TW508284B - Grooved polishing pads for chemical mechanical planarization - Google Patents

Grooved polishing pads for chemical mechanical planarization Download PDF

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Publication number
TW508284B
TW508284B TW090112648A TW90112648A TW508284B TW 508284 B TW508284 B TW 508284B TW 090112648 A TW090112648 A TW 090112648A TW 90112648 A TW90112648 A TW 90112648A TW 508284 B TW508284 B TW 508284B
Authority
TW
Taiwan
Prior art keywords
groove
micrometers
chemical mechanical
pad
mechanical planarization
Prior art date
Application number
TW090112648A
Other languages
English (en)
Chinese (zh)
Inventor
Arun Vishwanathan
Peter A Burke
David B James
David Shidner
Lee Melbourne Cook
Original Assignee
Rodel Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26902748&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW508284(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Rodel Inc filed Critical Rodel Inc
Application granted granted Critical
Publication of TW508284B publication Critical patent/TW508284B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW090112648A 2000-05-27 2001-05-25 Grooved polishing pads for chemical mechanical planarization TW508284B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US20793800P 2000-05-27 2000-05-27
US22209900P 2000-07-28 2000-07-28

Publications (1)

Publication Number Publication Date
TW508284B true TW508284B (en) 2002-11-01

Family

ID=26902748

Family Applications (2)

Application Number Title Priority Date Filing Date
TW090112648A TW508284B (en) 2000-05-27 2001-05-25 Grooved polishing pads for chemical mechanical planarization
TW090112660A TW528646B (en) 2000-05-27 2001-05-25 Polishing pads for chemical mechanical planarization

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW090112660A TW528646B (en) 2000-05-27 2001-05-25 Polishing pads for chemical mechanical planarization

Country Status (6)

Country Link
EP (2) EP1284842B1 (enExample)
JP (12) JP4959901B2 (enExample)
KR (2) KR100571449B1 (enExample)
DE (2) DE60114183T2 (enExample)
TW (2) TW508284B (enExample)
WO (2) WO2001091972A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7629554B2 (en) 2006-07-03 2009-12-08 San Fang Chemical Industry Co., Ltd. Sheet for mounting polishing workpiece and method for making the same
US7789738B2 (en) 2006-07-03 2010-09-07 San Fang Chemical Industry Co., Ltd. Sheet for mounting polishing workpiece and method for making the same
TWI669360B (zh) * 2015-04-03 2019-08-21 日商富士紡控股股份有限公司 Abrasive pad

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EP1284842B1 (en) * 2000-05-27 2005-10-19 Rohm and Haas Electronic Materials CMP Holdings, Inc. Polishing pads for chemical mechanical planarization
US6838149B2 (en) * 2001-12-13 2005-01-04 3M Innovative Properties Company Abrasive article for the deposition and polishing of a conductive material
US20050276967A1 (en) * 2002-05-23 2005-12-15 Cabot Microelectronics Corporation Surface textured microporous polishing pads
KR100669301B1 (ko) * 2002-06-03 2007-01-16 제이에스알 가부시끼가이샤 연마 패드 및 복층형 연마 패드
WO2004059715A1 (en) * 2002-12-28 2004-07-15 Skc Co., Ltd. Polishing pads, conditioner and methods for polishing using the same
JP3910921B2 (ja) * 2003-02-06 2007-04-25 株式会社東芝 研磨布および半導体装置の製造方法
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US7074115B2 (en) 2003-10-09 2006-07-11 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad
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JP4606730B2 (ja) * 2003-12-11 2011-01-05 東洋ゴム工業株式会社 研磨パッドおよびその製造方法
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TWI385050B (zh) * 2005-02-18 2013-02-11 Nexplanar Corp 用於ｃｍｐ之特製拋光墊及其製造方法及其用途
JP2006231429A (ja) * 2005-02-22 2006-09-07 Inoac Corp 研磨パッドおよびその製造方法
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TWI599447B (zh) 2013-10-18 2017-09-21 卡博特微電子公司 具有偏移同心溝槽圖樣之邊緣排除區的ｃｍｐ拋光墊
KR102347711B1 (ko) * 2014-04-03 2022-01-06 쓰리엠 이노베이티브 프로퍼티즈 컴파니 폴리싱 패드 및 시스템과 이의 제조 및 사용 방법
US9731398B2 (en) 2014-08-22 2017-08-15 Rohm And Haas Electronic Materials Cmp Holding, Inc. Polyurethane polishing pad
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JP6600149B2 (ja) * 2015-04-03 2019-10-30 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
US10086494B2 (en) * 2016-09-13 2018-10-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High planarization efficiency chemical mechanical polishing pads and methods of making
KR102329099B1 (ko) * 2017-01-20 2021-11-19 어플라이드 머티어리얼스, 인코포레이티드 Cmp 응용들을 위한 얇은 플라스틱 연마 물품
JP6981467B2 (ja) 2017-03-28 2021-12-15 Ａｇｃ株式会社 積層体、印刷物およびその製造方法
JP6968651B2 (ja) * 2017-10-12 2021-11-17 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
JP7349774B2 (ja) * 2018-03-09 2023-09-25 富士紡ホールディングス株式会社 研磨パッド、研磨パッドの製造方法、被研磨物の表面を研磨する方法、被研磨物の表面を研磨する際のスクラッチを低減する方法
JP7141230B2 (ja) 2018-03-30 2022-09-22 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
JP7141283B2 (ja) * 2018-09-06 2022-09-22 富士紡ホールディングス株式会社 研磨パッド、研磨パッドの製造方法、及び被研磨物の表面を研磨する方法
CN112512747B (zh) 2018-09-28 2024-04-05 富士纺控股株式会社 研磨垫及研磨加工物的制造方法
JP7384608B2 (ja) * 2018-09-28 2023-11-21 富士紡ホールディングス株式会社 研磨パッド及び研磨加工物の製造方法
KR102674027B1 (ko) * 2019-01-29 2024-06-12 삼성전자주식회사 재생 연마패드
KR102345784B1 (ko) * 2019-07-10 2022-01-03 에프엔에스테크 주식회사 웨이퍼 후면 연마용 고경도 연마패드
WO2021011260A1 (en) * 2019-07-12 2021-01-21 Cabot Microelectronics Corporation Polishing pad employing polyamine and cyclohexanedimethanol curatives
KR102811921B1 (ko) 2020-09-30 2025-05-22 후지보 홀딩스 가부시키가이샤 연마 패드 및 연마 가공물의 제조 방법
JP7759179B2 (ja) * 2020-09-30 2025-10-23 富士紡ホールディングス株式会社 研磨パッド
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7629554B2 (en) 2006-07-03 2009-12-08 San Fang Chemical Industry Co., Ltd. Sheet for mounting polishing workpiece and method for making the same
US7789738B2 (en) 2006-07-03 2010-09-07 San Fang Chemical Industry Co., Ltd. Sheet for mounting polishing workpiece and method for making the same
TWI669360B (zh) * 2015-04-03 2019-08-21 日商富士紡控股股份有限公司 Abrasive pad

Also Published As

Publication number Publication date
JP6655848B2 (ja) 2020-02-26
JP5767280B2 (ja) 2015-08-19
DE60109601D1 (de) 2005-04-28
JP2018157220A (ja) 2018-10-04
JP6141359B2 (ja) 2017-06-07
JP6375352B2 (ja) 2018-08-15
DE60114183D1 (de) 2006-03-02
JP4615813B2 (ja) 2011-01-19
JP2012023387A (ja) 2012-02-02
WO2001091971A1 (en) 2001-12-06
JP5993360B2 (ja) 2016-09-14
KR20030005405A (ko) 2003-01-17
TW528646B (en) 2003-04-21
KR20030004421A (ko) 2003-01-14
DE60114183T2 (de) 2006-07-13
EP1284841B1 (en) 2005-03-23
EP1284842A1 (en) 2003-02-26
JP4959901B2 (ja) 2012-06-27
JP2009033193A (ja) 2009-02-12
JP2015092610A (ja) 2015-05-14
JP2014078723A (ja) 2014-05-01
JP2012114454A (ja) 2012-06-14
JP2015188108A (ja) 2015-10-29
JP5584666B2 (ja) 2014-09-03
JP2017063211A (ja) 2017-03-30
WO2001091972A1 (en) 2001-12-06
JP2004507076A (ja) 2004-03-04
JP2013239737A (ja) 2013-11-28
DE60109601T2 (de) 2006-02-09
JP2004507077A (ja) 2004-03-04
EP1284842B1 (en) 2005-10-19
KR100770852B1 (ko) 2007-10-26
JP5016576B2 (ja) 2012-09-05
JP5544381B2 (ja) 2014-07-09
EP1284841A1 (en) 2003-02-26
KR100571449B1 (ko) 2006-04-17
JP2018117150A (ja) 2018-07-26

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