有限公司 一种高效超韧导电pc材料及其制备方法
JP7640673B2 (ja) 2021-03-22 2025-03-05 富士紡ホールディングス株式会社 研磨パッド及び研磨加工物の製造方法
KR102561824B1 (ko) 2021-06-02 2023-07-31 에스케이엔펄스 주식회사 연마패드 및 이를 이용한 반도체 소자의 제조방법
WO2026100464A1 (ja) * 2024-11-05 2026-05-15 株式会社クレハ 研磨パッド及び被研磨物の研磨方法
KR102959354B1 (ko) * 2024-12-18 2026-04-30 케이피엑스일렉트로켐 주식회사 연마패드, 이의 제조방법 및 평가방법

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7629554B2 (en) 2006-07-03 2009-12-08 San Fang Chemical Industry Co., Ltd. Sheet for mounting polishing workpiece and method for making the same
US7789738B2 (en) 2006-07-03 2010-09-07 San Fang Chemical Industry Co., Ltd. Sheet for mounting polishing workpiece and method for making the same
TWI669360B (zh) * 2015-04-03 2019-08-21 日商富士紡控股股份有限公司 Abrasive pad

Also Published As

Publication number Publication date
JP5584666B2 (ja) 2014-09-03
KR100770852B1 (ko) 2007-10-26
DE60114183D1 (de) 2006-03-02
DE60109601T2 (de) 2006-02-09
JP6655848B2 (ja) 2020-02-26
DE60114183T2 (de) 2006-07-13
EP1284842B1 (en) 2005-10-19
JP2009033193A (ja) 2009-02-12
JP4615813B2 (ja) 2011-01-19
EP1284841B1 (en) 2005-03-23
JP5016576B2 (ja) 2012-09-05
JP5544381B2 (ja) 2014-07-09
WO2001091972A1 (en) 2001-12-06
JP6141359B2 (ja) 2017-06-07
KR20030005405A (ko) 2003-01-17
JP2004507077A (ja) 2004-03-04
JP5993360B2 (ja) 2016-09-14
JP2018117150A (ja) 2018-07-26
EP1284841A1 (en) 2003-02-26
JP2017063211A (ja) 2017-03-30
JP5767280B2 (ja) 2015-08-19
TW528646B (en) 2003-04-21
KR20030004421A (ko) 2003-01-14
JP2015188108A (ja) 2015-10-29
DE60109601D1 (de) 2005-04-28
JP4959901B2 (ja) 2012-06-27
JP2012023387A (ja) 2012-02-02
JP2014078723A (ja) 2014-05-01
JP6375352B2 (ja) 2018-08-15
JP2013239737A (ja) 2013-11-28
JP2012114454A (ja) 2012-06-14
KR100571449B1 (ko) 2006-04-17
JP2018157220A (ja) 2018-10-04
JP2004507076A (ja) 2004-03-04
JP2015092610A (ja) 2015-05-14
WO2001091971A1 (en) 2001-12-06
EP1284842A1 (en) 2003-02-26

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